Abstract: A multilayer wiring board having a high degree of freedom of wiring design and realizing high-density wiring, and a method to simply manufacture the multilayer wiring board is provided. A core substrate with two or more wiring layers provided thereon through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically connected to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 ?m. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer. A first wiring layer provided through an electrical insulating layer on the core substrate is connected to the electroconductive material filled into the throughhole through via.

Abstract: A multilayer wiring board having a high degree of freedom of wiring design and realizing high-density wiring, and a method to simply manufacture the multilayer wiring board is provided. A core substrate with two or more wiring layers provided thereon through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically connected to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 ?m. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer. A first wiring layer provided through an electrical insulating layer on the core substrate is connected to the electroconductive material filled into the throughhole through via.

Abstract: A multilayer wiring board having a high degree of freedom of wiring design and realizing high-density wiring, and a method to simply manufacture the multilayer wiring board is provided. A core substrate with two or more wiring layers provided thereon through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically connected to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 ?m. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer. A first wiring layer provided through an electrical insulating layer on the core substrate is connected to the electroconductive material filled into the throughhole through via.

Abstract: A multilayer wiring board has a high degree of freedom of wiring design and can realize high-density wiring, and a method to simply manufacture the multilayer wiring board. A core substrate with two or more wiring layers provided thereon through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically conducted to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 ?m. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer. A first wiring layer provided through an electrical insulating layer on the core substrate is connected to the electroconductive material filled into the throughhole through via.

Abstract: A multilayer wiring board has a high degree of freedom of wiring design and can realize high-density wiring, and a method to simply manufacture the multilayer wiring board. A core substrate with two or more wiring layers provided thereon through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically conducted to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 ?m. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer. A first wiring layer provided through an electrical insulating layer on the core substrate is connected to the electroconductive material filled into the throughhole through via.

Abstract: A multilayer wiring board has a high degree of freedom of wiring design and can realize high-density wiring, and a method to simply manufacture the multilayer wiring board. A core substrate with two or more wiring layers provided thereon through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically conducted to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 ?m. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer. A first wiring layer provided through an electrical insulating layer on the core substrate is connected to the electroconductive material filled into the throughhole through via.

Abstract: A multilayer wiring board has a high degree of freedom of wiring design and can realize high-density wiring, and a method to simply manufacture the multilayer wiring board. A core substrate with two or more wiring layers provided thereon through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically conducted to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 ?m. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer. A first wiring layer provided through an electrical insulating layer on the core substrate is connected to the electroconductive material filled into the throughhole through via.

Abstract: Disclosed is a method for manufacturing an electroconductive material-filled throughhole substrate that is free from any void part in the electroconductive material filled into the throughholes. The method comprises forming an electroconductive base layer on one side of a core substrate having throughholes, and precipitating and growing an electroconductive material from one direction within the throughholes by electroplating using the electroconductive base layer as a seed layer to fill the electroconductive material into the throughholes without forming any void part and thus to manufacture an electroconductive material-filled throughhole substrate.

Abstract: Disclosed is a method for manufacturing an electroconductive material-filled throughhole substrate that is free from any void part in the electroconductive material filled into the throughholes. The method comprises forming an electroconductive base layer on one side of a core substrate having throughholes, and precipitating and growing an electroconductive material from one direction within the throughholes by electroplating using the electroconductive base layer as a seed layer to fill the electroconductive material into the throughholes without forming any void part and thus to manufacture an electroconductive material-filled throughhole substrate.

Abstract: Disclosed is a method for manufacturing an electroconductive material-filled throughhole substrate that is free from any void part in the electroconductive material filled into the throughholes. The method comprises forming an electroconductive base layer on one side of a core substrate having throughholes, and precipitating and growing an electroconductive material from one direction within the throughholes by electroplating using the electroconductive base layer as a seed layer to fill the electroconductive material into the throughholes without forming any void part and thus to manufacture an electroconductive material-filled throughhole substrate.

Abstract: Disclosed are a multilayer wiring board, which has a high degree of freedom of wiring design and can realize high-density wiring, and a method which can simply manufacture the multilayer wiring board. The multilayer wiring board comprises a core substrate and two or more wiring layers provided on the core substrate through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically conducted to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 ?m. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer.

Abstract: Disclosed are a multilayer wiring board, which has a high degree of freedom of wiring design and can realize high-density wiring, and a method which can simply manufacture the multilayer wiring board. The multilayer wiring board comprises a core substrate and two or more wiring layers provided on the core substrate through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically conducted to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 ?m. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer.

Abstract: Disclosed is a method for manufacturing an electroconductive material-filled throughhole substrate that is free from any void part in the electroconductive material filled into the throughholes. The method comprises forming an electroconductive base layer on one side of a core substrate having throughholes, and precipitating and growing an electroconductive material from one direction within the throughholes by electroplating using the electroconductive base layer as a seed layer to fill the electroconductive material into the throughholes without forming any void part and thus to manufacture an electroconductive material-filled throughhole substrate.

Abstract: Disclosed are a multilayer wiring board, which has a high degree of freedom of wiring design and can realize high-density wiring, and a method which can simply manufacture the multilayer wiring board. The multilayer wiring board comprises a core substrate and two or more wiring layers provided on the core substrate through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically conducted to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 ?m. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer.

Abstract: A thermal transfer film comprises a coloring layer formed on a substrate film via an intermediate layer, wherein the intermediate layer contains a thermally fusible substance and a non-transferable binder resin, the melt viscosity of the thermally fusible substance in the temperature range 15 to 25° C. higher than the fuse peak temperature of the thermally fusible substance is in the range of 100 to 1000 mPa·s, the fuse peak temperature of the thermally fusible substance is in the range of 50 to 110° C., the crystallization peak temperature of the thermally fusible substance is in the range of ?20 to 100 ° C., the crystallization peak temperature of the thermally fusible substance is lower than the fuse peak temperature by 10° C. or more, and the softening temperature of the binder resin measured by the ring and ball method is in the range of 130 to 400° C. This thermal transfer film is capable of forming a printed product with a good printing quality.

Abstract: An antistatic coat of the present invention coats a surface of a base body so as to prevent accumulation of electric charges in the base body, the antistatic coat having a multi-layers structure comprising at least one antistatic layer, and the antistatic layer being disposed between the base body and an outermost surface layer of the antistatic coat. On the back surface side of a thermal transfer sheet, there is formed a heat resistant slip layer through an antistatic layer, or a heat resistant slip layer containing a conductive material. Sulfonated polyaniline, a conductive carbon black having primary particle size of up to 40 nm and specific surface of at least 130 m2/g, and a conductive carbon black having an oil absorption of at least 75 ml/100 g are favorable conductive material.

Abstract: A thermal transfer film comprises a coloring layer formed on a substrate film via an intermediate layer, wherein the intermediate layer contains a thermally fusible substance and a non-transferable binder resin, the melt viscosity of the thermally fusible substance in the temperature range 15 to 25° C. higher than the fuse peak temperature of the thermally fusible substance is in the range of 100 to 1000 mPa·s, the fuse peak temperature of the thermally fusible substance is in the range of 50 to 110° C., the crystallization peak temperature of the thermally fusible substance is in the range of −20 to 100 ° C., the crystallization peak temperature of the thermally fusible substance is lower than the fuse peak temperature by 10° C. or more, and the softening temperature of the binder resin measured by the ring and ball method is in the range of 130 to 400 ° C. This thermal transfer film is capable of forming a printed product with a good printing quality.

Abstract: The present invention is for providing a thermal transfer film capable of providing a vivid print without generation of a void, and an image forming method using the same. The thermal transfer film comprises a coloring layer formed on a substrate film via an intermediate layer, wherein the intermediate layer comprises materials according to either one of the following combinations: (1) a polycaprolactone resin having a 100-1,000 mPa·s melt viscosity at 75° C., and a binder resin having a 130-400° C. extrapolation fuse starting temperature; (2) a thermally fusible substance having a 100-1,000 mPa·s melt viscosity at 75° C., and a binder resin having a 150-400° C. extrapolation fuse starting temperature, (3) a polycaprolactone resin having a 100-1,000 mPa·s melt viscosity at 75° C., and a non-transferable binder resin having a 130-400° C. softening temperature; and (4) a thermally fusible substance having a 100-1,000 mPa·s melt viscosity at 75° C.

Abstract: A thermal transfer film comprises a coloring layer formed on a substrate film via an intermediate layer, wherein the intermediate layer contains a thermally fusible substance and a non-transferable binder resin, the melt viscosity of the thermally fusible substance in the temperature range 15 to 25° C. higher than the fuse peak temperature of the thermally fusible substance is in the range of 100 to 1000 mPa·s, the fuse peak temperature of the thermally fusible substance is in the range of 50 to 110° C., the crystallization peak temperature of the thermally fusible substance is in the range of −20 to 100° C., the crystallization peak temperature of the thermally fusible substance is lower than the fuse peak temperature by 10° C. or more, and the softening temperature of the binder resin measured by the ring and ball method is in the range of 130 to 400° C. This thermal transfer film is capable of forming a printed product with a good printing quality.

Abstract: The present invention is for providing a thermal transfer film capable of providing a vivid print without generation of a void, and an image forming method using the same. The thermal transfer film comprises a coloring layer formed on a substrate film via an intermediate layer, wherein the intermediate layer comprises materials according to either one of the following combinations: (1) a polycaprolactone resin having a 100-1,000 mPa·s melt viscosity at 75° C., and a binder resin having a 130-400° C. extrapolation fuse starting temperature; (2) a thermally fusible substance having a 100-1,000 mPa·s melt viscosity at 75° C., and a binder resin having a 150-400° C. extrapolation fuse starting temperature, (3) a polycaprolactone resin having a 100-1,000 mPa·s melt viscosity at 75° C., and a non-transferable binder resin having a 130-400° C softening temperature; and (4) a thermally fusible substance having a 100-1,000 mPa·s melt viscosity at 75° C.