Patents by Inventor Shigehito Ishii

Shigehito Ishii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Armature winding of electrical rotating apparatus, electrical rotating apparatus using the same, and method of manufacturing the same
    Patent number: 9705370
    Abstract: According to one embodiment, an armature winding includes a plurality of rectangular solid conductors and a plurality of rectangular hollow conductors, which are arranged such that tip of end portions thereof form one surface, the surface being coated with a brazing filler material, and an anti-flowing agent applied on a portion of an inner surface of each hollow conductor to prevent the brazing filler material from flowing into hollow portions of the hollow conductors.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: July 11, 2017
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Mitsuhiko Koyama, Toru Otaka, Shigehito Ishii, Yoshitaka Sakai
  • ARMATURE WINDING OF ELECTRICAL ROTATING APPARATUS, ELECTRICAL ROTATING APPARATUS USING THE SAME, AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20150171687
    Abstract: According to one embodiment, an armature winding includes a plurality of rectangular solid conductors and a plurality of rectangular hollow conductors, which are arranged such that tip of end portions thereof form one surface, the surface being coated with a brazing filler material, and an anti-flowing agent applied on a portion of an inner surface of each hollow conductor to prevent the brazing filler material from flowing into hollow portions of the hollow conductors.
    Type: Application
    Filed: November 21, 2014
    Publication date: June 18, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Mitsuhiko KOYAMA, Toru OTAKA, Shigehito ISHII, Yoshitaka SAKAI
  • HIGHLY HEAT CONDUCTIVE INSULATING MEMBER, METHOD OF MANUFACTURING THE SAME AND ELECTROMAGNETIC DEVICE
    Publication number: 20090197102
    Abstract: The present invention provides a solution to the above-described drawbacks, and more specifically, as the tape-like or sheet-like insulation member, the resin matrix in which the first particles having a heat conductivity of 1 W/mK or higher and 300 W/mK or lower, that are diffused in the resin matrix, and the second particles having a heat conductivity of 0.5 W/mK or higher and 300 W/mK or lower, are diffused, is employed.
    Type: Application
    Filed: March 31, 2009
    Publication date: August 6, 2009
    Inventors: Tetsushi Okamoto, Hiroyoshi Tsuchiya, Fumio Sawa, Noriyuki Iwata, Mitsuhiko Koyama, Yukio Suzuki, Akihiko Suzuki, Tooru Ootaka, Shigehito Ishii, Susumu Nagano
  • Highly heat conductive insulating member, method of manufacturing the same and electromagnetic device
    Patent number: 7524557
    Abstract: The present invention provides a solution to the above-described drawbacks, and more specifically, as the tape-like or sheet-like insulation member, the resin matrix in which the first particles having a heat conductivity of 1 W/mK or higher and 300 W/mK or lower, that are diffused in the resin matrix, and the second particles having a heat conductivity of 0.5 W/mK or higher and 300 W/mK or lower, are diffused, is employed.
    Type: Grant
    Filed: January 4, 2005
    Date of Patent: April 28, 2009
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tetsushi Okamoto, Hiroyoshi Tsuchiya, Fumio Sawa, Noriyuki Iwata, Mitsuhiko Koyama, Yukio Suzuki, Akihiko Suzuki, Tooru Ootaka, Shigehito Ishii, Susumu Nagano
  • Highly heat conductive insulating member, method of manufacturing the same and electromagnetic device
    Publication number: 20050208301
    Abstract: The present invention provides a solution to the above-described drawbacks, and more specifically, as the tape-like or sheet-like insulation member, the resin matrix in which the first particles having a heat conductivity of 1 W/mK or higher and 300 W/mK or lower, that are diffused in the resin matrix, and the second particles having a heat conductivity of 0.5 W/mK or higher and 300 W/mK or lower, are diffused, is employed.
    Type: Application
    Filed: January 4, 2005
    Publication date: September 22, 2005
    Inventors: Tetsushi Okamoto, Hiroyoshi Tsuchiya, Fumio Sawa, Noriyuki Iwata, Mitsuhiko Koyama, Yukio Suzuki, Akihiko Suzuki, Tooru Ootaka, Shigehito Ishii, Susumu Nagano