Abstract: There is provided a semiconductor device including a wafer and a focus monitoring pattern formed on the wafer. The focus monitoring pattern has at least one pair of first and second patterns. The first pattern has an unexposed region surrounded by an exposed region and the second pattern has an exposed region surrounded by an unexposed region. In addition, the present invention provides a method of fabricating a semiconductor device comprising the steps of forming at least one pair of first and second patterns on a wafer. The first pattern has an unexposed region surrounded by an exposed region and the second pattern has an exposed region surrounded by an unexposed region. The method further comprises checking a focusing condition on exposure by measuring widths of the first and second patterns formed on the wafer.

Abstract: There is provided a semiconductor device including a wafer and a focus monitoring pattern formed on the wafer. The focus monitoring pattern having at least one pair of first and second patterns, and the first pattern has an unexposed region surrounded by an exposed region, and the second pattern has an exposed region surrounded by an unexposed region. In addition, the present invention provides a method of fabricating a semiconductor device comprising the steps of forming at least one pair of first and second patterns on a wafer, the first pattern having an unexposed region surrounded by an exposed region, the second pattern having an exposed region surrounded by an unexposed region, and checking a focusing condition on exposure by measuring widths of the first and second patterns formed on the wafer.

Abstract: There is provided a semiconductor device including a wafer and a focus monitoring pattern formed on the wafer. The focus monitoring pattern having at least one pair of first and second patterns, and the first pattern has an unexposed region surrounded by an exposed region, and the second pattern has an exposed region surrounded by an unexposed region. In addition, the present invention provides a method of fabricating a semiconductor device comprising the steps of forming at least one pair of first and second patterns on a wafer, the first pattern having an unexposed region surrounded by an exposed region, the second pattern having an exposed region surrounded by an unexposed region, and checking a focusing condition on exposure by measuring widths of the first and second patterns formed on the wafer.

Abstract: A scan-type reducing projection exposure method, which can reduce the influence of machining errors upon the focusing characteristic of a lens system, by: preparing test patterns distributed in an exposure area; projecting the test patterns onto a photosensitive member, while changing a scan direction of a scan-type reducing projection exposure apparatus; developing the photosensitive member to produce photosensitive patterns; measuring dimensions of predetermined parts of the photosensitive patterns to obtain a distribution of the dimensions of the photosensitive patterns in the exposure areas; determining a scan direction in accordance with dimension distribution obtained in said scanning step; and performing an exposure using the determined scanning direction.

Abstract: A motor-operated cylinder is provided, wherein the rotational movement of the output shaft of a motor is converted into a linear movement by a thread mechanism 3, with the least possible load applied to the thread mechanism 3 when an object starts to be moved. The motor-operated cylinder is equipped with a booster 14 so that propelling forces exerted by both the thread mechanism 3 and booster 14 simultaneously act on a retractable rod 6.

Abstract: The electric cylinder consists of an electromotor 1, a plurality of parallel ball screws 4 connected to the electromotor 1 via transmission members 3, a plurality of ball nuts 5 mating with the ball screws 4, a slider 6 for consolidating the ball nuts 5 into one body, and a rod 7 fixedly mounted to the slider 6. The electric cylinder has a high thrust so that it can replace an oil pressure cylinder so that those cylinders used in a plant are unified into electric cylinders to achieve their efficient maintenance.

Abstract: An electric cylinder to reduce shock and damage to itself and a body to be transferred. The electric cylinder includes a rod head having a flange mounted on the distal end of a hollow piston rod, a circular polyurethane rubber plate mounted on a circular front surface of the flange, and a protection plate mounted on the front surface of the polyurethane rubber plate.

Abstract: A rod-less cylinder comprises a cylinder having an inner surface, an outer surface, a slit elongating in the longitudinal direction in the outer surface, and being formed by a pair of opposing side surfaces, a side recess on the inner surface, which has a width larger than that of the slit, which extends over two sides of the slit and in the direction of the width of the same, and which have first surfaces intersection the side surfaces of the slit and second surfaces intersecting the first surfaces. The rod-less cylinder further comprises a piston which is able to reciprocate in the cylinder and a sealing member which is detachably fitted in the side recess, and which is able to close the slit. The sealing member has a pair of holding ribs for holding the sealing member in the side recess by its engagement with the second surfaces, and a pair of sealing lips for closing the cylinder and the side groove.

Abstract: A hopper for providing moulding sand having an opened top and a bottom member having through holes for discharging the sand is positioned spaced apart at a suitable distance horizontally from a cover member connected to a suitable source for generating gas for hardening the moulding sand. A pattern plate provided with vacuum evacuating means is disposed to be selectively connected to either one of the hopper and the cover member for discharging and filling the moulding sands into a flask placed on a pattern plate and for introducing hardening gas and allowing said gas to penetrate and permeate through the layer of sand filled in the flask to harden the filled sand, respectively. By using vacuum evacuation of a hollow chamber in the pattern plate instead of pressurized air and hardening gas under pressure, the entire moulding apparatus can be rendered lighter in construction and smaller in size, while any leakage of poisonous hardening gas can be completely prevented from occurring.

Abstract: A molding box apparatus having a horizontal tubular body and a pair of pattern plates having pattern surfaces complementary to the mold chambers to be formed fitting in the tubular body, at least one of the pattern plates being slidable in the tubular body. The apparatus further has a well pattern provided on the pattern surface of one of the pattern plates and a runner pattern provided on the well pattern and extending from one end of the latter substantially perpendicularly to the pattern surface. The end of the runner pattern is adapted to be slidingly received by a guide hole formed in the other pattern plate. With this apparatus, it is possible to easily produce a mold part of a vertical split type flaskless mold assembly.

Abstract: Disclosed is a gas hardening type molding machine wherein a vertical type molding box is disposed under a molding sand hopper having an upper part opened and a bottom part provided with a sand discharge port, and a mold cavity in the vertical split type molding box is communicated with both a vacuum device and a hardening gas generator through stop valves, thereby to conduct both the filling of molding sand and the permeation of a hardening gas by utilizing the suction operation of the vacuum device.

Abstract: A method of making a mold having the steps of supplying a molding sand containing a gas-hardenable binder into a space defined by a patter plate and a molding flask, covering the upper surface of the molding sand in a gas-tight manner with a film sheet, bringing the space in the molding flask into communication with a vacuum source to reduce the pressure in the space thereby to squeeze the molding sand by means of the film sheet, closing, after removing the film sheet, the upper opening of the molding flask, and connecting a hardening gas source to the space in the molding flask while reducing the pressure in the space to induce a hardening gas into the molding flask to make the gas penetrate the molding sand, thereby to harden the molding sand.

Abstract: A rod-less cylinder comprises a cylinder having an inner surface, an outer surface, a slit elongating in the longitudinal direction in the outer surface, and being formed by a pair of opposing side surfaces, a side recess on the inner surface, which has a width larger than that of the slit, which extends over two sides of the slit and in the direction of the width of the same, and which have first surfaces intersection the side surfaces of the slit and second surfaces intersecting the first surfaces. The rod-less cylinder further comprises a piston which is able to reciprocate in the cylinder and a sealing member which is detachably fitted in the side recess, and which is able to close the slit. The sealing member has a pair of holding ribs for holding the sealing member in the side recess by its engagement with the second surfaces, and a pair of sealing lips for closing the cylinder and the side groove.