Patents by Inventor Shigehisa OONAKAHARA

Shigehisa OONAKAHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, lead frame assembly, and method for fabricating the same
    Patent number: 8525307
    Abstract: A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and covering a side surface of the lead frame and exposing a lower surface of the lead frame. The frame-like member has at least one concave portion in a side surface thereof. The concave portion has a ceiling portion located at the same height as or lower than an upper surface of the lead frame, and a bottom portion located higher than the lower surface of the lead frame.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: September 3, 2013
    Assignee: Panasonic Corporation
    Inventors: Kenichi Ito, Shigehisa Oonakahara, Yoshikazu Tamura, Kiyoshi Fujihara
  • SEMICONDUCTOR DEVICE
    Publication number: 20120025260
    Abstract: A semiconductor device includes a lead frame, a first semiconductor element mounted on the lead frame, a frame-like member formed on the lead frame, surrounding the first semiconductor element, and a protective resin filling a space surrounded by the frame-like member. The lead frame has an external terminal protruding outside the frame-like member. The external terminal has a barrier portion which is located at an end portion thereof protruding from the frame-like member and rises from a top surface of the external terminal.
    Type: Application
    Filed: July 26, 2011
    Publication date: February 2, 2012
    Inventors: Shigehisa OONAKAHARA, Kenichi Ito, Tooru Aoyagi, Yuu Hasegawa
  • SEMICONDUCTOR DEVICE, LEAD FRAME ASSEMBLY, AND METHOD FOR FABRICATING THE SAME
    Publication number: 20120025361
    Abstract: A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and covering a side surface of the lead frame and exposing a lower surface of the lead frame. The frame-like member has at least one concave portion in a side surface thereof. The concave portion has a ceiling portion located at the same height as or lower than an upper surface of the lead frame, and a bottom portion located higher than the lower surface of the lead frame.
    Type: Application
    Filed: July 27, 2011
    Publication date: February 2, 2012
    Inventors: Kenichi ITO, Shigehisa Oonakahara, Yoshikazu Tamura, Kiyoshi Fujihara