Patents by Inventor Shigeharu Ishikawa

Shigeharu Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer
    Patent number: 7040963
    Abstract: A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table (2) includes a plurality of superimposed bases (11) each of which is formed of silicide ceramic or carbide ceramic. The bases (11) are joined together by an adhesive layer (14). A fluid passage (12) is formed in a joining interface between the bases (11).
    Type: Grant
    Filed: June 15, 2000
    Date of Patent: May 9, 2006
    Assignee: Ibiden Co., Ltd.
    Inventors: Yuji Okuda, Naoyuki Jimbo, Kazutaka Majima, Masahiro Tsuji, Hideki Takagi, Shigeharu Ishikawa, Hiroyuki Yasuda
  • Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
    Patent number: 7029379
    Abstract: A method for manufacturing a wafer holding plate for a wafer grinding apparatus wherein the plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
    Type: Grant
    Filed: July 6, 2005
    Date of Patent: April 18, 2006
    Assignee: Ibiden Co., Ltd.
    Inventors: Naoyuki Jimbo, Yuji Okuda, Shigeharu Ishikawa, Atsushi Mishima
  • Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer
    Publication number: 20050260938
    Abstract: A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table includes a plurality of superimposed bases each of which is formed of silicide ceramic or carbide ceramic. The bases are joined together by an adhesive layer. A fluid passage is formed in a joining interface between the bases.
    Type: Application
    Filed: July 28, 2005
    Publication date: November 24, 2005
    Inventors: Yuji Okuda, Naoyuki Jimbo, Kazutaka Majima, Masahiro Tsuji, Hideki Takagi, Shigeharu Ishikawa, Hiroyuki Yasuda
  • Table of wafer of polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer
    Publication number: 20050260930
    Abstract: A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table includes a plurality of superimposed bases each of which is formed of silicide ceramic or carbide ceramic. The bases are joined together by an adhesive layer. A fluid passage is formed in a joining interface between the bases.
    Type: Application
    Filed: July 28, 2005
    Publication date: November 24, 2005
    Inventors: Yuji Okuda, Naoyuki Jimbo, Kazutaka Majima, Masahiro Tsuji, Hideki Takagi, Shigeharu Ishikawa, Hiroyuki Yasuda
  • Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
    Publication number: 20050245177
    Abstract: A method for manufacturing a wafer holding plate for a wafer grinding apparatus wherein the plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
    Type: Application
    Filed: July 6, 2005
    Publication date: November 3, 2005
    Inventors: Naoyuki Jimbo, Yuji Okuda, Shigeharu Ishikawa, Atsushi Mishima
  • Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
    Patent number: 6916228
    Abstract: A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: July 12, 2005
    Assignee: Ibiden Co., Ltd.
    Inventors: Naoyuki Jimbo, Yuji Okuda, Shigeharu Ishikawa, Atsushi Mishima
  • Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
    Publication number: 20030008598
    Abstract: A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
    Type: Application
    Filed: September 5, 2002
    Publication date: January 9, 2003
    Inventors: Naoyuki Jimbo, Yuji Okuda, Shigeharu Ishikawa, Atsushi Mishima
  • Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
    Patent number: 6475068
    Abstract: A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
    Type: Grant
    Filed: March 21, 2000
    Date of Patent: November 5, 2002
    Assignee: Ibiden Co., Ltd.
    Inventors: Naoyuki Jimbo, Yuji Okuda, Shigeharu Ishikawa, Atsushi Mishima