Patents by Inventor Shigeharu Nonoyama

Shigeharu Nonoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6441317
    Abstract: In a semiconductor module comprising, a semiconductor element, an electrically insulating base having an outer surface to be connected to an electrically grounded surface, and an inner surface on which the semiconductor element is arranged, an electrically insulating cover covering the semiconductor element on the inner surface, and first and second electrically conductive members each of which is connected to the semiconductor element and extends to the exterior of the semiconductor module through the electrically insulating cover, a part of each of the first and second electrically conductive members on the exterior of the semiconductor module is arranged away from the outer surface to electrically isolate the part of the each of the first and second electrically conductive members from the electrically grounded surface.
    Type: Grant
    Filed: September 1, 2000
    Date of Patent: August 27, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Akira Tanaka, Ryuichi Saito, Tadao Kushima, Yoshihiko Koike, Hideo Shimizu, Shigeharu Nonoyama