Abstract: A photosemiconductor encapsulating resin composition, excellent in light transmittance, ultraviolet resistance and heat resistance, comprising the following component (A) and component (B): (A): a (meth)acrylic polymer containing an epoxy group, and (B): at least one hardener selected from the group consisting of the following components (b1) to (b4) (b1) a polyvalent carboxylic acid, (b2) a polyvalent carboxylic anhydride, (b3) a reaction product of a polyvalent carboxylic acid with a compound of the following general formula (B-1), and (b4) a reaction product of a polyvalent carboxylic anhydride with a compound of the following general formula (B-2) wherein R1 to R6 represent each independently a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, R3 and R4 may be bonded to form an alkylene group having 1 to 8 carbon atoms; R7 represents an alkylene group; a methylene group contained the alkylene group and the alkyl group represented by R1 to R7 may be substituted by an ether group and

Abstract: A photosemiconductor encapsulating resin composition, excellent in light transmittance, ultraviolet resistance and heat resistance, comprising the following component (A) and component (B): (A): a (meth)acrylic polymer containing an epoxy group, and (B): at least one hardener selected from the group consisting of the following components (b1) to (b4) (b1) a polyvalent carboxylic acid, (b2) a polyvalent carboxylic anhydride, (b3) a reaction product of a polyvalent carboxylic acid with a compound of the following general formula (B-1), and (b4) a reaction product of a polyvalent carboxylic anhydride with a compound of the following general formula (B-2) wherein R1 to R6 represent each independently a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, R3 and R4 may be bonded to form an alkylene group having 1 to 8 carbon atoms; R7 represents an alkylene group; a methylene group contained the alkylene group and the alkyl group represented by R1 to R7 may be substituted by an ether group and

Abstract: A photosemiconductor encapsulating resin composition, excellent in light transmittance, ultraviolet resistance and heat resistance, comprising the following component (A) and component (B): (A): a (meth)acrylic polymer containing an epoxy group, and (B): at least one hardener selected from the group consisting of the following components (b1) to (b4): (b1) a polyvalent carboxylic acid, (b2) a polyvalent carboxylic anhydride, (b3) a reaction product of a polyvalent carboxylic acid with a compound of the following general formula (B-1), and (b4) a reaction product of a polyvalent carboxylic anhydride with a compound of the following general formula (B-2) wherein R1 to R6 represent each independently a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, R3 and R4 may be bonded to form an alkylene group having 1 to 8 carbon atoms; R7 represents an alkylene group; a methylene group contained the alkylene group and the alkyl group represented by R1 to R7 may be substituted by an ether group an

Abstract: The present invention provides a thermosetting resin composition containing the following (A) component and (B) component, an adhesive containing the thermosetting resin composition and an organic solvent and/or water, and an adhesive film containing the thermosetting resin composition.

Abstract: The present invention provides a resin composition for paint, which contains a thermo-decomposition type foaming agent and polyester resin for paint, a laminate obtainable by applying said composition to a substrate, an article containing said laminate, and a method for recovering a substrate from a laminate comprising heating said laminate. And the paint in the laminate obtainable from said resin composition and the substrate is adhered firmly to the substrate until recycled and the paint layer can easily be peeled off from the substrate by heating the laminate. The resulting substrate can be reused.

Abstract: A photosemiconductor encapsulating resin composition, excellent in light transmittance, ultraviolet resistance and heat resistance, comprising the following component (A) and component (B):

Abstract: A resin composition for insulation material adhesive having excellent solder heat resistance comprising components (A) a copolymer comprising a vinyl group-containing monomer unit [a] and an epoxy group-containing monomer unit [b], and (B) a polymerization initiator;

Abstract: The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which. shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.

Abstract: The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.

Abstract: The invention provides a cis-stilbene type epoxy resin having lower melting point and lower viscosity than the trans-stilbene type epoxy resin hitherto known. The stilbene type epoxy resin has a cis-isomer content of essentially 100%, or in the alternative, at least about 10% with the rest being the trans-isomer, and is based on the following general formula (1): ##STR1## wherein R.sub.1 to R.sub.8 are independently an acyclic or cyclic alkyl group, a hydrogen atom, or a halogen atom. Production processes for these epoxy resins are also disclosed.

Abstract: The invention provides a cis-stilbene type epoxy resin having lower melting point and lower viscosity than the trans-stilbene type epoxy resin hitherto known. The stilbene type epoxy resin has a cis-isomer content of essentially 100%, or in the alternative, at least about 10% with the rest being the trans-isomer, and is based on the following general formula (1): ##STR1## wherein R.sub.1 to R.sub.8 are independently an acyclic or cyclic alkyl group, a hydrogen atom, or a halogen atom. Production processes for these epoxy resins are also disclosed.

Abstract: A process for encapsulating a semiconductor device involves the step(s) of encapsulating the device with an epoxy resin composites represented by the formula (2) ##STR1## in which R.sub.1 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group having 1 to 9 carbon atoms, or an aryl and n represents an average number of repeating units of 0.1 to 1.6; and a curing agent.

Abstract: The present invention provides polyhydric phenols which are starting materials for glycidyl ether compounds which can provide cured products having low moisture absorption, high heat resistance and improved crack resistance and can be used for encapsulating semiconductor devices. The polyhydric phenols are represented by the following formula: ##STR1## wherein R.sup.1 independently represents a halogen atom, an alkyl or cycloalkyl group of 1-9 carbon atoms, an alkoxy group of 4 or less carbon atoms or an aryl group and R.sup.1 may be identical or different when l is 2 or more, R.sup.2 independently represents a halogen atom, an alkoxy group of 4 or less carbon atoms or an alkyl group of 6 or less carbon atoms and R.sup.2 may be identical or different when m is 2 or more, R.sup.

Abstract: An epoxy resin composition contains (a) an epoxy resin represented by the general formula (2) ##STR1## wherein R.sub.1 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group having 1 to 9 carbon atoms, or an aryl and n represents an average number of repeating units of 0.1 to 1.6; and a curing agent.

Abstract: The polyamino oligomers of this invention are obtained by reacting diisopropenylbenzenes or bis(.alpha.-hydroxyisopropyl)benzenes and anilines in the presence of an acid catalyst and characterized by the recurring unit having an indane skeleton. These polyamino oligomers can be used as curing agent for laminate resins. Also, they can be reacted with maleic anhydride to prepare polymaleimide compounds of this invention.The polymaleimide compounds of this invention are low in melting point (or softening point) and, in combination with a substance producing three-dimensional crosslinkage such as triallyl isocyanurate, aromatic diamine, etc., can provide thermosetting resin compositions suited for producing copper-clad laminates. The copper-clad laminates obtained from the thermosetting resin compositions of this invention are low in dielectric constant, heat-resistant and also low in water absorptivity, so that they are useful for multi-layer printed boards.

Abstract: There is provided an epoxy resin composition represented by the general formula: ##STR1## wherein R.sub.1 represents an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, R.sub.2 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group having 1 to 9 carbon atoms, or an aryl group, and n represents an average number of repeating units of 0.1 to 1.6. Cured products prepared from the epoxy resin have a lower hygroscopicity and a balance between thermal resistance and curing performance.

Abstract: A thermosetting resin composition useful for a copper-clad laminate is provided, which comprise (A) an aromatic diamine compound represented by the following formula: ##STR1## wherein Ar is a divalent aromatic residue, and R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each is an allyl group or a hydrogen atom but at least one of them is an allyl group, and (B) a polymaleimide compound having two or more maleimide groups in a molecule thereof.

Abstract: A thermosetting resin composition is provide, which contains a compound of ##STR1## wherein substituents R.sub.1 -R.sub.6 each represents a hydrogen atom or a saturated alkyl group having 1-6 carbon atoms, substituents R.sup.7 -R.sup.12 each represents a hydrogen atom, a saturated alkyl group having 1-4 carbon atoms or an alkoxy group having 1-4 carbon atoms, X.sub.a -X.sub.e each represents a hydrogen atom, a chlorine atom or a bromine atome, and the average repeating unit number n denotes a numeral from 0 to 5, and a polyamide compound having two or more maleimide groups and, if desired, a compound of ##STR2## wherein R.sub.1 and R.sub.2 each represents a methyl group or a phenyl group, and R.sub.3 represents a hydrogen atom or a functional group containing an amino group, a glycidyl group or an alicylic epoxy group, l denotes a numeral in the range of 0-500, and m denotes a numeral in the range of 1-500, or ##STR3## wherein R.sub.1 and R.sub.2 each represents a methyl group or a phenyl group, and R.sub.

Abstract: A thermosetting resin composition useful for a copper-clad laminate is provided, which comprise (A) an aromatic diamine compound represented by the following formula: ##STR1## wherein Ar is a divalent aromatic residue, and R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each is an allyl group or a hydrogen atom but at least one of them is an allyl group, and (B) a polymaleimide compound having two or more maleimide groups in a molecule thereof.

Abstract: A thermosetting resin composition is prepared by mixing(A) a phenol novolak resin having hydroxy groups and allyl-etherified hydroxy groups,(B) a polymaleimide compound having two or more maleimide groups in the molecule, and(C) at least one silicone resin having the following formula (I); ##STR1## wherein R.sub.1 and R.sub.2, which may be the same or different, are methyl or phenyl; R.sub.3 and R.sub.4, which may be the same or different, are methyl, phenyl, hydrogen or a group having an amino group or an epoxy group but at least one of R.sub.3 and R.sub.4 is hydrogen or a group having an amino group or an epoxy group; and l and m, which may be the same or different, are a number of 0-400. The thermosetting resin composition of the present invention can be suitably used for encapsulating electric devices, for example, and gives, by curing, a cured resin product of high quality.