Patents by Inventor Shigeki Sawa
Shigeki Sawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8832935Abstract: A method for manufacturing a printed wiring board including providing a structure having a wiring substrate having a conductor circuit, a build-up multilayer structure formed over the wiring substrate and having an outermost conductor circuit and an outermost insulative resin layer, and a solder resist layer formed over the outermost conductor circuit and outermost insulative resin layer and having openings with an opening diameter D for mounting electronic elements, forming conductor pads with a pitch of about 200 pm or less on the outermost conductor circuit in the openings of the solder resist layer, respectively, and forming solder bumps with a height H from a surface of the solder resist layer on the conductor pads on the conductor pads, respectively, such that a ratio H/D is about 0.55 to about 1.0.Type: GrantFiled: November 23, 2010Date of Patent: September 16, 2014Assignee: Ibiden Co., Ltd.Inventors: Yoichiro Kawamura, Shigeki Sawa, Katsuhiko Tanno, Hironori Tanaka, Naoaki Fujii
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Patent number: 8721863Abstract: A method for plating a belt substrate including conveying a belt substrate through a plating tank, contacting an immersed cathode power-supply device and/or an auxiliary cathode power-supply device with the belt substrate conveyed into the interior of the plating tank such that the belt substrate becomes a cathode, and electrically plating a surface of the belt substrate in the interior of the plating tank while the immersed cathode power-supply device and/or the auxiliary cathode power-supply device maintains cathode power-supply to the belt substrate conveyed into the interior portion of the plating tank. The immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned in the interior portion of the plating tank and are electrically connected by a short circuit wiring.Type: GrantFiled: November 30, 2011Date of Patent: May 13, 2014Assignee: Ibiden Co., Ltd.Inventors: Yasuaki Tachi, Shigeki Sawa, Toshiyuki Kasuga
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Patent number: 8624132Abstract: A printed wiring board including a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. In the printed wiring board, since the at least one conductor pad is aligned at a pitch of about 200 ?m or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is about 1.05 to about 1.7, connection reliability and insulation reliability can be easily improved.Type: GrantFiled: May 17, 2011Date of Patent: January 7, 2014Assignee: Ibiden Co., Ltd.Inventors: Yoichiro Kawamura, Shigeki Sawa, Katsuhiko Tanno, Hironori Tanaka, Naoaki Fujii
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Patent number: 8448838Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.Type: GrantFiled: December 9, 2011Date of Patent: May 28, 2013Assignee: Ibiden Co., Ltd.Inventors: Shigeki Sawa, Katsuhiko Tanno, Osamu Kimura, Koji Kuribayashi
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Patent number: 8198546Abstract: A method of manufacturing a printed wiring board includes preparing a wiring substrate having a conductive circuit, coating a solder-resist layer over the conductive circuit, leveling a surface of the solder-resist layer so as to obtain a maximum surface roughness in a predetermined range, removing the resin film from the surface of the solder-resist layer, and forming multiple openings in the surface of the solder-resist layer to expose multiple portions of the conductive circuit so as to form multiple conductive pads for mounting an electronic components.Type: GrantFiled: November 23, 2007Date of Patent: June 12, 2012Assignee: Ibiden Co., Ltd.Inventors: Yoichiro Kawamura, Shigeki Sawa, Katsuhiko Tanno, Hironori Tanaka, Naoaki Fujii
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Patent number: 8157157Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.Type: GrantFiled: January 7, 2009Date of Patent: April 17, 2012Assignee: IBIDEN Co., Ltd.Inventors: Shigeki Sawa, Katsuhiko Tanno, Osamu Kimura, Koji Kuribayashi
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Publication number: 20120080505Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.Type: ApplicationFiled: December 9, 2011Publication date: April 5, 2012Applicant: IBIDEN, CO., LTD.Inventors: Shigeki Sawa, Katsuhiko Tanno, Osamu Kimura, Koji Kuribayashi
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Publication number: 20120080504Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.Type: ApplicationFiled: December 9, 2011Publication date: April 5, 2012Applicant: IBIDEN, CO., LTD.Inventors: Shigeki Sawa, Katsuhiko Tanno, Osamu Kimura, Koji Kuribayashi
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Publication number: 20120073977Abstract: A method for plating a belt substrate including conveying a belt substrate through a plating tank, contacting an immersed cathode power-supply device and/or an auxiliary cathode power-supply device with the belt substrate conveyed into the interior of the plating tank such that the belt substrate becomes a cathode, and electrically plating a surface of the belt substrate in the interior of the plating tank while the immersed cathode power-supply device and/or the auxiliary cathode power-supply device maintains cathode power-supply to the belt substrate conveyed into the interior portion of the plating tank. The immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned in the interior portion of the plating tank and are electrically connected by a short circuit wiring.Type: ApplicationFiled: November 30, 2011Publication date: March 29, 2012Applicant: IBIDEN CO., LTDInventors: Yasuaki TACHI, Shigeki Sawa, Toshiyuki Kasuga
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Patent number: 8128790Abstract: An apparatus that performs an electrolytic plating on a plating surface of a belt substrate is provided. The apparatus includes a plating tank, a conveyor device configured to carry a belt substrate through an interior of the plating tank, an immersed cathode power-supply section provided within the interior of the plating tank, an auxiliary cathode power-supply section provided within the interior of the plating tank, and short-circuit wiring configured to short-circuit the immersed cathode power-supply section to the auxiliary cathode power-supply section. A plating method for performing electrolytic plating on a plating surface of a belt substrate is provided.Type: GrantFiled: July 30, 2008Date of Patent: March 6, 2012Assignee: Ibiden Co., Ltd.Inventors: Yasuaki Tachi, Shigeki Sawa, Toshiyuki Kasuga
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Patent number: 8022314Abstract: A printed wiring board including a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. In the printed wiring board, since the at least one conductor pad is aligned at a pitch of about 200 ?m or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is about 1.05 to about 1.7, connection reliability and insulation reliability can be easily improved.Type: GrantFiled: November 19, 2009Date of Patent: September 20, 2011Assignee: Ibiden Co., Ltd.Inventors: Yoichiro Kawamura, Shigeki Sawa, Katsuhiko Tanno, Hironori Tanaka, Naoaki Fujii
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Patent number: 8017875Abstract: A printed wiring board includes a wiring substrate, one or more conductor circuits provided on the wiring substrate, a solder resist layer provided on a surface of the wiring substrate and having multiple openings, the openings exposing multiple parts of the conductor circuits forming multiple conductor pads for mounting electronic parts, and multiple solder bumps formed on the conductor pads, respectively. The conductor pads are aligned at a pitch of about 200 ?m or less, and a ratio W/D of a diameter W of the solder bumps to an opening diameter D of the openings formed in the solder resist layer is about 1.05 to about 1.7.Type: GrantFiled: June 29, 2006Date of Patent: September 13, 2011Assignee: Ibiden Co., Ltd.Inventors: Yoichiro Kawamura, Shigeki Sawa, Katsuhiko Tanno, Hironori Tanaka, Naoaki Fujii
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Publication number: 20110214915Abstract: A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. In the printed wiring board, since the at least one conductor pad is aligned at a pitch of about 200 ?m or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is about 1.05 to about 1.7, connection reliability and insulation reliability can be easily improved.Type: ApplicationFiled: May 17, 2011Publication date: September 8, 2011Applicant: IBIDEN CO., LTD.Inventors: Yoichiro KAWAMURA, Shigeki Sawa, Katsuhiko Tanno, Hironori Tanaka, Naoaki Fujii
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Patent number: 8003897Abstract: A printed wiring board includes a wiring substrate provided with at least one conductor circuit, a solder resist layer formed on the surface of the wiring substrate, covering the at least one conductor circuit, conductor pads formed on a part of the at least one conductor circuit exposed from respective openings provided in the solder resist layer for mounting electronic parts, and solder bumps formed on the respective conductor pads. Connection reliability and insulation reliability are easily improved by making the ratio (H/D) of a height H from solder resist layer surface the solder bump to an opening diameter of the opening about 0.55 to about 1.0 even in narrow pitch structure under the pitch of the opening provided in the solder resist layer of about 200 ?m or less.Type: GrantFiled: February 26, 2010Date of Patent: August 23, 2011Assignee: Ibiden Co., Ltd.Inventors: Yoichiro Kawamura, Shigeki Sawa, Katsuhiko Tanno, Hironori Tanaka, Naoaki Fujii
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Publication number: 20110061232Abstract: A method for manufacturing a printed wiring board including providing a structure having a wiring substrate having a conductor circuit, a build-up multilayer structure formed over the wiring substrate and having an outermost conductor circuit and an outermost insulative resin layer, and a solder resist layer formed over the outermost conductor circuit and outermost insulative resin layer and having openings with an opening diameter D for mounting electronic elements, forming conductor pads with a pitch of about 200 pm or less on the outermost conductor circuit in the openings of the solder resist layer, respectively, and forming solder bumps with a height H from a surface of the solder resist layer on the conductor pads on the conductor pads, respectively, such that a ratio H/D is about 0.55 to about 1.0.Type: ApplicationFiled: November 23, 2010Publication date: March 17, 2011Applicant: IBIDEN CO., LTD.Inventors: Yoichiro Kawamura, Shigeki Sawa, Katsuhiko Tanno, Hironori Tanaka, Naoaki Fujii
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Patent number: 7866529Abstract: A solder ball loading unit for loading a solder balls to be turned to a solder bumps on a connection pad of a printed wiring board, including a ball arranging mask having a plurality of openings corresponding to the connection pad of the printed wiring board, a cylinder member located above the ball arranging mask for gathering the solder balls just below the opening portion by sucking air from the opening portion, and a moving mechanism for moving the cylinder member in the horizontal direction, the moving mechanism moving the solder balls gathered on the ball arranging mask by moving the cylinder member and dropping the solder balls onto the connection pads of the printed wiring board through the opening in the ball arranging mask.Type: GrantFiled: December 4, 2008Date of Patent: January 11, 2011Assignee: Ibiden Co., Ltd.Inventors: Atsunori Sumita, Yoichiro Kawamura, Shigeki Sawa, Katsuhiko Tanno, Isao Tsuchiya, Yoshiyuki Mabuchi, Osamu Kimura
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Publication number: 20100155129Abstract: A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer formed on the surface of the wiring substrate, covering the at least one conductor circuit, conductor pads formed on a part of the at least one conductor circuit exposed from respective openings provided in the solder resist layer for mounting electronic parts, and solder bumps formed on the respective conductor pads. Connection reliability and insulation reliability are easily improved by making the ratio (H/D) of a height H from solder resist layer surface the solder bump to an opening diameter of the opening about 0.55 to about 1.0 even in narrow pitch structure under the pitch of the opening provided in the solder resist layer of about 200 ?m or less.Type: ApplicationFiled: February 26, 2010Publication date: June 24, 2010Applicant: IBIDEN CO., LTD.Inventors: Yoichiro KAWAMURA, Shigeki Sawa, Katsuhiko Tanno, Hironori Tanaka, Naoaki Fujii
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Patent number: 7714233Abstract: A printed wiring board including a wiring substrate provided with at least one conductor circuit, a solder resist layer formed on the surface of the wiring substrate, covering the at least one conductor circuit, conductor pads formed on a part of the at least one conductor circuit exposed from respective openings provided in the solder resist layer for mounting electronic parts, and solder bumps formed on the respective conductor pads. The ratio (H/D) of a height H of the solder bumps from solder resist layer surface to an opening diameter of the openings are made to be about 0.55 to about 1.0 with the pitch of the openings provided in the solder resist layer of about 200 ?m or less.Type: GrantFiled: June 29, 2006Date of Patent: May 11, 2010Assignee: Ibiden Co., Ltd.Inventors: Yoichiro Kawamura, Shigeki Sawa, Katsuhiko Tanno, Hironori Tanaka, Naoaki Fujii
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Publication number: 20100065323Abstract: A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. In the printed wiring board, since the at least one conductor pad is aligned at a pitch of about 200 ?m or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is about 1.05 to about 1.7, connection reliability and insulation reliability can be easily improved.Type: ApplicationFiled: November 19, 2009Publication date: March 18, 2010Applicant: IBIDEN CO., LTD.Inventors: Yoichiro Kawamura, Shigeki Sawa, Katsuhiko Tanno, Hironori Tanaka, Naoaki Fujii
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Publication number: 20090294516Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.Type: ApplicationFiled: January 7, 2009Publication date: December 3, 2009Applicant: IBIDEN, CO., LTD.Inventors: Shigeki Sawa, Katsuhiko Tanno, Osamu Kimura, Koji Kuribayashi