Patents by Inventor Shibata Kazutaka

Shibata Kazutaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5691241
    Abstract: A semiconductor device includes a lead frame which has an island portion on which a semiconductor chip is mounted and which is coated with a sealing resin, inner lead portions which are connected to electrodes of the semiconductor chip and are coated with the sealing resin; and outer lead portions which are continuously extended from the inner lead portions and are not coated with the sealing resin. The island portion and inner lead portions are formed to be smaller in thickness than the outer lead portions by, for example, rolling a roller along a material for the lead frame.
    Type: Grant
    Filed: February 3, 1995
    Date of Patent: November 25, 1997
    Assignee: Rohm Co., Ltd.
    Inventor: Shibata Kazutaka
  • Patent number: 5451813
    Abstract: A semiconductor device includes a lead frame which has an island portion on which a semiconductor chip is mounted and which is coated with a sealing resin, inner lead portions which are connected to electrodes of the semiconductor chip and are coated with the sealing resin; and outer lead portions which are continuously extended from the inner lead portions and are not coated with the sealing resin. The island portion and inner lead portions are formed to be smaller in thickness than the outer lead portions by, for example, rolling a roller along a material for the lead frame.
    Type: Grant
    Filed: March 9, 1994
    Date of Patent: September 19, 1995
    Assignee: Rohm Co., Ltd.
    Inventor: Shibata Kazutaka