Abstract: A laminate for forming a packaging bag including a substrate layer containing a crystalline polyester film, an adhesive layer, and a sealant layer containing the polyester film arranged in this order. The sealant layer has a ratio of a fracture elongation thereof to a thickness thereof which is 13%/um or less. The fracture elongation is a fracture elongation of the sealant layer as measured in a unit of 15mm width thereof in an MD direction.

Abstract: A laminate for forming a packaging bag, in sequence: a substrate layer; an adhesive layer; and a sealant layer, wherein the sealant layer includes a first polyester film having a crystallinity of 20 to 50% based on a first absorbance at a first wavenumber of 1409 cm?1, a second absorbance at a second wavenumber of 1370 cm?1, a third absorbance at a third wavenumber of 1340 cm?1, a first constant, and a second constant, the first to third absorbances and the first and second constants being determined based on FT-IR analysis, which uses a reflection method, on at least the first polyester film, the crystallinity of the first polyester film being expressed in accordance with the following formulas (1) and (2): I1409=p1×I1340+p2×I1370 . . . (Formula 1) and C=p1×(I1340/I1409)×100 . . . (Formula 2).

Abstract: The present disclosure relates to a method for selecting a polyester film in which the polyester film is used as a sealant layer in a multilayer body including a base material layer including a crystalline polyester film, an adhesive layer and a sealant layer in this order, the method including: a step in which FT-IR analysis is performed on the polyester film by a reflection method, and the crystallinity of the polyester film is measured by the following formula; and a step in which a first polyester film having a crystallinity of 2 to 15% is selected: I1409=p1×I1340+p2×I1370??(Formula 1) Crystallinity[%]=p1×(I1340/I1409)×100??(Formula 2)

Abstract: A packaging is provided including: a base layer including at least one layer of a biaxially oriented resin film; and a sealant layer including at least a first thermoplastic resin layer and a second thermoplastic resin layer, in which the base layer, the first thermoplastic resin laser, and the second thermoplastic resin layer are laminated in this order, a density of a first resin forming the first thermoplastic resin layer is higher than a density of a second resin forming the second thermoplastic resin layer, the density of the first resin is 0.90 g/cm3 or higher, the density of the second resin is 0.92 g/cm3 or lower, and the second thermoplastic resin layer contains 200 to 2000 ppm of a lubricant including at least one of a fatly acid amide lubricant and a fatty acid ester lubricant.

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract: A packaging is provided including: a base layer including at least one layer of a biaxially oriented resin film; and a sealant layer including at least a first thermoplastic resin layer and a second thermoplastic resin layer, in which the base layer, the first thermoplastic resin laser, and the second thermoplastic resin layer are laminated in this order, a density of a first resin forming the first thermoplastic resin layer is higher than a density of a second resin forming the second thermoplastic resin layer, the density of the first resin is 0.90 g/cm3 or higher, the density of the second resin is 0.92 g/cm3 or lower, and the second thermoplastic resin layer contains 200 to 2000 ppm of a lubricant including at least one of a fatly acid amide lubricant and a fatty acid ester lubricant.

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract: An inverted-F antenna includes a ground member, a first antenna member including a short-circuit portion rising perpendicularly from the ground member while being electrically coupled with the ground member, a flat plate portion extending from a top end of the short-circuit portion while being electrically coupled with the short-circuit portion, and a protrusion portion protruding from a part of an end of the flat plate portion; and a second antenna member including a conductor pattern that includes a power supply portion at one end portion thereof, has a width increasing toward an opposite end, and is electrically coupled with the flat plate portion. The second antenna member is located between the ground member and the flat plate portion with a predetermined distance from an end of the flat plate portion opposite to the protrusion portion.

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract: A TV antenna apparatus for vehicles of the present invention includes a plurality of sheet antennas serving as an antenna element which is obtained by forming a foil having a specific pattern on a base sheet constituted of a flexible insulating film, adhering means for adhering the plurality of sheet antennas to respective positions of front and rear nonconductive members of a vehicle body, such as inner right and left sides of front and rear bumpers of nonconductive members of the vehicle body, and feeders for connecting the plurality of sheet antennas adhered by the adhering means, to a TV set in a four-channel diversity system.