Patents by Inventor Shigang DAI

Shigang DAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for smoothing link-line power of electrothermal microgrid using thermal storage heat pump
    Patent number: 11277009
    Abstract: Disclosed are a method and apparatus for smoothing a link-line power of an electrothermal microgrid using a thermal storage heat pump cluster.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: March 15, 2022
    Assignees: State Grid Jiangsu Electric Power CO., LTD Nanjing Power Supply Company, SHANGHAI JIAO TONG UNIVERSITY, HOHAI UNIVERSITY, STATE GRID JIANGSU ELECTRIC POWER CO., LTD
    Inventors: Yong Zhang, Zhoujun Ma, Ming Zhang, Wentao Huang, Shigang Dai, Yuping Zheng, Nengling Tai, Chunning Wang, Liwei Wang, Honghua Xu, Yiru Chen, Di Ma
  • METHOD AND APPARATUS FOR SMOOTHING LINK-LINE POWER OF ELECTROTHERMAL MICROGRID USING THERMAL STORAGE HEAT PUMP
    Publication number: 20200176989
    Abstract: Disclosed are a method and apparatus for smoothing a link-line power of an electrothermal microgrid using a thermal storage heat pump cluster.
    Type: Application
    Filed: November 26, 2019
    Publication date: June 4, 2020
    Applicants: State Grid Jiangsu Electric Power CO., LTD Nanjing Power Supply Company, SHANGHAI JIAO TONG UNIVERSITY, HOHAI UNIVERSITY, STATE GRID JIANGSU ELECTRIC POWER CO., LTD
    Inventors: Yong ZHANG, Zhoujun MA, Ming ZHANG, Wentao HUANG, Shigang DAI, Yuping ZHENG, Nengling TAI, Chunning WANG, Liwei WANG, Honghua XU, Yiru CHEN, Di MA