Abstract: A method of manufacturing a thin-film photovoltaic module in which a photoelectric conversion element is deposited on a substrate, includes removing the photoelectric conversion element at a frame shape area from sides of the substrate toward inside with a predetermined width by a first removing step of scanning a first photoelectric conversion element removing device at the area along the sides of the substrate to remove the photoelectric conversion element for the predetermined width, and a second removing step of scanning a second photoelectric conversion element removing device within the area along the sides of the substrate to remove the photoelectric conversion element that is not removed in the first removing step at a width narrower than the predetermined width and without superimposing a center line of a scanning path on a center line of a scanning path of the first photoelectric conversion element removing device.

Abstract: A method of manufacturing a thin-film photovoltaic module in which a photoelectric conversion element is deposited on a substrate, includes removing the photoelectric conversion element at a frame shape area from sides of the substrate toward inside with a predetermined width by a first removing step of scanning a first photoelectric conversion element removing device at the area along the sides of the substrate to remove the photoelectric conversion element for the predetermined width, and a second removing step of scanning a second photoelectric conversion element removing device within the area along the sides of the substrate to remove the photoelectric conversion element that is not removed in the first removing step at a width narrower than the predetermined width and without superimposing a center line of a scanning path on a center line of a scanning path of the first photoelectric conversion element removing device.

Abstract: A laser processing method involving moving first and second laser beams relative to a workpiece, wherein the first and second laser beams have at least a differing wavelength or intensity. The method including irradiating the first and second laser beams through first and second portions, respectively, of an optical element that directs the first and second laser beams onto the workpiece, wherein irradiating the second laser beam is subsequent to the irradiating the first laser beam. The method including moving the first laser beam and the second laser beam relative to the workpiece along another direction. The method including irradiating the first and second laser beams through third and fourth portions, respectively, of the optical element, wherein the third and fourth portions are dependent on the another direction, wherein irradiating the second laser beam is subsequent to the irradiating the first laser beam.

Abstract: A laser processing apparatus which performs a predetermined processing by irradiating a laser beam (2) emitted from a laser oscillator onto a surface of a workpiece (1) through a condenser lens (3). There are provided microdeformation lenses (4), (5) for changing the beam shape in the vertical direction and the horizontal direction in a laser beam (2), for example, and a lens deformation control device for controlling the amount of deformation of the microdeformation lenses (4), (5) which are to adjust the beam shape of the laser beam (2) to a predetermined shape. The microdeformation lenses (4), (5) have a structure such that they can be caused to change to a desired shape by means of a plurality of actuators (4b), (5b) disposed around the outer periphery of the lenses.

Abstract: A laser processing apparatus which performs a predetermined processing by irradiating a laser beam (2) emitted from a laser oscillator onto a surface of a workpiece (1) through a condenser lens (3). There are provided microdeformation lenses (4), (5) for changing the beam shape in the vertical direction and the horizontal direction in a laser beam (2), for example, and a lens deformation control device for controlling the amount of deformation of the microdeformation lenses (4), (5) which are to adjust the beam shape of the laser beam (2) to a predetermined shape. The microdeformation lenses (4), (5) have a structure such that they can be caused to change to a desired shape by means of a plurality of actuators (4b), (5b) disposed around the outer periphery of the lenses.

Abstract: The present invention provides a method and an apparatus for efficiently processing in patterning of an electronic circuit board even when laser beams of differing intensities and wavelengths are irradiated in multiple stages. A laser processing apparatus is provided with first and second laser oscillators for emitting laser beams of which at least the wavelength or the intensities are different from each other; a stage apparatus for moving a workpiece to be processed; and optical systems for guiding the laser beams to prescribed positions of the workpiece. The optical systems can be moved by means of an adjusting device according to the relative moving direction of the laser beams and the workpiece to permit the prescribed position of the subject to be irradiated with laser beams in that order so that the workpiece can be processed by the laser beams.