Patents by Inventor Shigehisa Nakaya

Shigehisa Nakaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal print head
    Patent number: 3931492
    Abstract: The thermal print head comprises a substrate, a semiconductor wafer fabricated thereover, a plurality of junctions formed on the semiconductor wafer, and electrodes to supply an inverse current to the junctions. The junctions are arranged so as to correspond to the pattern of the symbol, such as letters, to be printed. Each of the junctions is used as a heating element. Heat is evolved at the junction when the inverse current flows through the potential barrier which is formed at the junction. The heat evolved is used for the heating element.
    Type: Grant
    Filed: June 7, 1973
    Date of Patent: January 6, 1976
    Assignee: Nippon Telegraph and Telephone Public Corporation
    Inventors: Rikuo Takano, Mitsushi Matsunaga, Akira Yoshida, Kiyoshi Nawata, Shigehisa Nakaya