Abstract: It is an object of the present invention to provide a thermally conductive sheet that is excellent in thermally conductive property, has insulation property, has a low permittivity, and is excellent in designability. The thermally conductive sheet 1 comprises a binder component 11, titanium oxide, titanium nitride, and a thermally conductive filler 12 other than these, and a ratio of the titanium oxide to the total of the titanium oxide and the titanium nitride is 20 to 90% by mass. An L* value of a surface of the thermally conductive sheet 1 in the L*a*b* color system is preferably 41 or less. The total content of the titanium oxide and the titanium nitride is preferably 0.3 to 10.0 parts by mass based on the total amount 100 parts by mass of the thermally conductive filler 12.

Abstract: A method of writing identifying information comprises: the step of forming a metal film on a wafer; the step of forming a resist layer on the metal film; the step of exposing the resist layer by projecting a pattern for an alignment mark on the resist layer; the first development step of developing the resist layer; the step of exposing the resist layer by projecting a pattern for the identifying information onto the resist layer using the pattern formed in the resist layer in the first development step as a reference of a location; the second development step of developing the resist layer; the step of selectively etching the metal film using the resist layer as an etching mask; and removing the resist layer.

Abstract: A method of writing identifying information comprises: the step of forming a metal film on a wafer; the step of forming a resist layer on the metal film; the step of exposing the resist layer by projecting a pattern for an alignment mark on the resist layer; the first development step of developing the resist layer; the step of exposing the resist layer by projecting a pattern for the identifying information onto the resist layer using the pattern formed in the resist layer in the first development step as a reference of a location; the second development step of developing the resist layer; the step of selectively etching the metal film using the resist layer as an etching mask; and removing the resist layer.

Abstract: In forming a second pole portion and a second yoke portion independently, after a first magnetic film, a gap film, a coil film, an insulating film and a second pole portion are formed, a plate underfilm M1 is formed on their exposed surfaces. Then, a negative type resistfilm is applied on the plate underfilm M1, and exposed and developed to fabricate a resistframe ton define a pattern for a second yoke portion. Then, a plate film to constitute a second yoke portion is formed.