Abstract: A magnetic disk is protected by a bilayer. The bilayer is formed as an adhesion enhancing underlayer and a protective diamond-like carbon (DLC) overlayer. The underlayer is formed of an aluminum or alloyed aluminum oxynitride, having the general formula AlOxNy or MezAlOxNy where Mez symbolizes Tiz, Siz or Crz and where x, y and z can be varied within the formation process. By adjusting the values of x and y the adhesion underlayer contributes to such qualities of the protective bilayer as stress compensation, chemical and mechanical stability and low electrical conductivity. Various methods of forming the underlayer are provided, including reactive ion sputtering, plasma assisted chemical vapor deposition, pulsed laser deposition and plasma immersion ion implantation.

Abstract: A protective bilayer on a magnetic read/write head or magnetic disk is formed as an adhesion enhancing and corrosion resistant underlayer and a protective diamond-like carbon (DLC) overlayer. The underlayer is a transition metal oxynitride, having the general formula MeOxNy, where Me represents a single element or an alloy of the following transition metal elements: Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, and W, here x can be within the range between 0 and 3 and y is in the range between approximately 0 and 2. Adjusting the values of x and y contributes to such qualities of the protective bilayer as stress compensation, chemical and mechanical stability and low electrical conductivity. Methods of forming the adhesion layer, include reactive ion sputtering, plasma assisted chemical vapor deposition, pulsed laser deposition and plasma immersion ion implantation.

Abstract: A method for forming a protective bilayer on a magnetic read/write head or magnetic disk. The bilayer is formed as an adhesion enhancing underlayer and a protective diamond-like carbon (DLC) overlayer. The underlayer is formed of an aluminum or alloyed aluminum oxynitride, having the general formula AlOxNy or MezAlOxNy where Mez symbolizes Tiz, Siz or Crz and where x, y and z can be varied within the formation process. By adjusting the values of x and y the adhesion underlayer contributes to such qualities of the protective bilayer as stress compensation, chemical and mechanical stability and low electrical conductivity. Various methods of forming the underlayer are provided, including reactive ion sputtering, plasma assisted chemical vapor deposition, pulsed laser deposition and plasma immersion ion implantation.

Abstract: A method for forming a protective bilayer on a magnetic read/write head or magnetic disk. The bilayer is formed as an adhesion enhancing underlayer and a protective diamond-like carbon (DLC) overlayer. The underlayer is formed of an aluminum or alloyed aluminum oxynitride, having the general formula AlOxNy or MezAlOxNy where Mez symbolizes Tiz, Siz or Crz and where x, y and z can be varied within the formation process. By adjusting the values of x and y the adhesion underlayer contributes to such qualities of the protective bilayer as stress compensation, chemical and mechanical stability and low electrical conductivity. Various methods of forming the underlayer are provided, including reactive ion sputtering, plasma assisted chemical vapor deposition, pulsed laser deposition and plasma immersion ion implantation.

Abstract: A magnetic disk is protected by a bilayer. The bilayer is formed as an adhesion enhancing underlayer and a protective diamond-like carbon (DLC) overlayer. The underlayer is formed of an aluminum or alloyed aluminum oxynitride, having the general formula AlOxNy or MezAlOxNy where Mez symbolizes Tiz, Siz or Crz and where x, y and z can be varied within the formation process. By adjusting the values of x and y the adhesion underlayer contributes to such qualities of the protective bilayer as stress compensation, chemical and mechanical stability and low electrical conductivity. Various methods of forming the underlayer are provided, including reactive ion sputtering, plasma assisted chemical vapor deposition, pulsed laser deposition and plasma immersion ion implantation.

Abstract: A method for forming a protective bilayer on a magnetic read/write head or magnetic disk. The bilayer is formed as an adhesion enhancing underlayer and a protective diamond-like carbon (DLC) overlayer. The underlayer is formed of an aluminum or alloyed aluminum oxynitride, having the general formula AlOxNy or MezAlOxNy where Mez symbolizes Tiz, Siz or Crz and where x, y and z can be varied within the formation process. By adjusting the values of x and y the adhesion underlayer contributes to such qualities of the protective bilayer as stress compensation, chemical and mechanical stability and low electrical conductivity. Various methods of forming the underlayer are provided, including reactive ion sputtering, plasma assisted chemical vapor deposition, pulsed laser deposition and plasma immersion ion implantation.

Abstract: A method for forming a protective bilayer on a magnetic read/write head or magnetic disk. The bilayer is formed as an adhesion enhancing and corrosion resistant underlayer and a protective diamond-like carbon (DLC) overlayer. The underlayer is formed of transition metal oxynitride, having the general formula MeOxNy, where Me represents a single element or an alloy formed with two or more of the following transition metal elements: Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, and W, here x can be within the range between 0 and 3 and y is in the range between approximately 0 and 2 By adjusting the values of x and y the adhesion underlayer contributes to such qualities of the protective bilayer as stress compensation, chemical and mechanical stability and low electrical conductivity. Various methods of forming the adhesion layer are provided, including reactive ion sputtering, plasma assisted chemical vapor deposition, pulsed laser deposition and plasma immersion ion implantation.

Abstract: A method for forming a protective bilayer on a substrate that is a magnetic read/write head or a magnetic recording medium. The bilayer is formed as an adhesion enhancing and corrosion resistant underlayer and a protective diamond-like carbon (DLC) overlayer. The underlayer is formed of silicon oxynitride, having the general formula SiOxNy, where x can be within the range between 0.02 and 2.0 and y is in the range between approximately 0.01 and 1.5. By adjusting the values of x and y the underlayer contributes to such qualities as strong chemical bonding between the substrate and the DLC, wear and corrosion resistance, chemical and mechanical stability and low electrical conductivity. The underlayer may be formed by various methods such as reactive ion sputtering, plasma assisted chemical vapor deposition, reactive pulsed laser deposition, plasma surface treatment and plasma immersion ion implantation.

Abstract: A method for forming a protective bilayer on a magnetic read/write head or magnetic disk. The bilayer is formed as an adhesion enhancing underlayer and a protective diamond-like carbon (DLC) overlayer. The underlayer is formed of an aluminum or alloyed aluminum oxynitride, having the general formula AlOxNy or MezAlOxNy where Mez symbolizes Tiz, Siz or Crz and where x, y and z can be varied within the formation process. By adjusting the values of x and y the adhesion underlayer contributes to such qualities of the protective bilayer as stress compensation, chemical and mechanical stability and low electrical conductivity. Various methods of forming the underlayer are provided, including reactive ion sputtering, plasma assisted chemical vapor deposition, pulsed laser deposition and plasma immersion ion implantation.

Abstract: A surface acoustic wave device that can operate in alternate-phase mode and single-phase mode, and thus generate surface acoustic waves at two different frequencies. The device is based on a piezoelectric film deposited on an elastic substrate, and includes an electrode layer patterned as two interdigital electrodes and electrical source (2). The device is operated in alternate-phase mode by connecting the two electrodes to different ends of an electrical source (22). The device is operated in single-phase mode by connecting the two electrodes to the same end of an electrical source.

Abstract: Optical modules and methods for making optical modules are described. In one embodiment, an optical module includes a substrate assembly including a photonic chip mounting region, and a groove extending towards the photonic chip mounting region. A waveguide is disposed within the groove. A plurality of spacers is on the chip mounting region, each spacer having a predetermined height. A photonic chip is placed on the plurality of spacers and above the chip mounting region, and an optical coupler is between the photonic chip and the waveguide.

Abstract: In a connection between an optical fiber or optical fiber array and an integrated optical waveguide or integrated optical waveguide array mounted or fabricated on a grooved substrate, an end face of an optical fiber array has a first facet and a second facet. The first facet has an inclination angle substantially equal to the inclination angle of an end wall of the substrate groove; the second facet has an inclination angle substantially equal to the inclination angle of the end face of the integrated optical waveguide. When the optical fiber array is mounted on the grooved substrate, each of the fibers rests in one of the substrate grooves. The first facet of each optical fiber end face is aligned with the end wall of the groove in which it rests, and the second facet is aligned with the end face of the integrated optical waveguide.

Abstract: A surface acoustic wave device which can generate surface acoustic waves in at least two directions. The device includes a piezoelectric layer, an elastic substrate and an electrode layer which includes two arrays 23 and 24 of linear electrodes with gap regions 25 located between the electrodes. Alternatively, the electrode layer may be patterned as an array of concentric annular strips for the generation of annular surface acoustic waves.

Abstract: A surface acoustic wave device that can operate in alternate-phase mode and single-phase mode, and thus generate surface acoustic waves at two different frequencies. The device is based on a piezoelectric film deposited on an elastic substrate, and includes an electrode layer patterned as two interdigital electrodes and electrical source (2). The device is operated in alternate-phase mode by connecting the two electrodes to different ends of an electrical source (22). The device is operated in single-phase mode by connecting the two electrodes to the same end of an electrical source.

Abstract: Optical modules and methods for making optical modules are described. In one embodiment, an optical module includes a substrate assembly including a photonic chip mounting region, and a groove extending towards the photonic chip mounting region. A waveguide is disposed within the groove. A plurality of spacers is on the chip mounting region, each spacer having a predetermined height. A photonic chip is placed on the plurality of spacers and above the chip mounting region, and an optical coupler is between the photonic chip and the waveguide.