Patents by Inventor Shigeki Mashimo

Shigeki Mashimo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit device and method of manufacturing the same
    Patent number: 9275930
    Abstract: In a hybrid integrated circuit device of the present invention, leads are fixedly attached on the upper surface of a circuit board. The lead includes an island portion, a slope portion, and a lead portion. A transistor and a diode are mounted on the upper surface of the island portion. Electrodes provided on the upper surfaces of the transistor and the diode are connected to a bonding portion through a fine metal wire. The bonding portion of the lead is disposed at a higher position than the island portion. Thus, the fine metal wires connected to the bonding portion are separated from each other.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: March 1, 2016
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Shigeki Mashimo, Fumio Horiuchi, Kiyoaki Kudo, Akira Sakurai, Yuhki Inagaki
  • Circuit device having an improved heat dissipitation, and the method of manufacturing the same
    Patent number: 8450837
    Abstract: In a hybrid integrated circuit device, a circuit board on which an island portion of a lead is fixedly attached and a control board on which a control element and the like are mounted are disposed in an overlapping manner. The circuit board and the control board are integrally encapsulated with an encapsulating resin. A transistor disposed on an upper surface of the circuit board and a control element mounted on an upper surface of the control board are also covered by the encapsulating resin. Thus, a module in which an inverter circuit and a control circuit are integrally encapsulated with resin is provided.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: May 28, 2013
    Assignee: ON Semiconductor Trading, Ltd.
    Inventors: Shigeki Mashimo, Fumio Horiuchi, Kiyoaki Kudo, Akira Sakurai, Yuhki Inagaki
  • CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20120075816
    Abstract: In a hybrid integrated circuit device of the present invention, leads are fixedly attached on the upper surface of a circuit board. The lead includes an island portion, a slope portion, and a lead portion. A transistor and a diode are mounted on the upper surface of the island portion. Electrodes provided on the upper surfaces of the transistor and the diode are connected to a bonding portion through a fine metal wire. The bonding portion of the lead is disposed at a higher position than the island portion. Thus, the fine metal wires connected to the bonding portion are separated from each other.
    Type: Application
    Filed: September 23, 2011
    Publication date: March 29, 2012
    Applicant: ON Semiconductor Trading, Ltd.
    Inventors: Shigeki MASHIMO, Fumio Horiuchi, Kiyoaki Kudo, Akira Sakurai, Yuhki Inagaki
  • CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20120074552
    Abstract: In a hybrid integrated circuit device, a circuit board on which an island portion of a lead is fixedly attached and a control board on which a control element and the like are mounted are disposed in an overlapping manner. The circuit board and the control board are integrally encapsulated with an encapsulating resin. A transistor disposed on an upper surface of the circuit board and a control element mounted on an upper surface of the control board are also covered by the encapsulating resin. Thus, a module in which an inverter circuit and a control circuit are integrally encapsulated with resin is provided.
    Type: Application
    Filed: September 22, 2011
    Publication date: March 29, 2012
    Applicant: ON Semiconductor Trading, Ltd.
    Inventors: Shigeki Mashimo, Fumio Horiuchi, Kiyoaki Kudo, Akira Sakurai, Yuhki Inagaki