Patents by Inventor SHIGEHARU HINO

SHIGEHARU HINO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE FREE FROM SHORT-CIRCUIT BETWEEN BUMP ELECTRODES AND SEPARATION FROM CIRCUIT BOARD AND PROCESS OF FABRICATION THEREOF
    Publication number: 20010013652
    Abstract: Bump electrodes are formed on a semiconductor pellet by tearing off conductive wires so as to expose fresh metal, and pad electrodes on a circuit board are cleared by exposing them to an ionic beam or an atomic beam; when the bump electrodes are bonded to the pad electrodes, bump electrodes are heated to a certain temperature lower than the melting point of the metal, and are pressed against the pad electrodes, thereby preventing the bump electrodes from undesirable short-circuit.
    Type: Application
    Filed: March 31, 1998
    Publication date: August 16, 2001
    Inventors: SHIGEHARU HINO, GOROU IKEGAMI