Patents by Inventor Shigekatsu Nagatomo
Shigekatsu Nagatomo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11522443Abstract: An inverter apparatus includes a main circuit substrate, an EMC filter substrate, a control substrate, and a panel. The main circuit substrate is configured to convert electric power and includes an output terminal through which the electric power is output from the inverter apparatus. The EMC filter substrate is provided on the main circuit substrate and configured to reduce propagation of electromagnetic noise. The EMC filter substrate includes a first input terminal through which the electric power is input to the inverter apparatus. The control substrate is provided on the EMC filter substrate so that the EMC filter substrate is sandwiched between the main circuit substrate and the control substrate. The control substrate is configured to control the main circuit substrate. The panel is provided on the control substrate so that the control substrate is sandwiched between the EMC filter substrate and the panel.Type: GrantFiled: June 22, 2020Date of Patent: December 6, 2022Assignee: KABUSHIKI KAISHA YASKAWA DENKIInventors: Ryosuke Tsumagari, Shigekatsu Nagatomo, Yuto Kubo, Yuki Tokimatsu
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Publication number: 20200321858Abstract: An inverter apparatus includes a main circuit substrate, an EMC filter substrate, a control substrate, and a panel. The main circuit substrate is configured to convert electric power and includes an output terminal through which the electric power is output from the inverter apparatus. The EMC filter substrate is provided on the main circuit substrate and configured to reduce propagation of electromagnetic noise. The EMC filter substrate includes a first input terminal through which the electric power is input to the inverter apparatus. The control substrate is provided on the EMC filter substrate so that the EMC filter substrate is sandwiched between the main circuit substrate and the control substrate. The control substrate is configured to control the main circuit substrate. The panel is provided on the control substrate so that the control substrate is sandwiched between the EMC filter substrate and the panel.Type: ApplicationFiled: June 22, 2020Publication date: October 8, 2020Applicant: KABUSHIKI KAISHA YASKAWA DENKIInventors: Ryosuke TSUMAGARI, Shigekatsu NAGATOMO, Yuto KUBO, Yuki TOKIMATSU
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Patent number: 10367425Abstract: A matrix converter includes a plurality of first bidirectional switches electrically connected to each of input phases of an AC power supply and each of output phases of a load, respectively, and a plurality of second bidirectional switches electrically connected to each of the input phases and each of the output phases, respectively. The first bidirectional switch and the second bidirectional switch are electrically connected in parallel to one of the input phases and one of the output phases.Type: GrantFiled: November 4, 2016Date of Patent: July 30, 2019Assignee: KABUSHIKI KAISHA YASKAWA DENKIInventors: Takayuki Morihara, Takahiro Uchino, Masahiro Tsuruta, Shigekatsu Nagatomo, Yuto Kubo
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Patent number: 10109419Abstract: A capacitor cover configured to store a plurality of capacitors of a power conversion device is provided. The capacitor cover includes a first cover including a plurality of types of first contact surfaces configured to be in contact with one side of each surface of the capacitors of plurality of types with different sizes.Type: GrantFiled: September 30, 2016Date of Patent: October 23, 2018Assignee: KABUSHIKI KAISHA YASKAWA DENKIInventors: Takayuki Morihara, Yuto Kubo, Shigekatsu Nagatomo
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Patent number: 9985551Abstract: A capacitor module applicable in a matrix convertor includes a module cover and a plurality of terminals. The module cover houses a plurality of AC capacitors. The plurality of terminals are disposed at least on a first side and a second side of the module cover in a widthwise direction of the module cover, and protrude from a bottom surface of the module cover.Type: GrantFiled: June 19, 2015Date of Patent: May 29, 2018Assignee: KABUSHIKI KAISHA YASKAWA DENKIInventors: Takayuki Morihara, Takahiro Uchino, Masahiro Tsuruta, Shigekatsu Nagatomo, Yuto Kubo
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Publication number: 20170077828Abstract: A matrix converter includes a plurality of first bidirectional switches electrically connected to each of input phases of an AC power supply and each of output phases of a load, respectively, and a plurality of second bidirectional switches electrically connected to each of the input phases and each of the output phases, respectively. The first bidirectional switch and the second bidirectional switch are electrically connected in parallel to one of the input phases and one of the output phases.Type: ApplicationFiled: November 4, 2016Publication date: March 16, 2017Applicant: KABUSHIKI KAISHA YASKAWA DENKIInventors: Takayuki MORIHARA, Takahiro UCHINO, Masahiro TSURUTA, Shigekatsu NAGATOMO, Yuto KUBO
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Publication number: 20170018355Abstract: This disclosure discloses a capacitor cover configured to store a plurality of capacitors of a power conversion device. The capacitor cover includes a first cover including a plurality of types of first contact surfaces configured to be in contact with one side of each surface of the capacitors of plurality of types with different sizes.Type: ApplicationFiled: September 30, 2016Publication date: January 19, 2017Applicant: KABUSHIKI KAISHA YASKAWA DENKIInventors: Takayuki MORIHARA, Yuto KUBO, Shigekatsu NAGATOMO
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Publication number: 20150372609Abstract: A capacitor module applicable in a matrix convertor includes a module cover and a plurality of terminals. The module cover houses a plurality of AC capacitors. The plurality of terminals are disposed at least on a first side and a second side of the module cover in a widthwise direction of the module cover, and protrude from a bottom surface of the module cover.Type: ApplicationFiled: June 19, 2015Publication date: December 24, 2015Applicant: KABUSHIKI KAISHA YASKAWA DENKIInventors: Takayuki MORIHARA, Takahiro UCHINO, Masahiro TSURUTA, Shigekatsu NAGATOMO, Yuto KUBO
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Publication number: 20130023165Abstract: An electric motor controller with a screw terminal block including: a terminal fitting connected with a solderless terminal having a crimping portion crimped to wire cores of an electrical wire; a plate-shaped square washer having a cut-out portion in at least one edge thereof, the cut-out portion for avoiding interference with the crimping portion of the solderless terminal or the wire cores projecting from the crimping portion to an end of the electrical wire; and a terminal screw fixing the solderless terminal between the square washer and the terminal fitting.Type: ApplicationFiled: July 3, 2012Publication date: January 24, 2013Applicant: KABUSHIKI KAISHA YASKAWA DENKIInventors: Kenta SASAHARA, Makoto Nakaya, Tomoyo Tohyama, Shigekatsu Nagatomo
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Publication number: 20120262891Abstract: A power converter for converting a direct-current power to an alternating-current power or converting an alternating-current power to a direct-current power, includes a box-shaped housing having a front surface, a rear surface, a left surface, a right surface, an upper surface, a lower surface and an opening formed in the front surface. The power converter further includes a reinforcing member including a first reinforcing member and a second reinforcing member which are provided in an internal space of the housing near the opening to intersect each other, the first reinforcing member joined to the left surface and the right surface of the housing, the second reinforcing member joined to the upper surface and the lower surface of the housing.Type: ApplicationFiled: March 22, 2012Publication date: October 18, 2012Applicant: KABUSHIKI KAISHA YASKAWA DENKIInventor: Shigekatsu NAGATOMO
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Patent number: 7817421Abstract: A motor controller capable of relaxing the temperature of a heat source which generates heat by driving the motor controller, and capable of realizing miniaturization and low price is provided. In a motor controller in which a power semiconductor module (2) which closely contact a heat sink (1) is mounted on a substrate (4), and a fan (6) is attached to the heat sink (1) by a fan case (8), portions of fins (1g) of the heat sink (1) are formed with a bell mouth (1c) and a circular-arc-shaped guide (1h), and the radiating capability of the fins (1g) is improved by effectively using the wind of the fan (6).Type: GrantFiled: August 24, 2007Date of Patent: October 19, 2010Assignee: Kabushiki Kaisha Yaskawa DenkiInventors: Shigekatsu Nagatomo, Koji Nuki
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Patent number: 7679915Abstract: There is provided a motor control apparatus in which a size of the apparatus can easily be reduced, a work for aligning a power semiconductor module with a substrate can be eliminated and an assembling property can be enhanced. In a motor control apparatus in which a power semiconductor module adhering to a heat sink is mounted on a first substrate, a spacer is provided between the heat sink and the substrate and the power semiconductor module is disposed in the spacer. Moreover, an edge part of a hole has such a structure as to block a space between a terminal protruded from a side portion of the power semiconductor module and the heat sink.Type: GrantFiled: August 22, 2005Date of Patent: March 16, 2010Assignee: Kabushiki Kaisha Yaskawa DenkiInventors: Kenji Isomoto, Shuhei Nohara, Shigekatsu Nagatomo
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Publication number: 20080007919Abstract: There is provided a motor control apparatus in which a size of the apparatus can easily be reduced, a work for aligning a power semiconductor module with a substrate can be eliminated and an assembling property can be enhanced. In a motor control apparatus in which a power semiconductor module adhering to a heat sink is mounted on a first substrate, a spacer is provided between the heat sink and the substrate and the power semiconductor module is disposed in the spacer. Moreover, an edge part of a hole has such a structure as to block a space between a terminal protruded from a side portion of the power semiconductor module and the heat sink.Type: ApplicationFiled: August 22, 2005Publication date: January 10, 2008Applicant: Kabushiki Kaisha Yaskawa DenkiInventors: Kenji Isomoto, Shuhei Nohara, Shigekatsu Nagatomo
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Patent number: D455399Type: GrantFiled: November 22, 2000Date of Patent: April 9, 2002Assignee: Kabushiki Kaisha Yaskawa DenkiInventors: Shintaro Imamura, Makoto Kojyo, Kenji Isomoto, Shigekatsu Nagatomo
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Patent number: D561095Type: GrantFiled: April 9, 2007Date of Patent: February 5, 2008Assignee: Kabushiki Kaisha Yaskawa DenkiInventors: Masafumi Sakai, Kenji Isomoto, Shigekatsu Nagatomo, Takayuki Morihara
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Patent number: D562233Type: GrantFiled: April 9, 2007Date of Patent: February 19, 2008Assignee: Kabushiki Kaisha Yaskawa DenkiInventors: Kenji Isomoto, Shigekatsu Nagatomo, Koji Nuki, Takayuki Morihara
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Patent number: D562234Type: GrantFiled: April 9, 2007Date of Patent: February 19, 2008Assignee: Kabushiki Kaisha Yaskawa DenkiInventors: Takayuki Morihara, Shigekatsu Nagatomo, Koji Nuki, Kenji Isomoto