Patents by Inventor Shigeharu Tunoda

Shigeharu Tunoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module
    Patent number: 7002250
    Abstract: A semiconductor module, comprising a wiring substrate on which wiring is formed, a semiconductor device electrically connected to the wiring formed on the wiring substrate, and an external connection terminal arranged on the semiconductor device mounted side of the wiring substrate so as to be a connected portion between the wiring and the outside electrically connected thereto, wherein there is formed an insulating resin layer thicker than the semiconductor device between the wiring substrate and the external connection terminal.
    Type: Grant
    Filed: August 16, 2001
    Date of Patent: February 21, 2006
    Assignee: Renesas Technology Corp.
    Inventors: Hiroshi Hozoji, Yoshihide Yamaguchi, Naoya Kanda, Shigeharu Tunoda, Hiroyuki Tenmei
  • Semiconductor module
    Publication number: 20020079575
    Abstract: A semiconductor module, comprising a wiring substrate on which wiring is formed, a semiconductor device electrically connected to the wiring formed on the wiring substrate, and an external connection terminal arranged on the semiconductor device mounted side of the wiring substrate so as to be a connected portion between the wiring and the outside electrically connected thereto, wherein there is formed an insulating resin layer thicker than the semiconductor device between the wiring substrate and the external connection terminal.
    Type: Application
    Filed: August 16, 2001
    Publication date: June 27, 2002
    Inventors: Hiroshi Hozoji, Yoshihide Yamaguchi, Naoya Kanda, Shigeharu Tunoda, Hiroyuki Tenmei