Abstract: A cooling apparatus includes a conveying means which conveys a resin composition formed into a sheet shape along a direction parallel to a surface of the sheet-shaped resin composition and a cooling means which cools the resin composition being conveyed by the conveying means. A temperature of the resin composition just before being cooled by the cooling means is in the range of 40 to 60° C. and the cooling means has a cooling ability to cool the resin composition such that a cooling rate of the resin composition is in the range of 0.2 to 5° C./min. Further, the cooling means includes a fan section having at least one outlet port which discharges cooling air of which temperature is in the range of ?40 to 0° C. to the resin composition.

Abstract: The kneading apparatus 1 includes a casing 2, a pair of elongated screws 4a, 4b rotatably provided in the casing 2. The screws 4a, 4b are arranged parallel and horizontally with respect to one another. The casing 2 has a main body 20 and a screw container 3 provided in the casing 2. The screw container 3 defines a kneading section 30 therein. The screw 4a includes a screw axis 41 having an outer periphery, a first screw member 42 provided on the outer periphery of the screw axis 41 and a kneading member 43 provided on the outer periphery of the screw axis 41. The first screw member 42 and kneading member 43 are provided in the kneading section 30. The screw 4a, the first screw member 42 and the kneading member 43 respectively have core portions 411, 412, 413 having a surface and outer layers 45 respectively provided on the surfaces of the core portions 411, 412, 413. The screw container 3 and the outer layers 45 are constituted of a nonmetallic material.

Abstract: A pulverizing apparatus for pulverizing a hard resin composition has a pulverizing mechanism having a pair of rollers arranged parallel to one another, these rollers pulverizing the hard resin composition by pressuring the hard resin composition between the rollers and a cooling device for cooling the hard resin composition during the hard resin composition being pulverized. Each of the rollers has a cylindrical shape with a hollow portion and the cooling device is configured to supply a coolant into the hollow portion of each of the rollers. The coolant flows in the hollow portion of each of the rollers in a longitudinal direction of each of the rollers. The cooling device has facilitating members respectively inserted into the hollow portions of the rollers.

Abstract: A degassing apparatus 1 includes a housing 2 having a degassing chamber 22, a rotor 3 rotatably provided in the housing 2 and a decompressing mechanism 4 for decompressing the degassing chamber 22 of the housing 2. The housing 2 further includes a conduit line 21 and a cylindrical portion 23. The degassing chamber 22 is provided in a middle part of the conduit line 21. An upper end of the conduit line 21 constitutes an inlet port 24 and a lower end of the conduit line 21 constitutes an outlet port 25. The rotor 3 is rotatably provided inside the cylindrical portion 23 so that a passage between the outlet portion 25 and the degassing chamber 22 can be hermetically separated by the rotor 3. The rotor 3 has four partitioning plates 31 which partition the inside of the cylindrical portion into four spaces 231-234.

Abstract: A compact production apparatus includes a main body having at least one molding die in which a cavity is formed, a first flow passage member for supplying powder into the cavity, an upper compaction member having an upper punch surface, a lower compaction member having a lower punch surface which is allowed to compress the powder in the cavity in cooperation with the upper punch surface to thereby obtain a compact of the powder, and a second flow passage member from which the compact separated from the cavity is to be discharged. Further, at least 80% or more of a total surface area of an upper surface of the main body, an inner circumferential surface defining the cavity, an inner circumferential surface of the first flow passage member, an inner circumferential surface of the second flow passage member, the upper punch surface of the upper compaction member and the lower punch surface of the lower compaction member is made of a nonmetallic material.

Abstract: A compact production apparatus includes a main body having at least one molding die in which a cavity is formed, a first flow passage member for supplying powder into the cavity, an upper compaction member having an upper punch surface, a lower compaction member having a lower punch surface which is allowed to compress the powder in the cavity in cooperation with the upper punch surface to thereby obtain a compact of the powder, and a second flow passage member from which the compact separated from the cavity is to be discharged. Further, at least 80% or more of a total surface area of an upper surface of the main body, an inner circumferential surface defining the cavity, an inner circumferential surface of the first flow passage member, an inner circumferential surface of the second flow passage member, the upper punch surface of the upper compaction member and the lower punch surface of the lower compaction member is made of a nonmetallic material.

Abstract: The kneading apparatus 1 includes a casing 2, a pair of elongated screws 4a, 4b rotatably provided in the casing 2. The screws 4a, 4b are arranged parallel and horizontally with respect to one another. The casing 2 has a main body 20 and a screw container 3 provided in the casing 2. The screw container 3 defines a kneading section 30 therein. The screw 4a includes a screw axis 41 having an outer periphery, a first screw member 42 provided on the outer periphery of the screw axis 41 and a kneading member 43 provided on the outer periphery of the screw axis 41. The first screw member 42 and kneading member 43 are provided in the kneading section 30. The screw 4a, the first screw member 42 and the kneading member 43 respectively have core portions 411, 412, 413 having a surface and outer layers 45 respectively provided on the surfaces of the core portions 411, 412, 413. The screw container 3 and the outer layers 45 are constituted of a nonmetallic material.

Abstract: A cooling apparatus includes a conveying means which conveys a resin composition formed into a sheet shape along a direction parallel to a surface of the sheet-shaped resin composition and a cooling means which cools the resin composition being conveyed by the conveying means. A temperature of the resin composition just before being cooled by the cooling means is in the range of 40 to 60° C. and the cooling means has a cooling ability to cool the resin composition such that a cooling rate of the resin composition is in the range of 0.2 to 5° C./min. Further, the cooling means includes a fan section having at least one outlet port which discharges cooling air of which temperature is in the range of ?40 to 0° C. to the resin composition.

Abstract: A pulverizing apparatus for pulverizing a hard resin composition has a pulverizing mechanism having a pair of rollers arranged parallel to one another, these rollers pulverizing the hard resin composition by pressuring the hard resin composition between the rollers and a cooling device for cooling the hard resin composition during the hard resin composition being pulverized. Each of the rollers has a cylindrical shape with a hollow portion and the cooling device is configured to supply a coolant into the hollow portion of each of the rollers. The coolant flows in the hollow portion of each of the rollers in a longitudinal direction of each of the rollers. The cooling device has facilitating members respectively inserted into the hollow portions of the rollers.

Abstract: A degassing apparatus 1 includes a housing 2 having a degassing chamber 22, a rotor 3 rotatably provided in the housing 2 and a decompressing mechanism 4 for decompressing the degassing chamber 22 of the housing 2. The housing 2 further includes a conduit line 21 and a cylindrical portion 23. The degassing chamber 22 is provided in a middle part of the conduit line 21. An upper end of the conduit line 21 constitutes an inlet port 24 and a lower end of the conduit line 21 constitutes an outlet port 25. The rotor 3 is rotatably provided inside the cylindrical portion 23 so that a passage between the outlet portion 25 and the degassing chamber 22 can be hermetically separated by the rotor 3. The rotor 3 has four partitioning plates 31 which partition the inside of the cylindrical portion into four spaces 231-234.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip, which has good flowability without deterioration in curability. Specifically, a resin composition is disclosed for encapsulating a semiconductor chip containing a phenol aralkyl type epoxy resin containing biphenylene structure(A), a phenol aralkyl type resin containing phenylene or biphenylene structure (B), an inorganic filler (C) and a curing accelerator (D) as main components, further containing a silane coupling agent (E) in 0.01 wt % to 1 wt % both inclusive of the total amount of the epoxy resin composition and a Compound (F) containing two hydroxyl groups combined with each of adjacent carbon atoms on a naphthalene ring in more than or equal to 0.01 wt % of the total amount of the epoxy resin composition.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip, which has good flowability without deterioration in curability. Specifically, a resin composition for encapsulating a semiconductor chip containing an epoxy resin (A), a phenol resin (B), an inorganic filler (C) and a curing accelerator (D) as main components, and further containing a silane coupling agent (E) in 0.01 wt % to 1 wt % both inclusive of the total amount of the epoxy resin composition and Compound (F) contains two hydroxyl groups combined with each of adjacent carbon atoms in an aromatic ring in more than or equal to 0.01 wt % of the total amount of the epoxy resin composition.

Abstract: An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor chip, which has good flowability without deterioration in curability. Specifically, this invention provides a resin composition for encapsulating a semiconductor chip containing an epoxy resin (A), a phenol resin (B), an inorganic filler (C) and a curing accelerator (D) as main components, comprising a silane coupling agent (E) in 0.01 wt % to 1 wt % both inclusive of the total amount of the epoxy resin composition and Compound (F) contains two hydroxyl groups combined with each of adjacent carbon atoms comprising said naphthalene ring in more than or equal to 0.01 wt % of the total amount of the epoxy resin composition.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip, which has good flowability without deterioration in curability. Specifically, a resin composition is disclosed for encapsulating a semiconductor chip containing a phenol aralkyl type epoxy resin containing biphenylene structure(A), a phenol aralkyl type resin containing phenylene or biphenylene structure (B), an inorganic filler (C) and a curing accelerator (D) as main components, further containing a silane coupling agent (E) in 0.01 wt % to 1 wt % both inclusive of the total amount of the epoxy resin composition and a Compound (F) containing two hydroxyl groups combined with each of adjacent carbon atoms on a naphthalene ring in more than or equal to 0.01 wt % of the total amount of the epoxy resin composition.

Abstract: An epoxy resin composition for encapsulating a semiconductor, which is free from halogen and antimony and has excellent soldering crack resistance and high-temperature storage life without lowering the flame-retardancy, and which comprises as essential components (A) an epoxy resin, (B) a phenol resin curing agent, (C) a curing accelerator, (D) an inorganic filler and (E) a red phosphorus-based flame-retardant, wherein the ratio of (a) the number of epoxy groups of the epoxy resin to (b) the number of phenolic hydroxyl groups of the phenol resin curing agent ?(a)/(b)! is 0.8 to 1.2, the amount of the inorganic filler (D) contained in the epoxy resin composition is 70 to 90% by weight based on the total weight of the epoxy resin composition and the cured product of the epoxy resin composition has a glass transition temperature of 100.degree. to 160.degree. C. and a linear expansion coefficient at 25.degree. C. of 0.8 to 1.8.times.10.sup.-5 /.degree.C.

Abstract: Disclosed is an epoxy resin composition for sealing semiconductors which comprises as essential components: (A) an epoxy resin containing a biphenyl type epoxy resin represented by the following formula (1) in an amount of 30-100% by weight on the basis of the total amount of the epoxy resin, ##STR1## wherein R.sub.1 -R.sub.8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, (B) a hardener containing a phenolic resin hardener represented by the following formula (2a) or a naphthol resin hardener represented by the following formula (2b) in an amount of 30-100% by weight on the basis of the total amount of the hardener, ##STR2## wherein R.sub.1 -R.sub.8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, R.sub.