Patents by Inventor Shichun Qu

Shichun Qu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIELECTRIC COMPOSITE MATERIAL
    Publication number: 20070085194
    Abstract: A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.
    Type: Application
    Filed: November 9, 2006
    Publication date: April 19, 2007
    Inventors: Guoping Mao, Shichun Qu, Fuming Li, Robert Clough, Nelson O'Bryan
  • DIELECTRIC COMPOSITE MATERIAL
    Publication number: 20070085212
    Abstract: A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.
    Type: Application
    Filed: November 9, 2006
    Publication date: April 19, 2007
    Inventors: Guoping Mao, Shichun Qu, Fuming Li, Robert Clough, Nelson O'Bryan
  • Dielectric composite material
    Patent number: 7164197
    Abstract: A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.
    Type: Grant
    Filed: June 19, 2003
    Date of Patent: January 16, 2007
    Assignee: 3M Innovative Properties Company
    Inventors: Guoping Mao, Shichun Qu, Fuming B. Li, Robert S. Clough, Nelson B. O'Bryan
  • Silane-based coupling agent
    Publication number: 20060275616
    Abstract: An article having a benzocyclobutene-based resin layer and a coupling agent containing a mixture of a vinylsilane and an aminosilane.
    Type: Application
    Filed: June 3, 2005
    Publication date: December 7, 2006
    Inventors: Robert Clough, Shichun Qu, Guoping Mao
  • Dielectric composite material
    Publication number: 20040256731
    Abstract: A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.
    Type: Application
    Filed: June 19, 2003
    Publication date: December 23, 2004
    Inventors: Guoping Mao, Shichun Qu, Fuming B. Li, Robert S. Clough, Nelson B. O'Bryan