Abstract: A method for manufacturing a trench field-effect transistor includes forming an epitaxial layer on a substrate; forming a trench in the epitaxial layer, forming a first insulating layer and a shielding conductor in the trench, where the first insulating layer surrounds the shielding conductor and partially fills the trench; forming a dielectric layer on the epitaxial layer, the first insulating layer, and a side wall of the trench; etching a part of the dielectric layer to form a dielectric region, where the dielectric region is located on the first insulating layer and the side wall of the trench; and forming a second insulating layer and a gate conductor in the trench, where the second insulating layer surrounds the gate conductor, fills the trench, and extends to the surface of the epitaxial layer.

Abstract: Disclosed is a split-gate MOSFET and a manufacturing method, comprising: forming a cavity in a semiconductor layer; form a first trench based on the cavity; forming a second trench communicated with the first trench and extending in a same direction with the second trench; forming a first dielectric layer and a second dielectric layer; forming a first conductor located in the second trench and isolated from the semiconductor layer by the first dielectric layer; forming a third dielectric layer covering a surface of the first conductor; forming a second conductor located in the first trench, isolated from the semiconductor layer by the second dielectric layer, and isolated from the second conductor by the third dielectric layer; forming a body region adjacent to the first trench, wherein an inner diameter of the first trench is larger than an inner diameter of the second trench. The manufacturing method expands a process window.

Abstract: Disclosed is a split-gate MOSFET and a manufacturing method, including: forming a first trench in a semiconductor layer; forming a second trench communicated with the first trench by using the first trench; forming a first dielectric layer in the second trench, a second dielectric layer in the first trench; forming a first conductor, located in the second trench, isolated from the semiconductor layer by the first dielectric layer; forming a third dielectric layer covering the first conductor; forming a second conductor, located in the first trench, isolated from the semiconductor layer by the second dielectric layer, the first conductor being isolated from the second conductor by the third dielectric layer; forming a body region adjacent to the first trench, the first trench has an inner diameter greater than that of the second trench. Thus, process window is expanded and beneficial to forming the third dielectric layer.

Abstract: A power MOS device with low gate charge and a method for manufacturing the same. The device includes an M-shaped gate structure, which reduces the overlapped area between control gate electrode and split gate electrode. A low-k material is introduced to reduce dielectric constant of the isolation medium material. The combination of the M-shaped gate structure and low-k material can reduce parasitic capacitance Cgs of the device, thereby increasing switching speed and reducing switching losses.

Abstract: A power MOS device with low gate charge and a method for manufacturing the same. The device includes an M-shaped gate structure, which reduces the overlapped area between control gate electrode and split gate electrode. A low-k material is introduced to reduce dielectric constant of the isolation medium material. The combination of the M-shaped gate structure and low-k material can reduce parasitic capacitance Cgs of the device, thereby increasing switching speed and reducing switching losses.

Abstract: A metal wiring method for reducing gate resistance of a narrow control gate structure, wherein the gate structure is etched with first gate electrodes and second gate electrodes at regular intervals and kept with complete gate electrodes at regular intervals, thereby constituting a structure in which the first and second gate electrodes and the complete gate electrodes are spaced apart. A first contact hole is etched on the complete gate electrode to draw out metal as a first metal layer. A second contact hole is etched on a source region and a split gate to draw out metal as a second metal layer. These two metal layers are separated by a dielectric layer. A multi-point contact of the first layer of metal with the gate electrode in a Y direction reduces the gate resistance caused by an excessively long path in the Y direction of a control gate electrode.