Patents by Inventor Shigeki Sato

Shigeki Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210316250
    Abstract: A thermo-sensitive draw solute including a polyoxyalkylene adduct represented by a general formula (1): R1O(AO)nR2 (1), where R1 denotes a residue after withdrawal of a hydroxy group from a monovalent alcohol having a carbon number ranging from 6 to 13, R2 denotes a hydrogen atom or denotes an alkyl group or an alkenyl group having a carbon number ranging from 1 to 13, AO denotes an oxyalkylene group having a carbon number ranging from 2 to 4, n denotes an average added mole number of an alkylene oxide ranging from 1 to 235, and where n is two or more, the two or more AOs may be the same or different from each other.
    Type: Application
    Filed: August 5, 2019
    Publication date: October 14, 2021
    Inventors: Aya OSATO, Takeshi TSUJi, Koji FUCHIGAMI, Keiji TOMURA, Shigeki FUJIWARA, Makcto KUNUGI, Yuya SATO, Eri WATANABE, Masami NAKAGAWA, Sohei HAMAGUCHI, Koji KUBO
  • Patent number: 11137651
    Abstract: To suppress a variation in characteristics of a transistor due to a released gas from an organic insulating film so that reliability of a display device is increased. The display device includes a transistor, an organic insulating film which is provided over the transistor in order to reduce unevenness due to the transistor, and a capacitor over the organic insulating film. An entire surface of the organic insulating film is not covered with components (a transparent conductive layer and an inorganic insulating film) of the capacitor, and a released gas from the organic insulating film can be released to the outside from exposed part of an upper surface of the organic insulating film.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: October 5, 2021
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Masatoshi Yokoyama, Shigeki Komori, Manabu Sato, Kenichi Okazaki, Shunpei Yamazaki
  • Patent number: 11133541
    Abstract: Provided is a battery pack including: a first battery group in which a plurality of storage batteries having a battery can side surface and a battery can bottom surface linked to the battery can side surface are laminated so that the battery can side surfaces face each other; a second battery group in which a plurality of storage batteries having a battery can side surface and a battery can bottom surface linked to the battery can side surface are laminated so that the battery can side surfaces are face each other; and a case housing the first battery group and the second battery group, wherein the facing surfaces of the first battery group and the second battery group are directly or indirectly thermally connected to each other.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: September 28, 2021
    Assignee: Vehicle Energy Japan Inc.
    Inventors: Masanari Oda, Hirofumi Takahashi, Shigeki Makino, Wataru Sato, Hitoshi Nishimori
  • Patent number: 11094809
    Abstract: A power module which includes a power semiconductor module chip, a driver chip and a charge storage element. The power semiconductor module chip is configured by forming an IGBT having a trench gate structure including a dummy trench gate, and a freewheeling diode for returning excess carrier of the emitter of the IGBT to the collector of the IGBT, in the same chip. The drive chip is used for driving the IGBT on/off. The power module is configured by packaging the power semiconductor module chip and the drive chip. The charge storage element that is connected between the gate and emitter of a dummy IGBT which can be pseudo-formed in order that the dummy trench gate be used in screening examinations.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: August 17, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Shigeki Sato
  • Publication number: 20210237556
    Abstract: A grille shutter device opens and closes an introduction passage through which air is introduced from an opening provided at a front part of a vehicle to the inside of the vehicle. The grille shutter device includes: a driving fin and a driven fin that are configured to rotate between an open position in which the introduction passage is open and a closed position in which the introduction passage is closed; an actuator configured to drive the driving fin; a power transmission member configured to transmit power from the driving fin to the driven fin; and a first stopper configured to define a first position by coming into contact with the power transmission member.
    Type: Application
    Filed: January 29, 2021
    Publication date: August 5, 2021
    Applicants: AISIN SEIKI KABUSHIKI KAISHA, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Ken KOMATSUBARA, Kazuki TSUBOI, Shigeki SATO, Toshikazu HARADA, Shuichi MORIE
  • Publication number: 20210225588
    Abstract: In a coil component and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.
    Type: Application
    Filed: April 7, 2021
    Publication date: July 22, 2021
    Applicant: TDK CORPORATION
    Inventors: Hitoshi OHKUBO, Masazumi ARATA, Manabu OHTA, Shou KAWADAHARA, Yoshihiro MAEDA, Takahiro KAWAHARA, Hokuto EDA, Shigeki SATO
  • Patent number: 11049641
    Abstract: A coil device comprising a coil, and a magnetic metal powder containing resin covering said coil. Said magnetic metal powder comprises at least two types of magnetic metal powders with different D50. The magnetic metal powder having larger D50 is defined as a large diameter powder, and the magnetic metal powder having smaller D50 is defined as a small diameter powder among the two types of said magnetic metal powder. Said large diameter powder is made of iron or iron based alloy. Said small diameter powder is made of Ni—Fe alloy. Said small diameter powder has D50 of 0.5 to 1.5 ?m. Said large diameter powder and said small diameter powder respectively comprises an insulation coating layer.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: June 29, 2021
    Assignee: TDK CORPORATION
    Inventors: Hitoshi Ohkubo, Kyohei Tonoyama, Shigeki Sato
  • Patent number: 10998130
    Abstract: In a coil component and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: May 4, 2021
    Assignee: TDK CORPORATION
    Inventors: Hitoshi Ohkubo, Masazumi Arata, Manabu Ohta, Shou Kawadahara, Yoshihiro Maeda, Takahiro Kawahara, Hokuto Eda, Shigeki Sato
  • Patent number: 10715134
    Abstract: A power module which includes a power semiconductor chip that includes an IGBT and a freewheeling diode formed in the same chip, and the power module includes a drive circuit that is connected to the power semiconductor chip and drives the IGBT on/off. The power module is configured by packaging the power semiconductor chip and the drive circuit, and is characterized by further including a capacitor and a switch element disposed in series between the emitter of the IGBT and the ground of the drive circuit. The switch element connects the emitter and the ground in the case where the drive circuit has the IGBT perform a turn off switching operation.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: July 14, 2020
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Shigeki Sato
  • Publication number: 20200143980
    Abstract: A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.
    Type: Application
    Filed: January 3, 2020
    Publication date: May 7, 2020
    Applicant: TDK CORPORATION
    Inventors: Hitoshi OHKUBO, Masazumi ARATA, Manabu OHTA, Yuuya KANAME, Yoshihiro MAEDA, Takahiro KAWAHARA, Hokuto EDA, Shigeki SATO
  • Patent number: 10644311
    Abstract: An objective of the present invention is to provide a positive electrode active material that can inhibit the capacity changes associated with temperature variations, and an alkaline battery that contains this positive electrode active material. Aluminum and ytterbium are at least partially solid-dissolved in nickel hydroxide in the nickel composite hydroxide present in the positive electrode active material of the present invention.
    Type: Grant
    Filed: November 7, 2016
    Date of Patent: May 5, 2020
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, TANAKA CHEMICAL CORPORATION
    Inventors: Shigeki Sato, Makio Kon, Mikio Hata, Taiki Yasuda
  • Patent number: 10624207
    Abstract: A touch sensor of this disclosure includes: a printed circuit board having a connection terminal; a substrate portion having a mounting portion on which the printed circuit board is mounted; a conductive layer disposed on the mounting portion of the substrate portion; and an adhesive agent connecting the connection terminal and the conductive layer to each other. A plurality of linear projections arranged in a first direction and extending in a second direction intersecting with the first direction are disposed on a surface of the substrate portion at the mounting portion, and the conductive layer is disposed on a groove portion positioned between the linear projections disposed adjacently to each other out of the plurality of linear projections.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: April 14, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tsutomu Aisaka, Hirotoshi Watanabe, Shigeki Sato
  • Patent number: 10559417
    Abstract: A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: February 11, 2020
    Assignee: TDK CORPORATION
    Inventors: Hitoshi Ohkubo, Masazumi Arata, Manabu Ohta, Yuuya Kaname, Yoshihiro Maeda, Takahiro Kawahara, Hokuto Eda, Shigeki Sato
  • Patent number: 10522668
    Abstract: A semiconductor device, including a semiconductor substrate, an active region formed on the semiconductor substrate, and a gate runner disposed to surround the active region. The active region includes a first cell group in which a gate electrode of each cell is directly connected to the gate runner, and a second cell group in which a gate electrode of each cell is connected to the gate runner via a di/dt mitigating element. The di/dt mitigating element is a capacitor, a resistor connected in parallel to a capacitor, or an inverse-parallel-connected diode.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: December 31, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Shigeki Sato
  • Publication number: 20190385792
    Abstract: In a coil component and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.
    Type: Application
    Filed: August 29, 2019
    Publication date: December 19, 2019
    Inventors: Hitoshi OHKUBO, Masazumi ARATA, Manabu OHTA, Shou KAWADAHARA, Yoshihiro MAEDA, Takahiro KAWAHARA, Hokuto EDA, Shigeki SATO
  • Publication number: 20190386655
    Abstract: A power module which includes a power semiconductor chip that includes an IGBT and a freewheeling diode formed in the same chip, and the power module includes a drive circuit that is connected to the power semiconductor chip and drives the IGBT on/off. The power module is configured by packaging the power semiconductor chip and the drive circuit, and is characterized by further including a capacitor and a switch element disposed in series between the emitter of the IGBT and the ground of the drive circuit. The switch element connects the emitter and the ground in the case where the drive circuit has the IGBT perform a turn off switching operation.
    Type: Application
    Filed: August 30, 2019
    Publication date: December 19, 2019
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Shigeki Sato
  • Publication number: 20190387622
    Abstract: A touch sensor of this disclosure includes: a printed circuit board having a connection terminal; a substrate portion having a mounting portion on which the printed circuit board is mounted; a conductive layer disposed on the mounting portion of the substrate portion; and an adhesive agent connecting the connection terminal and the conductive layer to each other. A plurality of linear projections arranged in a first direction and extending in a second direction intersecting with the first direction are disposed on a surface of the substrate portion at the mounting portion, and the conductive layer is disposed on a groove portion positioned between the linear projections disposed adjacently to each other out of the plurality of linear projections.
    Type: Application
    Filed: March 8, 2018
    Publication date: December 19, 2019
    Inventors: TSUTOMU AISAKA, HIROTOSHI WATANABE, SHIGEKI SATO
  • Publication number: 20190386125
    Abstract: A power module which includes a power semiconductor module chip, a driver chip and a charge storage element. The power semiconductor module chip is configured by forming an IGBT having a trench gate structure including a dummy trench gate, and a freewheeling diode for returning excess carrier of the emitter of the IGBT to the collector of the IGBT, in the same chip. The drive chip is used for driving the IGBT on/off. The power module is configured by packaging the power semiconductor module chip and the drive chip. The charge storage element that is connected between the gate and emitter of a dummy IGBT which can be pseudo-formed in order that the dummy trench gate be used in screening examinations.
    Type: Application
    Filed: August 30, 2019
    Publication date: December 19, 2019
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Shigeki SATO
  • Patent number: 10468184
    Abstract: In a coil component 1 and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: November 5, 2019
    Assignee: TDK CORPORATION
    Inventors: Hitoshi Ohkubo, Masazumi Arata, Manabu Ohta, Shou Kawadahara, Yoshihiro Maeda, Takahiro Kawahara, Hokuto Eda, Shigeki Sato
  • Publication number: 20190267370
    Abstract: A semiconductor device is preferably excellent in characteristics such as a loss characteristic. Provided is a semiconductor device including a semiconductor substrate, including an upper-surface electrode provided on an upper surface of the semiconductor substrate; an lower-surface electrode provided on a lower surface of the semiconductor substrate; a transistor portion provided in the semiconductor substrate and connected to the upper-surface electrode and the lower-surface electrode; a first diode portion provided in the semiconductor substrate and connected to the upper-surface electrode and the lower-surface electrode; and a second diode portion provided in the semiconductor substrate and connected to the upper-surface electrode and the lower-surface electrode, wherein the first diode portion and the second diode portion have different resistivities in a depth direction of the semiconductor substrate.
    Type: Application
    Filed: December 21, 2018
    Publication date: August 29, 2019
    Inventors: Shigeki SATO, Seiji MOMOTA, Tadashi MIYASAKA