Abstract: A method of forming a brazed joint is described. The method includes pressing a non-molybdenum component, such as a cross pin of a battery case assembly, against a molybdenum component, such as a terminal pin of the battery case assembly, and applying one or more electrical pulses to form an interface liquid layer between the components that cools to form the brazed joint. At least one of the electrical pulses has a constant voltage over a pulse time. A contact resistance between the components can decrease during the pulse time, and thus, the constant voltage can cause an uncontrolled electrical current of the electrical pulse to increase. The increasing electrical current heats the components sufficiently to form the interface liquid layer having a predetermined thickness that provides a required bend strength. Removal of surface oxides provide consistent mechanical strength for this joint. Other embodiments are also described and claimed.

Abstract: A method of forming a brazed joint is described. The method includes pressing a non-molybdenum component, such as a cross pin of a battery case assembly, against a molybdenum component, such as a terminal pin of the battery case assembly, and applying one or more electrical pulses to form an interface liquid layer between the components that cools to form the brazed joint. At least one of the electrical pulses has a constant voltage over a pulse time. A contact resistance between the components can decrease during the pulse time, and thus, the constant voltage can cause an uncontrolled electrical current of the electrical pulse to increase. The increasing electrical current heats the components sufficiently to form the interface liquid layer having a predetermined thickness that provides a required bend strength. Removal of surface oxides provide consistent mechanical strength for this joint. Other embodiments are also described and claimed.

Abstract: Disclosed herein is an implantable electronic device for use with an implantable medical lead. The implantable electronic device includes a housing and a header connector assembly coupled to the housing and adapted to receive the proximal lead end of the implantable medical lead. The header connector assembly includes a connector assembly including a connector, a feedthrough extending through the housing, and a conductor coupling the feedthrough to the connector. The conductor includes a first conductor segment and a second conductor segment offset from the first conductor segment and each of the first conductor segment and the second conductor segment are resistance welded to the connector.

Abstract: Disclosed herein is an implantable electronic device for use with an implantable medical lead. The implantable electronic device includes a housing and a header connector assembly coupled to the housing and adapted to receive the proximal lead end of the implantable medical lead. The header connector assembly includes a connector assembly including a connector, a feedthrough extending through the housing, and a conductor coupling the feedthrough to the connector. The conductor includes a first conductor segment and a second conductor segment offset from the first conductor segment and each of the first conductor segment and the second conductor segment are resistance welded to the connector.

Abstract: Disclosed herein is an implantable electronic device for use with an implantable medical lead. The implantable electronic device includes a housing and a header connector assembly coupled to the housing and adapted to receive the proximal lead end of the implantable medical lead. The header connector assembly includes a connector assembly including a connector, a feedthru extending through the housing, and a conductor coupling the feedthru to the connector. The conductor includes a first conductor segment and a second conductor segment offset from the first conductor segment and each of the first conductor segment and the second conductor segment are resistance welded to the connector.

Abstract: A method of forming a brazed joint is described. The method includes pressing a non-molybdenum component, such as a cross pin of a battery case assembly, against a molybdenum component, such as a terminal pin of the battery case assembly, and applying one or more electrical pulses to form an interface liquid layer between the components that cools to form the brazed joint. At least one of the electrical pulses has a constant voltage over a pulse time. A contact resistance between the components can decrease during the pulse time, and thus, the constant voltage can cause an uncontrolled electrical current of the electrical pulse to increase. The increasing electrical current heats the components sufficiently to form the interface liquid layer having a predetermined thickness that provides a required bend strength. Removal of surface oxides provide consistent mechanical strength for this joint. Other embodiments are also described and claimed.

Abstract: Disclosed herein is an implantable electronic device for use with an implantable medical lead. The implantable electronic device includes a housing and a header connector assembly coupled to the housing and adapted to receive the proximal lead end of the implantable medical lead. The header connector assembly includes a connector assembly including a connector, a feedthru extending through the housing, and a conductor coupling the feedthru to the connector. The conductor includes a first conductor segment and a second conductor segment offset from the first conductor segment and each of the first conductor segment and the second conductor segment are resistance welded to the connector.

Abstract: The present disclosure provides electrode assemblies. An electrode assembly includes a wire and a substantially cylindrical electrode including a radially inner surface, a radially outer surface, and a strip defined by at least one slot extending from the radially inner surface to the radially outer surface, wherein the wire is welded to the radially outer surface of the strip.