Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.

Abstract: An interconnect structure includes a dielectric layer, a first conductive feature, a hard mask layer, a conductive layer, and a capping layer. The first conductive feature is disposed in the dielectric layer. The hard mask layer is disposed on the first conductive feature. The conductive layer includes a first portion and a second portion, the first portion of the conductive layer is disposed over at least a first portion of the hard mask layer, and the second portion of the conductive layer is disposed over the dielectric layer. The hard mask layer and the conductive layer are formed by different materials. The capping layer is disposed on the dielectric layer and the conductive layer.

Abstract: An advanced balanced RF power amplifier circuit is provided. The RF power amplifier has a pair of RF amplification paths constructed to efficiently operate in a high-power mode. When instructed to operate in a low-power mode, one of the amplification paths is deactivated, and optionally, an impedance device is also set to operate at a low-power impedance value. With only one path operating in low-power mode, the network RF topology has changed from the topology of the high-power mode. This new topology provides increased impedance on the active RF amplification path as compared to when both RF amplification paths were active. This increased impedance causes the RF power amplifier to operate more efficiently in its low-power mode.

Abstract: A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.

Abstract: This invention provides a terminal arrangement for an electrical device. The electrical device includes a ground terminal on its outer surface that has a relatively large surface area. The electrical device also includes a plurality of contact terminals that are arranged around the periphery of the outer surface. Preferably, these terminals are generally equally-spaced from each other. Where the outer surface is rectangular, a terminal is normally located in each corner and one or more terminals are located along a side between the corners. The electrical device can be, for instance, a power amplifier. In such an arrangement, the amplifier is used to receive a radio frequency signal at a first side of the outer surface and output an amplified radio frequency signal from a second side of the outer surface. The power used to operate the amplifier is provided by power supply signals that typically enter at outer surface corners.

Abstract: A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.