Abstract: Prior art technology has a problem in that when a plant is cultivated for a long period of time on a PVA film having its lower surface positioned in contact with a nutrient fluid, plant roots that have formed penetrate through the film. A plant cultivation system wherein the PVA film has an equilibrium degree of swelling in the range of from 125 to 250% as measured in water at 30° C. and has a loss tangent (tan ?) in the range of from 0.005 to 0.2 as measured in an equilibrium swollen state in water at 30° C., and a method for cultivating a plant by using this plant cultivation system. Plant cultivation can be performed for a long period of time while avoiding infection by bacteria and the like causative of plant diseases. Therefore, the present invention is useful in, e.g., agriculture and the manufacture of pharmaceuticals.

Abstract: Prior art technology has a problem in that when a plant is cultivated for a long period of time on a PVA film having its lower surface positioned in contact with a nutrient fluid, plant roots that have formed penetrate through the film. A plant cultivation system wherein the PVA film has an equilibrium degree of swelling in the range of from 125 to 250% as measured in water at 30° C. and has a loss tangent (tan ?) in the range of from 0.005 to 0.2 as measured in an equilibrium swollen state in water at 30° C., and a method for cultivating a plant by using this plant cultivation system. Plant cultivation can be performed for a long period of time while avoiding infection by bacteria and the like causative of plant diseases. Therefore, the present invention is useful in, e.g., agriculture and the manufacture of pharmaceuticals.

Abstract: Prior art technology has a problem in that when a plant is cultivated for a long period of time on a PVA film having its lower surface positioned in contact with a nutrient fluid, plant roots that have formed penetrate through the film. A plant cultivation system wherein the PVA film has an equilibrium degree of swelling in the range of from 125 to 250% as measured in water at 30° C. and has a loss tangent (tan ?) in the range of from 0.005 to 0.2 as measured in an equilibrium swollen state in water at 30° C., and a method for cultivating a plant by using this plant cultivation system. Plant cultivation can be performed for a long period of time while avoiding infection by bacteria and the like causative of plant diseases. Therefore, the present invention is useful in, e.g., agriculture and the manufacture of pharmaceuticals.

Abstract: [Problems] Prior art technology has a problem in that when a plant is cultivated for a long period of time on a polyvinyl alcohol (PVA) film having its lower surface positioned in contact with a nutrient fluid, plant roots that have formed penetrate through the film. [Means to solve the problems] A plant cultivation system wherein the PVA film has an equilibrium degree of swelling in the range of from 125 to 250% as measured in water at 30° C. and has a loss tangent (tan ?) in the range of from 0.005 to 0.2 as measured in an equilibrium swollen state in water at 30° C., and a method for cultivating a plant by using this plant cultivation system. [Industrial applicability] Plant cultivation can be performed for a long period of time while avoiding infection by bacteria and the like causative of plant diseases. Therefore, the present invention is useful in, e.g., agriculture and the manufacture of pharmaceuticals.

Abstract: An electrode substrate of the present invention includes a first conductive layer made of a first conductive material and a second conductive layer made of a second conductive material formed on a transparent base material, wherein the first conductive layer is formed on the transparent base material, the second conductive layer is formed on the transparent base material to cover the first conductive layer, both the first conductive layer and the second conductive layer form a fine wiring pattern, the second conductive layer has a width not less than 1.5 times and not more than 300 times that of the first conductive layer, and the second conductive material has a light transmissivity higher than that of the first conductive material, and a conductivity lower than that of the first conductive material.

Abstract: A method of forming an Sn—Ag—Cu ternary alloy thin-film of the present invention forms the ternary alloy thin-film by electroplating. A plating bath contains an Sn compound, an Ag compound, a Cu compound, an inorganic chelating agent and an organic chelating agent. The inorganic chelating agent is one of a polymerized phosphate-based chelating agent and a chelating agent represented by a chemical formula (I): MFX(X—Y)— . . . (I) where M is an arbitrary metal, X is an arbitrary natural number and Y is an oxidation number of M. The organic chelating agent is one of porphyrins, dipivaloylmethane, phthalocyanines and a compound represented by a chemical formula (II): R—(CH2CH2O)n-A . . . (II) where R is an alkyl group having a carbon number of 8 to 30, A is CH2COONa or CH2SO4Na and n is a natural number.

Abstract: A method of forming an Sn—Ag—Cu ternary alloy thin-film of the present invention forms the ternary alloy thin-film by electroplating. A plating bath contains an Sn compound, an Ag compound, a Cu compound, an inorganic chelating agent and an organic chelating agent. The inorganic chelating agent is one of a polymerized phosphate-based chelating agent and a chelating agent represented by a chemical formula (I): MFX(X—Y)— . . . (I) where M is an arbitrary metal, X is an arbitrary natural number and Y is an oxidation number of M. The organic chelating agent is one of porphyrins, dipivaloylmethane, phthalocyanines and a compound represented by a chemical formula (II): R—(CH2CH2O)n-A . . . (II) where R is an alkyl group having a carbon number of 8 to 30, A is CH2COONa or CH2SO4Na and n is a natural number.

Abstract: A conductive sheet according to the present invention includes: an insulating substrate having at least one via hole, a ground conductive layer; and a top conductive layer, and characterized in that the via hole is a fine pore penetrating through the insulating substrate, the ground conductive layer is formed by a sputtering method or a vapor deposition method on all of a surface of the insulating substrate, the top conductive layer is formed on all of or part of a surface of the ground conductive layer, and the via hole is filled with the top conductive layer.

Abstract: An aluminum stabilization stacked body formed by stacking a stabilization layer formed with a metal and having a thickness of 0.001-1 ?m with any of a sputtering method, a deposition method and an ion plating method on a whole surface of a thin film having a surface formed with aluminum.

Abstract: A terminal obtained by forming a surface layer formed of an Sn—Ag—Cu ternary alloy with electroplating on a whole surface or a portion of a conductive base, wherein the Sn—Ag—Cu ternary alloy is constructed with a ratio of 70-99.8 mass % of Sn, 0.1-15 mass % of Ag and 0.1-15 mass % of Cu, has a melting point of 210-230° C., and is formed in a state of a crystal of a minute particle as compared with the surface layer formed of Sn alone.

Abstract: The present invention relates to a conductive sheet having a metal layer formed on at least a portion of a surface of an insulating substrate, wherein the insulating substrate has a long size of 1-10000 m in length, at least a portion of the surface thereof is irradiated with cations to set a surface roughness value Ra of an irradiated portion to 0.2-200 nm, and the metal layer is formed on the portion irradiated with cations by a sputtering method or a deposition method.

Abstract: A conductive sheet according to the present invention includes: an insulating substrate having at least one via hole, a ground conductive layer; and a top conductive layer, and characterized in that the via hole is a fine pore penetrating through the insulating substrate, the ground conductive layer is formed by a sputtering method or a vapor deposition method on all of a surface of the insulating substrate, the top conductive layer is formed on all of or part of a surface of the ground conductive layer, and the via hole is filled with the top conductive layer.

Abstract: A terminal of the present invention includes a ruthenium layer formed on conductive substrate entirely or partially, and a surface metal layer made of at least one of the metals selected from the group consisting of Au, Pt, Ag, Pd, Rh, Co, Ni, In and Sn, or made of an alloy containing at least one of the metals selected from the group, which is formed on the ruthenium layer entirely or partially.

Abstract: A scroll compressor comprises a fixed scroll member and a revolving scroll member that engage with each other with their centrifugal walls, wherein the revolving scroll member is supported to revolve with respect to the fixed scroll member, but to avoid self-rotation thereof. The spiral-starting portion of the centrifugal wall comprises non-stepped portions formed along curves of &bgr;1-&bgr;1′ and &bgr;2-&bgr;2′ respectively, and a stepped portion formed along a curve &bgr;1′-&bgr;2′ that provides a thickness increase area encompassed by its upper-side curved surface and its lower-side curved surface. The discharge port is located on the end board of the fixed scroll member to partly overlap with the thickness increase area by partly hollowing the lower side of the stepped portion with the prescribed height.

Abstract: A material for an electronic component having a plating layer A formed of metals X and Y mixed with each other on a base metal material and a coating layer B formed of the metal X provided on the plating layer A is provided, whereby wettability of soldering is satisfactory ensured, degradation of solderability and appearance is prevented and generation of whiskers can also be prevented.

Abstract: A compressor assembled under desirable working conditions at a low cost is disclosed. In the compressor, the first rolling bearing for permitting axial movement of the shaft is inserted into the first housing from the side where the compression mechanism is to be provided, and the second rolling bearing for restricting axial movement of the shaft is inserted into the first housing from the other side where the driving source is to be provided. The shaft is inserted into the first housing from the side where the compression mechanism is to be provided. A seal member is further provided between the rolling bearings for sealing an area between the insertion hole and the shaft, wherein the seal member is inserted into the insertion hole of the first housing from the side where the compression mechanism is to be provided before the shaft is inserted into the insertion hole.

Abstract: An object of the present invention is to provide a scroll compressor that improves assembly precision and the engagement projections are not easily damaged even when a strong force is applied to the Oldham ring during operation; in order to attain this object, a scroll compressor is provided wherein a fixed scroll member comprising an end plate and an involute wrap provided on one face of the end plate, and an orbiting scroll member comprising an end plate and an involute wrap provided on one face of this end plate, and which form a plurality of compression chambers in combination with the involute wrap of the fixed scroll member, wherein a mechanism that prevents autorotation of this orbiting scroll memberand permits rotation of the orbiting scroll member with respect to fixed scroll member is provided between the orbiting scroll member and fixed scroll member.

Abstract: A scroll compressor comprises a fixed scroll member and a revolving scroll member that engage with each other with their centrifugal walls, wherein the revolving scroll member is supported to revolve with respect to the fixed scroll member, but to avoid self-rotation thereof. The spiral-starting portion of the centrifugal wall comprises non-stepped portions formed along curves of &bgr;1-&bgr;1′ and &bgr;2-&bgr;2′ respectively, and a stepped portion formed along a curve &bgr;1′-&bgr;2′ that provides a thickness increase area encompassed by its upper-side curved surface and its lower-side curved surface. The discharge port is located on the end board of the fixed scroll member to partly overlap with the thickness increase area by partly hollowing the lower side of the stepped portion with the prescribed height.

Abstract: A material for an electronic component having a plating layer A formed of metals X and Y mixed with each other on a base metal material and a coating layer B formed of the metal X provided on the plating layer A is provided, whereby wettability of soldering is satisfactory ensured, degradation of solderability and appearance is prevented and generation of whiskers can also be prevented.

Abstract: A compressor assembled under desirable working conditions at a low cost is disclosed. In the compressor, the first rolling bearing for permitting axial movement of the shaft is inserted into the first housing from the side where the compression mechanism is to be provided, and the second rolling bearing for restricting axial movement of the shaft is inserted into the first housing from the other side where the driving source is to be provided. The shaft is inserted into the first housing from the side where the compression mechanism is to be provided. A seal member is further provided between the rolling bearings for sealing an area between the insertion hole and the shaft, wherein the seal member is inserted into the insertion hole of the first housing from the side where the compression mechanism is to be provided before the shaft is inserted into the insertion hole.