Patents by Inventor Shigekatsu Nagatomo

Shigekatsu Nagatomo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11522443
    Abstract: An inverter apparatus includes a main circuit substrate, an EMC filter substrate, a control substrate, and a panel. The main circuit substrate is configured to convert electric power and includes an output terminal through which the electric power is output from the inverter apparatus. The EMC filter substrate is provided on the main circuit substrate and configured to reduce propagation of electromagnetic noise. The EMC filter substrate includes a first input terminal through which the electric power is input to the inverter apparatus. The control substrate is provided on the EMC filter substrate so that the EMC filter substrate is sandwiched between the main circuit substrate and the control substrate. The control substrate is configured to control the main circuit substrate. The panel is provided on the control substrate so that the control substrate is sandwiched between the EMC filter substrate and the panel.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: December 6, 2022
    Assignee: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Ryosuke Tsumagari, Shigekatsu Nagatomo, Yuto Kubo, Yuki Tokimatsu
  • Publication number: 20200321858
    Abstract: An inverter apparatus includes a main circuit substrate, an EMC filter substrate, a control substrate, and a panel. The main circuit substrate is configured to convert electric power and includes an output terminal through which the electric power is output from the inverter apparatus. The EMC filter substrate is provided on the main circuit substrate and configured to reduce propagation of electromagnetic noise. The EMC filter substrate includes a first input terminal through which the electric power is input to the inverter apparatus. The control substrate is provided on the EMC filter substrate so that the EMC filter substrate is sandwiched between the main circuit substrate and the control substrate. The control substrate is configured to control the main circuit substrate. The panel is provided on the control substrate so that the control substrate is sandwiched between the EMC filter substrate and the panel.
    Type: Application
    Filed: June 22, 2020
    Publication date: October 8, 2020
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Ryosuke TSUMAGARI, Shigekatsu NAGATOMO, Yuto KUBO, Yuki TOKIMATSU
  • Patent number: 10367425
    Abstract: A matrix converter includes a plurality of first bidirectional switches electrically connected to each of input phases of an AC power supply and each of output phases of a load, respectively, and a plurality of second bidirectional switches electrically connected to each of the input phases and each of the output phases, respectively. The first bidirectional switch and the second bidirectional switch are electrically connected in parallel to one of the input phases and one of the output phases.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: July 30, 2019
    Assignee: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Takayuki Morihara, Takahiro Uchino, Masahiro Tsuruta, Shigekatsu Nagatomo, Yuto Kubo
  • Patent number: 10109419
    Abstract: A capacitor cover configured to store a plurality of capacitors of a power conversion device is provided. The capacitor cover includes a first cover including a plurality of types of first contact surfaces configured to be in contact with one side of each surface of the capacitors of plurality of types with different sizes.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: October 23, 2018
    Assignee: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Takayuki Morihara, Yuto Kubo, Shigekatsu Nagatomo
  • Patent number: 9985551
    Abstract: A capacitor module applicable in a matrix convertor includes a module cover and a plurality of terminals. The module cover houses a plurality of AC capacitors. The plurality of terminals are disposed at least on a first side and a second side of the module cover in a widthwise direction of the module cover, and protrude from a bottom surface of the module cover.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: May 29, 2018
    Assignee: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Takayuki Morihara, Takahiro Uchino, Masahiro Tsuruta, Shigekatsu Nagatomo, Yuto Kubo
  • Publication number: 20170077828
    Abstract: A matrix converter includes a plurality of first bidirectional switches electrically connected to each of input phases of an AC power supply and each of output phases of a load, respectively, and a plurality of second bidirectional switches electrically connected to each of the input phases and each of the output phases, respectively. The first bidirectional switch and the second bidirectional switch are electrically connected in parallel to one of the input phases and one of the output phases.
    Type: Application
    Filed: November 4, 2016
    Publication date: March 16, 2017
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Takayuki MORIHARA, Takahiro UCHINO, Masahiro TSURUTA, Shigekatsu NAGATOMO, Yuto KUBO
  • Publication number: 20170018355
    Abstract: This disclosure discloses a capacitor cover configured to store a plurality of capacitors of a power conversion device. The capacitor cover includes a first cover including a plurality of types of first contact surfaces configured to be in contact with one side of each surface of the capacitors of plurality of types with different sizes.
    Type: Application
    Filed: September 30, 2016
    Publication date: January 19, 2017
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Takayuki MORIHARA, Yuto KUBO, Shigekatsu NAGATOMO
  • Publication number: 20150372609
    Abstract: A capacitor module applicable in a matrix convertor includes a module cover and a plurality of terminals. The module cover houses a plurality of AC capacitors. The plurality of terminals are disposed at least on a first side and a second side of the module cover in a widthwise direction of the module cover, and protrude from a bottom surface of the module cover.
    Type: Application
    Filed: June 19, 2015
    Publication date: December 24, 2015
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Takayuki MORIHARA, Takahiro UCHINO, Masahiro TSURUTA, Shigekatsu NAGATOMO, Yuto KUBO
  • Publication number: 20130023165
    Abstract: An electric motor controller with a screw terminal block including: a terminal fitting connected with a solderless terminal having a crimping portion crimped to wire cores of an electrical wire; a plate-shaped square washer having a cut-out portion in at least one edge thereof, the cut-out portion for avoiding interference with the crimping portion of the solderless terminal or the wire cores projecting from the crimping portion to an end of the electrical wire; and a terminal screw fixing the solderless terminal between the square washer and the terminal fitting.
    Type: Application
    Filed: July 3, 2012
    Publication date: January 24, 2013
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Kenta SASAHARA, Makoto Nakaya, Tomoyo Tohyama, Shigekatsu Nagatomo
  • Publication number: 20120262891
    Abstract: A power converter for converting a direct-current power to an alternating-current power or converting an alternating-current power to a direct-current power, includes a box-shaped housing having a front surface, a rear surface, a left surface, a right surface, an upper surface, a lower surface and an opening formed in the front surface. The power converter further includes a reinforcing member including a first reinforcing member and a second reinforcing member which are provided in an internal space of the housing near the opening to intersect each other, the first reinforcing member joined to the left surface and the right surface of the housing, the second reinforcing member joined to the upper surface and the lower surface of the housing.
    Type: Application
    Filed: March 22, 2012
    Publication date: October 18, 2012
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventor: Shigekatsu NAGATOMO
  • Patent number: 7817421
    Abstract: A motor controller capable of relaxing the temperature of a heat source which generates heat by driving the motor controller, and capable of realizing miniaturization and low price is provided. In a motor controller in which a power semiconductor module (2) which closely contact a heat sink (1) is mounted on a substrate (4), and a fan (6) is attached to the heat sink (1) by a fan case (8), portions of fins (1g) of the heat sink (1) are formed with a bell mouth (1c) and a circular-arc-shaped guide (1h), and the radiating capability of the fins (1g) is improved by effectively using the wind of the fan (6).
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: October 19, 2010
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Shigekatsu Nagatomo, Koji Nuki
  • Patent number: 7679915
    Abstract: There is provided a motor control apparatus in which a size of the apparatus can easily be reduced, a work for aligning a power semiconductor module with a substrate can be eliminated and an assembling property can be enhanced. In a motor control apparatus in which a power semiconductor module adhering to a heat sink is mounted on a first substrate, a spacer is provided between the heat sink and the substrate and the power semiconductor module is disposed in the spacer. Moreover, an edge part of a hole has such a structure as to block a space between a terminal protruded from a side portion of the power semiconductor module and the heat sink.
    Type: Grant
    Filed: August 22, 2005
    Date of Patent: March 16, 2010
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Kenji Isomoto, Shuhei Nohara, Shigekatsu Nagatomo
  • Publication number: 20080007919
    Abstract: There is provided a motor control apparatus in which a size of the apparatus can easily be reduced, a work for aligning a power semiconductor module with a substrate can be eliminated and an assembling property can be enhanced. In a motor control apparatus in which a power semiconductor module adhering to a heat sink is mounted on a first substrate, a spacer is provided between the heat sink and the substrate and the power semiconductor module is disposed in the spacer. Moreover, an edge part of a hole has such a structure as to block a space between a terminal protruded from a side portion of the power semiconductor module and the heat sink.
    Type: Application
    Filed: August 22, 2005
    Publication date: January 10, 2008
    Applicant: Kabushiki Kaisha Yaskawa Denki
    Inventors: Kenji Isomoto, Shuhei Nohara, Shigekatsu Nagatomo
  • Patent number: D455399
    Type: Grant
    Filed: November 22, 2000
    Date of Patent: April 9, 2002
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Shintaro Imamura, Makoto Kojyo, Kenji Isomoto, Shigekatsu Nagatomo
  • Patent number: D561095
    Type: Grant
    Filed: April 9, 2007
    Date of Patent: February 5, 2008
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Masafumi Sakai, Kenji Isomoto, Shigekatsu Nagatomo, Takayuki Morihara
  • Patent number: D562233
    Type: Grant
    Filed: April 9, 2007
    Date of Patent: February 19, 2008
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Kenji Isomoto, Shigekatsu Nagatomo, Koji Nuki, Takayuki Morihara
  • Patent number: D562234
    Type: Grant
    Filed: April 9, 2007
    Date of Patent: February 19, 2008
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Takayuki Morihara, Shigekatsu Nagatomo, Koji Nuki, Kenji Isomoto