Abstract: The present invention provides a miniature liquid transfer pump. The pump has a housing that includes first and second blocks joinable to form a leak-resistant impeller chamber with a drive shaft aperture, an inlet and an outlet. An impeller is located in the impeller chamber and a micro-motor with a drive shaft extending therefrom is mounted to the housing. The drive shaft on the micro-motor passes through the drive shaft aperture and engages the impeller. The micro-motor drives the impeller to draw liquid through the inlet and eject the liquid through the outlet.

Abstract: A header containing a semiconductor die, method of manufacture thereof and electronic device employing the same. In one embodiment, the header includes first and second contacts, and an intermediate body. The intermediate body includes an insulated section interposed between the first and second contacts and has a cavity therein. The intermediate body also includes a semiconductor die, located within the cavity, adapted to condition a signal passing through at least a portion of the header.

Abstract: The present invention provides an encapsulant structure for retaining an electronic circuit having heat-generating components within a case that at least partially surrounds the electronic circuit. In one advantageous embodiment, the encapsulant structure provides for a thermally conductive insert to be located within the case proximate the heat-generating components. The insert increases the heat transfer efficiency from the electronic circuit to the case.

Abstract: An improved circuit board apparatus configured for mounting electronic components in a circuit arrangement. The apparatus comprises a metal substrate having a first side and a second side, a first-side laminar structure and a second-side laminar structure. The first-side laminar structure includes at least one first-side conductive stratum alternated with at least one first-side dielectric stratum affixed at the first side The second-side laminar structure includes at least one second-side conductive stratum alternated with at least one second-side dielectric stratum affixed at the second side of the metal substrate. The apparatus further comprises a plurality of electrically conductive interside courses intermediate selected first-side strata of the at least one first-side conductive stratum and selected second-side strata of the at least one second-side conductive stratum.

Abstract: For use in a power supply having a bias circuit with a bias transformer, an auxiliary bias circuit and a method of providing power via the auxiliary bias circuit to an auxiliary load. In one embodiment, the auxiliary bias circuit includes a blocking device coupled to the bias transformer. The auxiliary bias circuit also includes a storage device, coupled to the blocking device and across the bias transformer, that provides a voltage to drive the auxiliary load without requiring a separate power supply.

Abstract: A method of mounting a power semiconductor die on a substrate, a package for the die and a power supply including the package. The die has a first power terminal on a first surface thereof and a second power terminal on an opposing second surface thereof. The method including the steps of: (1) forming an electrically-conductive, mechanical bond between the first surface and a first location on the substrate, the mechanical bond electrically coupling the first power terminal to the substrate and (2) soldering an elongated electrically conductive strap to the second surface and a second location on the substrate, the conductive strap composed of a material having an electrical resistivity at most about 5.0.times.10.sup.-8 ohm-meters (.OMEGA.-m) and forming a low impedance path between the second power terminal and the second location.

Abstract: A power supply and a method of manufacturing the same. In one embodiment, the power supply includes: (1) a substrate, (2) a main power supply mounted on the substrate and having an input and a main output, (3) an auxiliary power supply mounted on the substrate, coupled to the input and having an auxiliary output and (4) a cooling device mount, coupled to the power supply, configured to receive and support a cooling device, the auxiliary output configured to provide electric power to the cooling device.

Abstract: The present invention relates to semiconductor devices packaged using overcasting. The overcast devices of the present invention incorporate encapsulative materials, such as ultraviolet-curing material, which are cast in open stencils at approximately ambient pressure (and potentially at approximately ambient temperature) over electronic components mechanically and electrically connected to the substrate. The overcast semiconductor devices of the present invention may incorporate new encapsulative materials, including UV-cured materials and longer shelf life materials, poorly suited for the pressures and temperatures of injection molding. The overcast devices also allow the incorporation of substrate materials which are not feasible for use with a higher pressure, higher temperature forming process.

Abstract: A package for a power magnetic device containing an isolation transformer having a primary and secondary winding, and a method of manufacture therefor.

Abstract: A power magnetic device, a method of manufacture therefor and a power converter. The power magnetic device includes: (1) an isolation transformer having a primary winding and a secondary winding, (2) a switch coupled to the primary winding, (3) a rectifier coupled to the secondary winding and (4) an encapsulant substantially surrounding the isolation transformer, the switch and the rectifier to join the isolation transformer, the switch and the rectifier into an integrated package, the integrated package having: (a) a first power input coupled to a first end of the primary winding, (b) a second power input coupled to the switch, (c) first and second power outputs coupled to the rectifier circuit and (d) a control input coupled to the switch, the control input allowing the switch to be controlled to couple the primary winding to a source of electrical power, the power magnetic device thereby capable of employing the isolation transformer and the rectifier to convert electrical power into DC electrical power.