Patents by Inventor Shigekazu UMEMURA

Shigekazu UMEMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240150638
    Abstract: It is an object of the present invention to provide a thermally conductive sheet that is excellent in thermally conductive property, has insulation property, has a low permittivity, and is excellent in designability. The thermally conductive sheet 1 comprises a binder component 11, titanium oxide, titanium nitride, and a thermally conductive filler 12 other than these, and a ratio of the titanium oxide to the total of the titanium oxide and the titanium nitride is 20 to 90% by mass. An L* value of a surface of the thermally conductive sheet 1 in the L*a*b* color system is preferably 41 or less. The total content of the titanium oxide and the titanium nitride is preferably 0.3 to 10.0 parts by mass based on the total amount 100 parts by mass of the thermally conductive filler 12.
    Type: Application
    Filed: March 11, 2022
    Publication date: May 9, 2024
    Inventors: Yuusuke HARUNA, Hiroshi TAJIMA, Shigekazu UMEMURA, Kanoe KOMATSU, Yuu IIHARA, Junichi KINOSHITA, Kiyoshi IWAI
  • Patent number: 10577524
    Abstract: Provided herein is a conductive adhesive composition containing: a thermosetting resin having a functional group reactive with an epoxy group; an epoxy resin; a conductive filler; and urethane resin particles having a mean particle diameter of 4 ?m or more and 13 ?m or less and a hardness of 55 or more and 90 or less measured by a type A durometer in conformity with JIS K6253.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: March 3, 2020
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Yoshihisa Yamamoto, Shigekazu Umemura
  • Publication number: 20190106607
    Abstract: Provided herein is a conductive adhesive composition containing: a thermosetting resin having a functional group reactive with an epoxy group; an epoxy resin; a conductive filler; and urethane resin particles having a mean particle diameter of 4 ?m or more and 13 ?m or less and a hardness of 55 or more and 90 or less measured by a type A durometer in conformity with JIS K6253.
    Type: Application
    Filed: May 23, 2017
    Publication date: April 11, 2019
    Inventors: Yoshihisa YAMAMOTO, Shigekazu UMEMURA