Abstract: A composite member includes a substrate composed of a composite material containing a metal and a non-metal. One surface of the substrate has spherical warpage of which radius of curvature R is not smaller than 5000 mm and not greater than 35000 mm. A sphericity error is not greater than 10.0 ?m, the sphericity error being defined as an average distance between a plurality of measurement points on a contour of a warped portion of the substrate and approximate arcs defined by the plurality of measurement points. The substrate has a thermal conductivity not lower than 150 W/m·K and a coefficient of linear expansion not greater than 10 ppm/K.

Abstract: A composite member includes a substrate composed of a composite material containing a metal and a non-metal. One surface of the substrate has spherical warpage of which radius of curvature R is not smaller than 5000 mm and not greater than 35000 mm. A sphericity error is not greater than 10.0 ?m, the sphericity error being defined as an average distance between a plurality of measurement points on a contour of a warped portion of the substrate and approximate arcs defined by the plurality of measurement points. The substrate has a thermal conductivity not lower than 150 W/m·K and a coefficient of linear expansion not greater than 10 ppm/K.

Abstract: A magnesium-based composite member is provided with a through hole through which a fastening member for attachment to a fixing target is to be inserted. A substrate is provided with a substrate hole through which the fastening member is to be inserted, and made of a composite material which is a composite of SiC and a matrix metal which is any of magnesium and a magnesium alloy. A receiving portion is attached to the substrate and made of a metal material different from the matrix metal. The receiving portion is provided with a receiving portion hole through which the fastening member is to be inserted, and at least a part of an inner circumferential surface of the through hole is formed from an inner circumferential surface of the receiving portion hole.

Abstract: A composite member has a substrate made of a composite material having SiC combined with magnesium or a magnesium alloy, and has a warpage degree of not less than 0.01×10?3 and not more than 10×10?3, the warpage degree being defined as lmax/Dmax, where lmax being a difference between a maximum value and a minimum value of surface displacement of one surface of composite member measured along a longest side thereof, and Dmax being a length of the longest side. Thereby, a composite member capable of efficiently dissipating heat to an installation object, a heat-dissipating member using the composite member, and a semiconductor device having the heat-dissipating member are provided.

Abstract: A hydroponic cultivation kit enables taking a plant seedling, intact in its planting soil, out of a growth pot and replanting it. Within a growth pot prepared in advance, a plant seedling or the like planted in soil is taken out of the growth pot together with the soil and cultivated in a culture solution. The hydroponic cultivation kit is furnished with: foam stone for surrounding the soil periphery of the plant taken out from the growth pot; a retaining mesh pot for retaining the plant with its soil periphery surrounded by the foam stone; and a buoyant member for floating the mesh pot in culture solution inside a water-tank unit. The mesh pot has perforations such as to prohibit the foam stone from passing through it, yet meanwhile permit passage of roots jutting out from the plant.

Abstract: A composite member has a substrate made of a composite material having SiC combined with magnesium or a magnesium alloy, and has a warpage degree of not less than 0.01×10?3 and not more than 10×10?3, the warpage degree being defined as lmax/Dmax, where lmax being a difference between a maximum value and a minimum value of surface displacement of one surface of composite member measured along a longest side thereof, and Dmax being a length of the longest side. Thereby, a composite member capable of efficiently dissipating heat to an installation object, a heat-dissipating member using the composite member, and a semiconductor device having the heat-dissipating member are provided.

Abstract: A magnesium-based composite member is provided with a through hole through which a fastening member for attachment to a fixing target is to be inserted. A substrate is provided with a substrate hole through which the fastening member is to be inserted, and made of a composite material which is a composite of SiC and a matrix metal which is any of magnesium and a magnesium alloy. A receiving portion is attached to the substrate and made of a metal material different from the matrix metal. The receiving portion is provided with a receiving portion hole through which the fastening member is to be inserted, and at least a part of an inner circumferential surface of the through hole is formed from an inner circumferential surface of the receiving portion hole.

Abstract: Provided are a heat spreader for a semiconductor device, which can be joined such that a multitude of pin-shaped fins are not easily fractured even when the heat spreader for a semiconductor device is incorporated in a heat dissipation structure for a semiconductor device, in which direct cooling is performed by using water, and a method for manufacturing the heat spreader for a semiconductor device. The heat spreader (1) for a semiconductor device comprises: a plurality of columnar members (13) joined onto at least one of surfaces of a plate-like member (11, 12) by stud welding; and a joining layer (14) formed between the plate-like member (11, 12) and the columnar members (13). The plate-like member (11, 12) includes a base material (11) and surface layers (12). The surface layers (12) and the columnar members (13) are made of a material containing aluminum or an aluminum alloy. A thickness of the plate-like member (11, 12) is 0.5 mm through 6 mm and a thickness of each of the surface layers (12) is 0.

Abstract: Disclosed is a technique for setting a body frame for a pattern and collectively deleting an area located outside the body frame. Consecutive codes can be assigned to scanned patterns.

Abstract: Editing of a displayed image is performed with simple operations. The editing is made by specifying an edit-start and edit-end points in an edit area of a displayed image, designating a movement area and movement destination based on the edit-start and edit-end points, designating a copy area and copy destination based on the edit-start and edit-end points, then moving the movement area to the movement destination and copying the copy area at the copy destination.

Abstract: An image process is performed using a computer, without needing any special knowledge by a user. First, when a picture on a screen is designated and inputted by an input unit, a check is made to determine if an input figure name corresponding to the input figure is defined in a first table stored in a memory. When it is judged that the input figure name is defined, a setting method of a value of a variable in the first table is determined. On the basis of the determined setting method, the value is set into the variable shown by the variable name in the first table. A check is made to determine if a figure shown by a connected figure name which is defined in a second table stored in the same memory as that of the first table, and is interlocked with the variable shown by the variable name exists on a screen. When it is judged that such a figure exists, the figure shown by the connected figure name is edited and displayed on the basis of the display type in the second table.

Abstract: A figure pattern is processed by modifying a point array that forms the figure pattern. The modification may include moving the points of the array, inserting points into the array, deleting points of the array, and changing the attributes of the points or the point array. According to one arrangement, a sample point of an array forming the outline of a figure pattern is designated for deletion and a figure pattern corresponding to the sample point array is generated on the basis of an attribute of sample points adjacent to the sample point designated for deletion.

Abstract: A change in magnification of a figure pattern within a predetermined area is performed by designating a desired rectangular frame or one point on a screen, A plurality of menus associated with figure processes are performed by interruption,