Patents by Inventor Shigeki Kawano
Shigeki Kawano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145929Abstract: A frequency selective reflector including a reflecting member reflecting the electromagnetic waves; and a dielectric layer that: is disposed at an incident side of the electromagnetic waves with respect to the reflecting member; includes a concave and convex structure in which a plurality of a unit structure including a thickness distribution of increasing thickness in a predetermined direction is arranged; and transmits the electromagnetic waves, wherein the unit structure of the dielectric layer includes a plurality of cell regions of which thickness differs from one another; the dielectric layer includes, as the unit structure, at least a first unit structure including three or more of the cell regions of which thickness differs from one another; and a reflection direction of the electromagnetic waves is controlled by controlling a relative reflection phase distribution of the electromagnetic waves by the thickness distribution of the dielectric layer.Type: ApplicationFiled: March 4, 2022Publication date: May 2, 2024Applicant: DAI NIPPON PRINTING CO., LTDInventors: Yuichi MIYAZAKI, Hiroyuki ASAKURA, Atsuo NAKAMURA, Takeshi SEKIGUCHI, Shigeki KAWANO
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Patent number: 8308967Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.Type: GrantFiled: January 13, 2011Date of Patent: November 13, 2012Assignee: Dai Nippon Printing Co., Ltd.Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
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Patent number: 8252423Abstract: There is provided a resin laminate having a layer construction of a first inorganic material layer/insulating layer/second inorganic material layer or a layer construction of an inorganic material layer/insulating layer, wherein the insulating layer has a multi-layer structure of two or more resin layers of a core insulating layer and an adhesive insulating layer. In this case, the resin laminate has the adhesive insulating layer which can realize optimal etching, is suitable for etching by a wet process, and has excellent adhesion. At least one of the layers constituting the insulating layer is formed of a polyimide resin which comprises repeating units represented by formula (1) and has a glass transition point of 150 to 360° C. and is dissolvable in a basic solution at a rate of more than 3 ?m/min, preferably more than 5 ?m/min, and most preferably more than 8 ?m/min.Type: GrantFiled: October 25, 2010Date of Patent: August 28, 2012Assignee: Dai Nippon Printing Co., Ltd.Inventors: Katsuya Sakayori, Shigeki Kawano, Hiroko Amasaki, Hidetsugu Tazawa, Kazunari Ikeda, Kouhei Ohno
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Patent number: 8208226Abstract: It is a primary object of the present invention to provide a suspension substrate having reduced strain. The present invention solves the problem by providing a suspension substrate comprising: a fundamental structure in which a metal substrate, a first insulation layer, and a wiring are laminated in this order; a wide wiring laminate structure provided with a wide wiring first insulation part of the first insulation layer, a first wide wiring formed on the wide wiring first insulation part, a second insulation part formed on the first wide wiring, and a second wide wiring formed on the second insulation part; and a narrow wiring-containing structure provided with a narrow wiring first insulation part of the first insulation layer and a first narrow wiring formed on the narrow wiring first insulation part, wherein the narrow wiring-containing structure is provided with a strain-limiting part formed to limit strain generated in relation to the wide wiring laminate structure.Type: GrantFiled: October 27, 2009Date of Patent: June 26, 2012Assignee: Dai Nippon Printing Co., Ltd.Inventor: Shigeki Kawano
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Patent number: 8066891Abstract: The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.Type: GrantFiled: October 6, 2006Date of Patent: November 29, 2011Assignee: Dai Nippon Printing Co., Ltd.Inventors: Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Shigeki Kawano, Michiaki Uchiyama, Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose
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Publication number: 20110108519Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.Type: ApplicationFiled: January 13, 2011Publication date: May 12, 2011Applicant: Dai Nippon Printing Co., Ltd.Inventors: Katsuya SAKAYORI, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
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Publication number: 20110076855Abstract: There is provided a resin laminate having a layer construction of a first inorganic material layer/insulating layer/second inorganic material layer or a layer construction of an inorganic material layer/insulating layer, wherein the insulating layer has a multi-layer structure of two or more resin layers of a core insulating layer and an adhesive insulating layer. In this case, the resin laminate has the adhesive insulating layer which can realize optimal etching, is suitable for etching by a wet process, and has excellent adhesion. At least one of the layers constituting the insulating layer is formed of a polyimide resin which comprises repeating units represented by formula (1) and has a glass transition point of 150 to 360° C. and is dissolvable in a basic solution at a rate of more than 3 ?m/min, preferably more than 5 ?m/min, and most preferably more than 8 ?m/min.Type: ApplicationFiled: October 25, 2010Publication date: March 31, 2011Applicant: Dai Nippon Printing Co., Ltd.Inventors: Katsuya SAKAYORI, Shigeki KAWANO, Hiroko AMASAKI, Hidetsugu TAZAWA, Kazunari IKEDA, Kouhei OHNO
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Publication number: 20100142097Abstract: It is a primary object of the present invention to provide a suspension substrate having reduced strain. The present invention solves the problem by providing a suspension substrate comprising: a fundamental structure in which a metal substrate, a first insulation layer, and a wiring are laminated in this order; a wide wiring laminate structure provided with a wide wiring first insulation part of the first insulation layer, a first wide wiring formed on the wide wiring first insulation part, a second insulation part formed on the first wide wiring, and a second wide wiring formed on the second insulation part; and a narrow wiring-containing structure provided with a narrow wiring first insulation part of the first insulation layer and a first narrow wiring formed on the narrow wiring first insulation part, wherein the narrow wiring-containing structure is provided with a strain-limiting part formed to limit strain generated in relation to the wide wiring laminate structure.Type: ApplicationFiled: October 27, 2009Publication date: June 10, 2010Applicant: Dai Nippon Printing Co., Ltd.Inventor: Shigeki KAWANO
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Patent number: 7226806Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer—insulating layer—second inorganic material layer or a layer construction of inorganic material layer—insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.Type: GrantFiled: February 14, 2002Date of Patent: June 5, 2007Assignee: Dai Nippon Printing Co., Ltd.Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
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Publication number: 20070120229Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable byawet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer—insulating layer—second inorganic material layer or a layer construction of inorganic material layer—insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.Type: ApplicationFiled: January 25, 2007Publication date: May 31, 2007Applicant: Dai Nippon Printing Co., Ltd.Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
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Publication number: 20070026678Abstract: The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.Type: ApplicationFiled: October 6, 2006Publication date: February 1, 2007Applicant: Dai Nippon Printing Co., Ltd.Inventors: Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Shigeki Kawano, Michiaki Uchiyama, Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose
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Publication number: 20060073316Abstract: This invention relates to an HDD suspension and a process for its manufacture with high productivity and reliability. The HDD suspension of this invention is manufactured from a laminate composed of a stainless steel substrate, an insulating resin layer and a metal foil by wet-etching the laminate by the use of a basic fluid. The insulating layer of the laminate is composed of plural layers of polyimide, every constituent layer exhibits a mean etching rate of 0.5 ?M/min or more by a 50 wt % aqueous solution of KOH at 80° C., the layers in contact with the stainless steel substrate and the metal foil are those of polyimide (B) exhibiting a glass transition temperature of 300° C. or less and the adhesive strength between the layer of polyimide (B) and either the stainless steel substrate or the metal foil is 0.5 kN/m or more.Type: ApplicationFiled: October 20, 2005Publication date: April 6, 2006Inventors: Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose, Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Michiaki Uchiyama, Shigeki Kawano
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Patent number: 6942817Abstract: A wireless suspension blank is made using a two-layer laminate composed of a metallic layer with the spring property and an electrically insulating layer. The first method includes a first step for working the metallic layer by the photo etching method, a second step for forming a wiring part on the insulating layer by the semi-additive method and a third step for working the insulating layer by the wet-etching method. The second method includes a first step for working the metallic layer by the photo etching method, a second step for forming a wiring part on the insulating layer by the semi-additive method and a third step for working the insulating layer by the plasma etching method. The third method includes a first step for forming a wiring part on the metallic layer by the semi-additive method, a second step for working the metallic layer by the wet-etching method and a third step for working the insulating layer by the dry-etching method or the wet-etching method.Type: GrantFiled: March 21, 2001Date of Patent: September 13, 2005Assignee: Dainippon Printing Co., Ltd.Inventors: Hiroshi Yagi, Shigeki Kawano, Kazuo Umeda, Jiro Takei, Yukio Iimura, Satoshi Sasaki, Katsuya Sakayori, Hiroko Amasaki
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Patent number: 6750148Abstract: A method of manufacturing a wireless suspension blank wherein three-layered laminate formed of a metallic layer having a spring property and a conductive layer laminated on the metallic layer through an electrically insulating layer are used. The laminate used is a laminate in which an insulating layer is formed of a core-insulating layer and adhesive layers laminated on both sides of the core-insulating layer, and the ratio of higher etching rate to lower etching rate of the respective layers of the insulating layer is between 6:1 and 1:1. The metallic layer and the conductive layer are processed by the photo etching method. The insulating layer is processed by the wet etching method.Type: GrantFiled: July 6, 2001Date of Patent: June 15, 2004Assignee: Dainippon Printing Co., Ltd.Inventors: Katsuya Sakayori, Shigeki Kawano, Hiroko Amasaki, Kazuo Umeda, Satoshi Sasaki, Hiroshi Yagi
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Publication number: 20040096676Abstract: The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.Type: ApplicationFiled: August 15, 2003Publication date: May 20, 2004Inventors: Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Shigeki Kawano, Michiaki Uchiyama, Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose
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Patent number: 6709988Abstract: The present invention relates to a production process which, in the production of an electronic component by wet etching of an insulating layer in a laminate, is low in cost, does not use any organic solvent, which poses a problem of waste treatment. The production process of an electronic component comprises the steps of: wet etching a laminate of conductive inorganic material layer—insulating layer—conductive inorganic material layer or a laminate of conductive inorganic material layer—insulating layer to pattern the conductive inorganic material layer; and then performing wet etching to pattern the insulating layer. The patterning of the insulating layer by wet etching is carried out in a continuous form using a dry film resist; and, the dry film resist is laminated by roll pressing onto the laminate under a reduced pressure of not more than 80 KPa.Type: GrantFiled: March 28, 2002Date of Patent: March 23, 2004Assignee: Dai Nippon Printing Co., Ltd.Inventors: Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Shigeki Kawano, Hiroko Amasaki, Michiaki Uchiyama, Hiroshi Yagi
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Publication number: 20040043232Abstract: A laminate having a layer structure of first inorganic layer-insulating layer-second inorganic layer or inorganic layer-insulating layer, characterized in that the insulating layer comprises two or more resin layers containing a core insulating layer and an adhesive insulating layer, and at least one layer constituting the insulating layer comprises a polyimide resin which has a recurring unit represented by the general formula (1), has a glass transition temperature of 150° C. to 360° C., and exhibits a rate of dissolution in a basic solution of 3 &mgr;/min or more, preferably 5 ?m/min or more, most preferably 8 &mgr;/min or more.Type: ApplicationFiled: February 21, 2002Publication date: March 4, 2004Inventors: Katsuya Sakayori, Shigeki Kawano, Hiroko Amasaki, Hidetsugu Tazawa, Kazunari Ikeda, Kouhei Ohno
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Patent number: 6697836Abstract: A client (referred to as A) transmits a request to a service mediate server (referred to as B) through a communication medium. B receives information. A server (referred to as C) receives a request for obtaining information from B and transmits information requested by B. B receives a request from A. A service mediate managing unit determines a type of information to be provided to A, based on the attribute information of the content of the request, the customized information of A and C pre-stored in the service mediate managing unit, and various status at the receipt of the request. The service mediate agent selects any one of plural Cs and transmit the request for obtaining information to the selected C. The information received by C is processed by the service mediate agent and the processed information is transmitted to A.Type: GrantFiled: September 16, 1998Date of Patent: February 24, 2004Assignee: Hitachi, Ltd.Inventors: Shigeki Kawano, Junichi Toyouchi, Motohisa Funabashi, Masanori Kataoka, Katsumi Kawano, Linda Strick
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Publication number: 20030085451Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer—insulating layer—second inorganic material layer or a layer construction of inorganic material layer—insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.Type: ApplicationFiled: June 10, 2002Publication date: May 8, 2003Applicant: Dai Nippon Printing Co., Ltd.Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
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Publication number: 20030052078Abstract: The present invention relates to a production process which, in the production of an electronic component by wet etching of an insulating layer in a laminate, is low in cost, does not use any organic solvent, which poses a problem of waste treatment, and can produce the electronic component with high accuracy and with significantly increased productivity.Type: ApplicationFiled: March 28, 2002Publication date: March 20, 2003Applicant: Dai Nippon Printing Co., Ltd.Inventors: Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Shigeki Kawano, Hiroko Amasaki, Michiaki Uchiyama, Hiroshi Yagi