Abstract: A door handle device capable of operating a door opening/closing mechanism of a vehicle is disclosed. The door handle device includes a support member, a door handle, a circuit substrate, a lock detection electrode, a capacitance sensor, and an auxiliary electrode. The circuit substrate is arranged in the door handle and includes a ground electrode. The lock detection electrode is mounted on the circuit substrate and capacitance-coupled to an outer panel of the door. The capacitance sensor is connected to the lock detection electrode and detects the issuance of a door lock command based on a change in a first capacitance between the outer panel and the lock detection electrode. The auxiliary electrode is capacitance-coupled to the ground electrode to form a second capacitance connected in parallel to the first capacitance between the auxiliary electrode and the ground electrode.

Abstract: A door handle device capable of operating a door opening/closing mechanism of a vehicle is disclosed. The door handle device includes a support member, door handle, lock detection electrode, and capacitance sensor. The door handle includes a first end, second end, pivot portion, and operation portion. The capacitance sensor detects issuance of a door lock command from a change in capacitance between an outer panel and the lock detection electrode. The door handle includes a first handle case and second handle case, which covers the first handle case. The lock detection electrode is arranged proximal to and facing toward an inner surface of an upper wall or lower wall of the second handle case. The lock detection electrode is encompassed by a waterproof elastic body.

Abstract: A high-strength steel pipe having a tensile strength of 800 MPa or more that includes a weld metal having high cold-cracking resistance and high low-temperature toughness is provided. The high-strength steel pipe is a high-strength welded steel pipe in which the welded steel pipe is manufactured by double one layer submerged arc welding performed on an internal surface and an external surface of a base metal, both the base metal of the welded steel pipe and a weld metal have a tensile strength of 800 MPa or more, the weld metal contains C: 0.04% to 0.09% by mass, Si: 0.32% to 0.50% by mass, Mn: 1.4% to 2.0% by mass, Cu: less than 0.5% by mass, Ni: more than 0.9% by mass but not more than 4.2% by mass, Mo: 0.4% to 1.5% by mass, Cr: less than 0.5% by mass, V: less than 0.2% by mass, and the remainder of Fe and incidental impurities, and CS values calculated from the weld metal components using the equation CS=5.1+1.4[Mo]?[Ni]?0.6[Mn]?36.

Abstract: An electronic apparatus is equipped with housing, a motherboard, a stud, and a lid. The housing constitutes an outer shell of the main body having a shielding property against electromagnetic radiation and an opening located on the bottom wall. The opening is smaller than the total mounting area of a plurality of extension modules which are layered each other. The motherboard is installed in the housing. The stud is attached on the bottom surface side of the motherboard and is fastened by a set of screws together with the plurality of extension modules. The lid has a shielding property against electromagnetic radiation and covers the opening.

Abstract: A door handle device (S) has a handle-side connector (30) fixed to a door handle (10) that is hinged to a handle frame (20). Thus, the door handle device (S) is displaceable as the door handle (10) is turned. A frame-side connector (40) is located in the handle frame (20) and is connectable with the handle-side connector (30) for displacement with the handle-side connector (30) as the door handle (10) is turned. A clamp (60) has a wire retaining portion (61) for retaining a wire group (80) drawn out through an end surface of the frame-side connector (40) and a handle attaching portion (62) continuous with the wire retaining portion (61) for attachment to the door handle (10). Thus, a relative position of the wire retaining portion (61) to the door handle (10) is invariable.

Abstract: According to one embodiment, a docking device has a main body, which includes a surface facing an electronic apparatus. A hook, which is removably engaged with the electronic apparatus, and a to-be-broken portion are provided on the surface of the main body. The to-be-broken portion interferes with and is broken by the hook, when the hook is moved away from the surface as the electronic apparatus is moved.

Abstract: A method of welding a deck plate and a closed section rib both constituting a steel plate deck, comprising: working a root portion of the closed section rib to have a flat surface in parallel with a surface of the deck plate; and welding the deck plate and the closed section rib while making the flat surface of the closed section rib to be in contact with the surface of the deck plate.

Abstract: According to one embodiment, an electronic apparatus is provided with a case, a module contained in the case and including a first hole portion and a connector, a cable connected electrically to the connector, a fixture which is inserted in the first hole portion and fixes the module in the case, and a cover which covers the connector, includes a second hole portion communicating with the first hole portion, and is fixed in combination with the module by the fixture.

Abstract: According to one embodiment, an electronic apparatus is provided with a semiconductor package, a heat receiving plate, and a gap adjusting member. The semiconductor package includes a substrate and a silicon die mounted on the substrate. The heat receiving plate is opposed to the silicon die and thermally connected to the silicon die. The gap adjusting member is disposed between the heat receiving plate and a region of the substrate apart from the silicon die and serves to reduce a gap which exists between the substrate and the heat receiving plate.

Abstract: According to one embodiment, a docking device has a main body, which includes a surface facing an electronic apparatus. A hook, which is removably engaged with the electronic apparatus, and a to-be-broken portion are provided on the surface of the main body. The to-be-broken portion interferes with and is broken by the hook, when the hook is moved away from the surface as the electronic apparatus is moved.

Abstract: An electronic apparatus is equipped with housing, a motherboard, a stud, and a lid. The housing constitutes an outer shell of the main body having a shielding property against electromagnetic radiation and an opening located on the bottom wall. The opening is smaller than the total mounting area of a plurality of extension modules which are layered each other. The motherboard is installed in the housing. The stud is attached on the bottom surface side of the motherboard and is fastened by a set of screws together with the plurality of extension modules. The lid has a shielding property against electromagnetic radiation and covers the opening.

Abstract: According to one embodiment, an electronic apparatus is provided with a case, a module contained in the case and including a first hole portion and a connector, a cable connected electrically to the connector, a fixture which is inserted in the first hole portion and fixes the module in the case, and a cover which covers the connector, includes a second hole portion communicating with the first hole portion, and is fixed in combination with the module by the fixture.

Abstract: According to one embodiment of the invention, An electronic apparatus comprises; a body including a keyboard exposed on an upper surface hereof; a display device including a display surface and movable to a first state, a second state and a third state; an inversion hinge for rotating the display device on an inversion axis to move the display device from the first state to the third state; a support unit connected to the display device by the inversion hinge; a rotation hinge for rotating the support unit on a rotation axis provided along a rear side of the body while connecting the body and the support unit to each other; and an operation device provided in the support unit coaxially with the inversion axis and for outputting a signal related to information displayed on the display device.

Abstract: An electronic apparatus includes a functional portion provided at an upper surface of a main body, and a hinge portion which couples a display unit to the main body, and includes a first shaft and a second shaft. The display unit is rotatable about the first shaft to change its state between a first state in which it covers the upper surface and a second state in which it is opened to expose the upper surface. The display unit is also turnable about the second shaft with respect to the main body. Furthermore, the display unit is set in a third state in which it covers the upper surface in such a way as to expose the functional portion, when it is downwardly rotated about the first shaft after being turned about the second shaft while being in the second state.

Abstract: In a terminal member, a protuberance is formed so as to protrude toward an external electrode, and thereby, a bonding portion where the terminal member is bonded to the external electrode, the bonding portion being formed with solder, is extended substantially linearly across a part of the external electrode. Preferably, the direction in which the bonding portion is elongated linearly is in parallel to that in which internal electrodes are extended. Further, it is preferable that the bonding portion is as wide as possible, and the center of the bonding portion in the width direction is as near to the center of the end-face of the capacitor body as possible.

Abstract: A ceramic condenser module includes at least one first multi-layered ceramic condenser and at least one second multi-layered ceramic condenser, which are mounted to a front surface and a back surface of a substrate, respectively. When a total surface area of the outside surfaces of the mounted first and second multi-layered ceramic condensers excluding surfaces thereof opposing the substrate is defined as S2, and a total equal to S2 and a surface area of the outside surface of the substrate excluding the area covered by the first and second multi-layered ceramic condensers is defined as S1, S1 is equal to or greater than about 1.3 times S2. With this arrangement, the ceramic condenser module is suitable for use with large amounts of current, has excellent heat-dissipation effect, is much smaller and much less expensive.

Abstract: In a terminal member, a protuberance is formed so as to protrude toward an external electrode, and thereby, a bonding portion where the terminal member is bonded to the external electrode, the bonding portion being formed with solder, is extended substantially linearly across a part of the external electrode. Preferably, the direction in which the bonding portion is elongated linearly is in parallel to that in which internal electrodes are extended. Further, it is preferable that the bonding portion is as wide as possible, and the center of the bonding portion in the width direction is as near to the center of the end-face of the capacitor body as possible.

Abstract: An inverter capacitor module includes a plurality of substrates having a plurality of ceramic capacitors provided on the top surfaces thereof, and first and second feeding unit lands having conductive films provided on both surfaces thereof and arranged to feed the plurality of ceramic capacitors, the first and second feeding unit lands on both surfaces thereof being electrically connected to each other, a conductive spacer inserted between the plurality of substrates for establishing one of an electrical connection between the first feeding unit lands of an underlying substrate and its overlying substrate and an electrical connection between the second feeding unit lands of an underlying substrate and its overlying substrate, a fixing member arranged to fix the plurality of substrates laminated via the conductive spacer, and a switching module fixed below the bottom substrate among the plurality of substrates that are laminated.

Abstract: The present invention provides a small-sized capacitor module for use in an inverter, which is capable of suppressing the occurrence of unwanted inductance components in an electric connection path and which is suitable for a large current use. The present capacitor module is constituted by: mounting a plurality of ceramic capacitors 3 having first and second terminals 3a and 3b on the first surface 1 of a substrate 2; forming a first conductor 12 on the first surface of the substrate 2; forming a second conductor 14 on the second surface of the substrate 2; electrically connecting first and second terminals 3a and 3b to the first conductor 12 and the second conductor 14, respectively; forming, on the substrate 2, first and second terminal mounting portions where the respective first and second terminals of a switching module are mounted; and electrically connecting the first and second terminal mounting portions to the first and second conductors 12 and 14, respectively.

Abstract: A highly reliable method for screening a multi-layer ceramic electronic component, in which multi-layer ceramic electronic components having inner-structural defects and a reduced useful life are efficiently detected and removed. In this method, after applying an AC voltage to a multi-layer ceramic electronic component, a DC voltage is applied thereto. Then, by measuring the insulation-resistance value of the electronic component obtained when the DC voltage is applied, the quality of the multi-layer ceramic electronic component is checked. The applied AC voltage is in a range of 40 to 80% or 50 to 70% of a breakdown voltage. The applied DC voltage is between approximately a rated voltage and approximately twice the rated voltage. This method can, for example, be applied to the screening of a multi-layer ceramic capacitor.