Patents by Inventor Shigeaki Yagi

Shigeaki Yagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140315322
    Abstract: The present invention relates to providing a simple and highly reproducible method for measuring the concentration of acetic acid in blood plasma by using a gas chromatography/mass spectrometry (GC/MS), and more specifically relates to a method for measuring the concentration of acetic acid in blood plasma by using a gas chromatography/mass spectrometry (GC/MS), which comprises extracting acetic acid in blood plasma with methyl-tert-butyl ether (MTBE).
    Type: Application
    Filed: December 26, 2012
    Publication date: October 23, 2014
    Applicant: FUSO PHARMACEUTICAL INDUSTRIES, LTD.
    Inventors: Shigeaki Yagi, Manabu Nishizawa, Hidetoshi Matsuzawa, Hideo Nagase
  • Patent number: 5844309
    Abstract: An adhesive composition including: a main component comprising a resin material, a solvent for dissolving said main component, and a filler added to said main component, wherein said filler has a particle size so as to make a concavo-convex depth of a surface of said adhesive composition equal to or less than 15 .mu.m after said adhesive composition is applied to an adherend and dried in order to evaporate said solvent before a thermocompression process. The present invention also discloses a semiconductor device using the adhesive composition, an adhering method using the adhesive composition and a method for producing a semiconductor device using the adhesive composition.
    Type: Grant
    Filed: December 3, 1996
    Date of Patent: December 1, 1998
    Assignee: Fujitsu Limited
    Inventors: Yukio Takigawa, Shigeaki Yagi, Toshimi Kawahara, Mitsunada Osawa, Hiroyuki Ishiguro, Shinya Nakaseko, Takashi Hozumi, Masaaki Seki
  • Patent number: 5763540
    Abstract: An epoxy resin composition for encapsulating semiconductors containing 5 to 50 parts by weight of a silicone-based flexibility imparting agent, 100 parts by weight of an epoxy resin containing at least two epoxy groups in one molecule thereof, 50 to 150 parts by weight of a curing resin including a phenolic resin, and 200 to 1,000 parts by weight of an inorganic filler.
    Type: Grant
    Filed: October 18, 1995
    Date of Patent: June 9, 1998
    Assignee: Fujitsu Limited
    Inventors: Yoshihiro Nakata, Yukio Takigawa, Shigeaki Yagi, Norio Sawatari
  • Patent number: 5659004
    Abstract: An epoxy resin composition contains an epoxy resin as a substratal resin and incorporates therein a polyallylphenol curing agent. The composition may also contain a polyphenol compound. The epoxy resin may have a naphthalene skeleton. The epoxy resin composition may also include a blend of two or more epoxy resins.
    Type: Grant
    Filed: February 16, 1995
    Date of Patent: August 19, 1997
    Assignee: Fujitsu Limited
    Inventors: Yukio Takigawa, Yoshihiro Nakata, Shigeaki Yagi, Norio Sawatari, Nobuo Kamehara
  • Patent number: 4813782
    Abstract: An apparatus for measuring the floating amount of the magnetic head comprising a single color light source such as laser, a rotating glass disk, a light scanner section, a photoelectric converter element, and an interference light strength computing section (or waveform memory section and computer section). Therefore, static behaviors such as pitch angle and balance of the magnetic head can be measured along with dynamic behaviors such as floating and frequency fluctuations thereof. Even when the floating amount of the magnetic head is extremely low, the measurement can be made accurately in a shorter time period with a high S/N ratio.
    Type: Grant
    Filed: February 27, 1987
    Date of Patent: March 21, 1989
    Assignee: Alps Electric Co., Ltd.
    Inventors: Shigeaki Yagi, Hirofumi Furusawa