Abstract: A semiconductor device includes a semiconductor chip, a circuit board, a heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.

Abstract: A region of a sealing part is effectively utilized. -A semiconductor device includes a semiconductor element, a substrate, a sealing part, and a cavity region. The substrate included in this semiconductor device is disposed adjacent to a bottom surface of the semiconductor element. The sealing part included in this semiconductor device is formed in a shape that covers an upper surface that is a surface facing the bottom surface of the semiconductor element, and seals the semiconductor element. The cavity region included in this semiconductor device is a region disposed in the sealing part and formed with a cavity.

Abstract: Deformation of a semiconductor chip is to be prevented in a semiconductor device in which a heat releasing plate and a circuit board are disposed. The semiconductor device includes the semiconductor chip, the circuit board, the heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.

Abstract: To provide a substrate device, an electronic apparatus, and a method for manufacturing a substrate device that can make large the gap between a semiconductor substrate and a wiring substrate by making the height of a solder ball high. A substrate device includes a substrate; an electrical connection unit provided on the substrate; a metal post provided on the electrical connection unit; and a metal film that is provided in one body from a tip surface to at least part of a side surface of the metal post and of which wettability to a solder material is lower than wettability to the solder material of the metal post.

Abstract: [Object] To provide a substrate device, an electronic apparatus, and a method for manufacturing a substrate device that can make large the gap between a semiconductor substrate and a wiring substrate by making the height of a solder ball high. [Solution] A substrate device includes: a substrate; an electrical connection unit provided on the substrate; a metal post provided on the electrical connection unit; and a metal film that is provided in one body from a tip surface to at least part of a side surface of the metal post and of which wettability to a solder material is lower than wettability to the solder material of the metal post.