Patents by Inventor Shicai Ma

Shicai Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System for separating a diced semiconductor die from a die attach tape
    Patent number: 8499813
    Abstract: A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: August 6, 2013
    Assignee: SanDisk Technologies Inc.
    Inventors: Jack Chang Chien, King Hoo Ong, Weili Wang, Li Wang, XingZhi Liang, Shicai Ma
  • SYSTEM FOR SEPARATING A DICED SEMICONDUCTOR DIE FROM A DIE ATTACH TAPE
    Publication number: 20120145332
    Abstract: A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.
    Type: Application
    Filed: February 16, 2012
    Publication date: June 14, 2012
    Inventors: Jack Chang Chien, KH Ong, Weili Wang, Li Wang, XingZhi Liang, Shicai Ma
  • SYSTEM FOR SEPARATING A DICED SEMICONDUCTOR DIE FROM A DIE ATTACH TAPE
    Publication number: 20110084377
    Abstract: A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.
    Type: Application
    Filed: February 22, 2010
    Publication date: April 14, 2011
    Inventors: Jack Chang Chien, KH Ong, Weili Wang, Li Wang, XingZhi Liang, Shicai Ma