Abstract: A method for monitoring hydraulic fracturing range of a surface vertical shaft is provided by the present disclosure, belonging to the technical field of ultrahigh-pressure hydraulic fracturing monitoring of the coal mine vertical shafts.

Abstract: In-situ fabrication of tamper-respondent sensors with random security circuit patterns is provided. The method includes establishing a random security circuit pattern for fabricating a security circuit of a tamper-respondent sensor to enclose, at least in part, one or more components within a secure volume. The establishing includes generating a trace pattern extending once through nodes of a plurality of nodes dispersed within an area of the tamper-respondent sensor, and randomly modifying the trace pattern to produce a randomly modified trace pattern with a desired randomization index relative to a specified randomization threshold, and providing the randomly modified trace pattern as a random security circuit pattern. Further, the method includes initiating fabricating of the tamper-respondent sensor in-situ on a surface of an enclosure to facilitate defining the secure volume, with the fabricating using the random security circuit pattern.

Abstract: Semiconductor structures are provided with five different cooling elements directly bonded to a semiconductor chip. The cooling element is directly bonded to the backside of a thinned semiconductor substrate or to the front side back-end-of-line (BEOL) interconnect wiring of the semiconductor chip. The cooling element replaces a carrier wafer on semiconductor chips with backside BEOL interconnect wiring. Each of the five cooling elements provide better thermal conductivity for the semiconductor structure when directly bonded to the front side BEOL interconnect wiring than the carrier wafer typically bonded to a semiconductor chip with backside BEOL interconnect wiring. The cooling element is one of a copper cooling element with water-filled microchannels, or a copper plate, a silicon cooling element with water-filled microchannels, a silicon carbide plate, or a glass plate with copper-filled vias. The cooling element is directly bonded to the semiconductor chip by a hybrid bond.

Abstract: A flexible circuit substrate that includes a conductive line on a flexible substrate and at least one slot in the conductive line on the flex substrate, where at one slot is in an area of the flexible circuit substrate that will be bent to prevent an open in the conductive line on the flexible substrate.

Abstract: A refrigerator, comprising an automatic door-opening/closing apparatus mounted on a refrigerator body for driving the opening and closing of a door. When opening the door, if a first obstacle detecting apparatus detects the presence of an obstacle in front of the door, then the automatic door opening/closing apparatus stops the opening of the door; when closing the door, if a second obstacle detection apparatus detects the presence of an obstacle behind the door, then the automatic door-opening/closing apparatus stops the closing of the door. This stops the movement of the door upon the discovery of an obstacle while opening or closing the door, thus preventing the door from being damaged by collision, and when the obstacle is a person, preventing physical injuries from being caused.

Abstract: A control method for a drawer door of a refrigerator and the refrigerator. The refrigerator comprises a refrigerator body, a drawer door mounted in the refrigerator body in a front-back pushed and pulled mode, and a driving mechanism driving the drawer door to move forward and backward. The control method comprises: obtaining a door opening instruction or a door closing instruction; controlling the driving mechanism to drive the drawer door to move forward to open or move backward to close; detecting a resistance borne by the drawer door during the movement; determining whether the resistance is greater than a preset resistance threshold; and if yes, controlling the driving mechanism to stop running to enable the drawer door to stop moving.

Abstract: An electronic structure includes offset three-dimensional stacked chips; and a two-piece lid structure configured to extract heat from the bottom and top of the stacked chips.

Abstract: An integrated circuit package substrate (ICPS) system includes a die including a first array of connectors and a substrate including a second array of connectors that is configured to be thermocompression bonded to the first array of connectors at a bonding temperature that is above a solder melting temperature. The first die is bonded to the substrate such that the first die is asymmetric with respect to a substrate center, and the second array of connectors is adjusted, at an alignment temperature that is below the solder melting temperature, for thermal expansion to the bonding temperature with respect to a reference point that is not a first die center.

Abstract: A module includes a substrate having a plurality of contact regions, and a spacer-chip assembly. The spacer-chip assembly in turn includes at least first and second semiconductor dies, each having a plurality of electrical interconnect pillars and a plurality of contact pads, and a spacer wafer. The at least first and second semiconductor dies are secured to the spacer wafer, and the spacer wafer includes at least first and second semiconductor circuit features coupled to a first portion of the contact pads of the at least first and second semiconductor dies. The spacer wafer includes wiring electrically coupling the at least first and second semiconductor dies via a second portion of the contact pads. The spacer wafer has a plurality of holes formed therethrough. The plurality of electrical interconnect pillars extend through the holes and are secured to the contact regions on the substrate.

Abstract: An integrated circuit package structure is provided that includes a chip carrier substrate, at least one processor die provided on the chip carrier substrate, a plurality of lateral escape wiring lines connected to and extending away from the at least one processor die, and a plurality of chips at least partially surrounding the processor die, at least one of the chips overlapping with at least one of the lateral escape wiring lines in a plan view. An interconnect structure of the chips includes at least one vertical power feed structure that is configured and positioned not to intersect with the lateral escape wiring lines in the plan view.

Abstract: An electronic structure includes offset three-dimensional stacked chips; and a two-piece lid structure configured to extract heat from the bottom and top of the stacked chips.

Abstract: A method for monitoring hydraulic fracturing range of a surface vertical shaft is provided by the present disclosure, belonging to the technical field of ultrahigh-pressure hydraulic fracturing monitoring of the coal mine vertical shafts.

Abstract: Moisture-driven degradation of a crack stop in a semiconductor die is mitigated by forming a groove in an upper surface of the die between an edge of the die and the crack stop; entirely filling the groove with a moisture barrier material; preventing moisture penetration of the semiconductor die by presence of the moisture barrier material; and dissipating mechanical stress in the moisture barrier material without presenting a stress riser in the bulk portion of the die. The moisture barrier material is at least one of moisture-absorbing, moisture adsorbing, and hydrophobic.

Abstract: A flexible circuit substrate that includes a conductive line on a flexible substrate and at least one slot in the conductive line on the flex substrate, where at one slot is in an area of the flexible circuit substrate that will be bent to prevent an open in the conductive line on the flexible substrate.

Abstract: In some examples, an electronic package and methods for forming the electronic package are described. The electronic package can be formed by disposing an interposer on a surface of a substrate having a first pitch wiring density. The interposer can have a second pitch wiring density different from the first pitch wiring density. A layer of non-conductive film can be situated between the interposer and the surface of the substrate. A planarization process can be performed on a surface of the substrate. A solder resist patterning can be performed on the planarized surface the substrate. A solder reflow and coining process can be performed to form a layer of solder bumps on top of the planarized surface of the substrate. The interposer can provide bridge connection between at least two die disposed above the substrate. Solder bumps under the interposer electrically connect the substrate and the interposer.

Abstract: Provided are a liquid crystal alignment agent, a liquid crystal alignment film and a liquid crystal display element. The liquid crystal alignment agent at least comprises one of a polyamic acid solution and a polyimide solution. The polyamic acid solution is obtained by means of a polymerization reaction of diamine compound component A and dianhydride compound component B in a solvent, and the polyimide solution is obtained from the polyamic acid solution via a dehydration imidization treatment. The diamine component A at least comprises one of the diamine compounds represented by “formula 1”. The obtained liquid crystal alignment agent has a better liquid crystal alignment capability, an excellent effect on image sticking, and the effect that decomposition products resulting from light alignment are easy to remove.

Abstract: The present invention discloses a refrigerator and a control method thereof. The refrigerator comprises a door body with an inner door and an outer door, a locking mechanism for locking the outer door, an unlocking mechanism for unlocking the outer door, and a detection unit for detecting an open state and a closed state of the inner door. The present disclosure avoids damages caused by collision between the inner door and the outer door when the outer door is opened, and also avoids simultaneous opening of the inner door and outer door and facilitates the user to use and achieves an energy-saving effect.

Abstract: A refrigerator, comprising an automatic door-opening/closing apparatus mounted on a refrigerator body for driving the opening and closing of a door. When opening the door, if a first obstacle detecting apparatus detects the presence of an obstacle in front of the door, then the automatic door opening/closing apparatus stops the opening of the door; when closing the door, if a second obstacle detection apparatus detects the presence of an obstacle behind the door, then the automatic door-opening/closing apparatus stops the closing of the door. This stops the movement of the door upon the discovery of an obstacle while opening or closing the door, thus preventing the door from being damaged by collision, and when the obstacle is a person, preventing physical injuries from being caused.

Abstract: An electronic apparatus that includes a semiconductor device; an electronic packaging substrate for receiving the semiconductor device; a thermal interface material on the semiconductor device; and a lid in contact with the thermal interface material and having a zone of targeted flexibility spaced from the semiconductor device.

Abstract: An integrated circuit package structure is provided that includes a chip carrier substrate, at least one processor die provided on the chip carrier substrate, a plurality of lateral escape wiring lines connected to and extending away from the at least one processor die, and a plurality of chips at least partially surrounding the processor die, at least one of the chips overlapping with at least one of the lateral escape wiring lines in a plan view. An interconnect structure of the chips includes at least one vertical power feed structure that is configured and positioned not to intersect with the lateral escape wiring lines in the plan view.