Patents by Inventor Shigehito Sagisaka

Shigehito Sagisaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090246435
    Abstract: The present invention provides a laminate having an environmental cracking resistance for a fuel and a fuel impermeability and, in addition, higher in productivity. The present invention is a laminate including a chlorotrifluoroethylene copolymer layer (C) and a fluorine-free organic material layer (K), wherein the chlorotrifluoroethylene copolymer has a melt flow rate of 15.0 to 40.0 (g/10 minutes) and contains 15.0 to 25.0 mole percent of chlorotrifluoroethylene units relative to all monomer units.
    Type: Application
    Filed: March 27, 2009
    Publication date: October 1, 2009
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Takeshi SHIMONO, Kenji Ichikawa, Takeshi Inaba, Yukinori Kamiya, Shingo Sakakibara, Shigehito Sagisaka, Takahiro Kitahara
  • Patent number: 6893729
    Abstract: The present invention is to provide a laminated resin molding comprising a polyamide-based resin composition as an outer layer and being excellent in interlayer adhesion strength, in particular a laminated resin molding comprising a fluorine-containing resin as an inner layer. The present invention is a laminated resin molding which comprises a layer (A) comprising a polyamide-based resin composition and a layer (B) laminated to said layer (A), said layer (B) comprising a fluorine-containing ethylenic polymer having a carbonyl group, and said polyamide-based resin composition having a functional group, in addition to an amide group, selected from the group consisting of hydroxyl group, carboxyl group, ester group and sulfonamide group in a total amount of 0.05 to 80 equivalent percent relative to the amide group.
    Type: Grant
    Filed: February 19, 2001
    Date of Patent: May 17, 2005
    Assignee: Daikin Industries, Ltd.
    Inventors: Takeshi Inaba, Taketo Kato, Shigehito Sagisaka, Takuya Arase, Tetsuo Shimizu
  • Patent number: 6881460
    Abstract: A multilayer molding having a polyamide-based resin as an outer layer, the multilayer molding including a fluorine-containing resin as an inner layer, as well as a resin laminate which can form the multilayer molding. The resin laminate has a layer (A) including a polyamide-based resin and a layer (B) including a fluorine-containing ethylenic polymer laminated to the layer (A), the polyamide-based resin having an amine value of 10 to 60 equivalents/106 g, and the fluorine-containing ethylenic polymer being a fluorine-containing ethylenic polymer having a carbonyl group.
    Type: Grant
    Filed: February 13, 2001
    Date of Patent: April 19, 2005
    Assignee: Daikin Industries, Ltd.
    Inventors: Takeshi Inaba, Taketo Kato, Shigehito Sagisaka, Takuya Arase, Tetsuo Shimizu
  • Patent number: 6740375
    Abstract: A fluorine-containing adhesive material comprising a fluorine-containing ethylenic polymer having a carbonate group and/or a carboxylic acid halide group at a chain end or a side chain of the polymer, wherein a total of a number of the carbonate groups and/or carboxylic acid halide groups is at less than 150 per 1×106 main chain carbon atoms, can directly impart the firm adherability to a substrate such as a metal, a glass or a resin while maintaining excellent properties such as chemical resistance, solvent resistance, weatherability and soil releasability possessed by a fluorine-containing polymer.
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: May 25, 2004
    Assignee: Daikin Industries, Ltd.
    Inventors: Shigehito Sagisaka, Taketo Kato, Takeshi Inaba, Takuya Arase, Tetsuo Shimizu
  • Patent number: 6680124
    Abstract: A fluorine-containing adhesive material comprising a fluorine-containing ethylenic polymer having a carbonate group and/or a carboxylic halide group at a chain end or a side chain of polymer, wherein a total of a number of the carbonate groups and/or carboxylic halide groups is at least 150 relative to 1×106 main chain carbons, can directly impart the firm adherability to a substrate such as a metal, a glass or a resin while maintaining excellent properties such as resistance to chemicals, resistance to solvent, weatherability and resistance to stain possessed by a fluorine-containing polymer.
    Type: Grant
    Filed: November 6, 2000
    Date of Patent: January 20, 2004
    Assignee: Daikin Industries Ltd.
    Inventors: Takayuki Araki, Takahiro Kitahara, Shigehito Sagisaka, Taketo Kato, Takeshi Inaba, Kazuo Ishiwari, Tetsuo Shimizu, Hidenori Ozaki, Tatsuya Higuchi
  • Publication number: 20030157335
    Abstract: The present invention is to provide a multilayer molding comprising a polyamide-based resin as an outer layer and having excellent interlayer adhesion, in particular, the multilayer molding comprising a fluorine-containing resin as an inner layer, as well as a resin laminate which can form the multilayer molding.
    Type: Application
    Filed: November 1, 2002
    Publication date: August 21, 2003
    Inventors: Takeshi Inaba, Taketo Kato, Shigehito Sagisaka, Takuya Arase, Tetsuo Shimizu
  • Publication number: 20030148125
    Abstract: The present invention is to provide a laminated resin molding comprising a polyamide-based resin composition as an outer layer and being excellent in interlayer adhesion strength, in particular a laminated resin molding comprising a fluorine-containing resin as an inner layer.
    Type: Application
    Filed: November 1, 2002
    Publication date: August 7, 2003
    Inventors: Takeshi Inaba, Taketo Kato, Shigehito Sagisaka, Takuya Arase, Tetsuo Shimizu
  • Patent number: 6599997
    Abstract: A fluorine-containing adhesive comprising a fluorine-containing ethylenic polymer (A) having functional group which has a crystalline melting point or glass transition temperature of not more than 270° C. and is prepared by copolymerizing (a) 0.05 to 30% by mole of at least one of fluorine-containing ethylenic monomers having at least one functional group selected from the group consisting of carboxyl and a carboxylic salt group and (b) 70 to 99.95% by mole of at least one of fluorine-containing ethylenic monomers which do not have the above-mentioned functional group and is copolymerizable with the component (a). To provide the fluorine-containing adhesive maintaining chemical resistance, solvent resistance, weather resistance and stain-proofing property and giving direct strong adhesion particularly to a substrate of metal, glass, resin, etc. and an adhesive film and laminated article which are produced from the fluorine-containing adhesive.
    Type: Grant
    Filed: July 8, 2002
    Date of Patent: July 29, 2003
    Assignee: Daikin Industries, Ltd.
    Inventors: Takayuki Araki, Shigehito Sagisaka, Yoshito Tanaka, Masahiro Kumegawa
  • Publication number: 20030026996
    Abstract: A fluorine-containing adhesive comprising a fluorine-containing ethylenic polymer (A) having functional group which has a crystalline melting point or glass transition temperature of not more than 270° C. and is prepared by copolymerizing (a) 0.05 to 30% by mole of at least one of fluorine-containing ethylenic monomers having at least one functional group selected from the group consisting of carboxyl and a carboxylic salt group and (b) 70 to 99.95% by mole of at least one of fluorine-containing ethylenic monomers which do not have the above-mentioned functional group and is copolymerizable with the component (a). To provide the fluorine-containing adhesive maintaining chemical resistance, solvent resistance, weather resistance and stain-proofing property and giving direct strong adhesion particularly to a substrate of metal, glass, resin, etc. and an adhesive film and laminated article which are produced from the fluorine-containing adhesive.
    Type: Application
    Filed: July 8, 2002
    Publication date: February 6, 2003
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Takayuki Araki, Shigehito Sagisaka, Yoshito Tanaka, Masahiro Kumegawa
  • Patent number: 6479161
    Abstract: A fluorine-containing adhesive comprising a fluorine-containing ethylenic polymer (A) having functional group which has a crystalline melting point or glass transition temperature of not more than 270° C. and is prepared by copolymerizing (a) 0.05 to 30% by mole of at least one of fluorine-containing ethylenic monomers having at least one functional group selected from the group consisting of carboxyl and a carboxylic salt group and (b) 70 to 99.95% by mole of at least one of fluorine-containing ethylenic monomers which do not have the above-mentioned functional group and is copolymerizable with the component (a). To provide the fluorine-containing adhesive maintaining chemical resistance, solvent resistance, weather resistance and stain-proofing property and giving direct strong adhesion particularly to a substrate of metal, glass, resin, etc. and an adhesive film and laminated article which are produced from the fluorine-containing adhesive.
    Type: Grant
    Filed: December 3, 1999
    Date of Patent: November 12, 2002
    Assignee: Daikin Industries, Ltd.
    Inventors: Takayuki Araki, Shigehito Sagisaka, Yoshito Tanaka, Masahiro Kumegawa