Patents by Inventor Shigeki Shimada

Shigeki Shimada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160187028
    Abstract: An immediate hot-water supplying system 1 includes a P hot water supply device 10 configured to heat water flowing through a first supply pipe 2, an N hot water supply device 30 configured to heat water flowing through a second supply pipe 3, a check valve 6, and a coupled controller 60 configured to, when the flow amount detected by a second flow amount sensor 34 is equal to or more than a hot-water-supply detection flow amount, perform a hot-water supply operation in which a first burner 12 or a second burner 32 is burned with a circulation pump 16 stopped, and when the flow amount detected by the second flow amount sensor 34 is less than the hot-water-supply detection flow amount, perform a circulation heat keeping operation in which the first burner 12 is burned with the circulation pump 16 activated.
    Type: Application
    Filed: December 31, 2014
    Publication date: June 30, 2016
    Inventors: Shigeki Shimada, Ai Yuge
  • Publication number: 20160186988
    Abstract: A boiler connection system includes: a plurality of heat source device; and a controller. Each of the plurality of heat source devices includes: a first heat exchanger; a heat medium heating circuit branching at one end thereof from a heat medium return pipe and connected at another end thereof to a heat medium outgoing pipe via the first heat exchanger; a bypass pipe connected to the heat medium heating circuit so as to bypass the first heat exchanger; a pressure-feed device provided on the heat medium heating circuit; a flow passage switching valve; a second heat exchanger provided on the bypass pipe; and a water heating circuit branching at one end thereof from the water supply pipe and connected at another end thereof to a hot water supply pipe via the second heat exchanger.
    Type: Application
    Filed: December 17, 2015
    Publication date: June 30, 2016
    Applicant: RINNAI CORPORATION
    Inventor: Shigeki Shimada
  • Publication number: 20160047558
    Abstract: A hot water supply and heating system 1a includes a heating flow rate changing valve 44 that changes the flow rate of hot water flowing through a heating pipe 46 and a priority controller 53a that carries out hot water supply priority control whereby to reduce the flow rate of the hot water flowing through the heating pipe 46 by the heating flow rate changing valve 44 in the case where the total of the amount of heat consumed in a heating operation and the amount of heat consumed in a hot water supply operation is equal to or more than a maximum amount of heat that can be applied by the heat source machine 10 during a simultaneous operation of the heating operation and the hot water supply operation.
    Type: Application
    Filed: August 18, 2014
    Publication date: February 18, 2016
    Inventors: Shigeki Shimada, Yasuo Niwa
  • Publication number: 20120231615
    Abstract: Substrates are mounted on a plurality of susceptors respectively. The plurality of susceptors on which respective substrates are mounted are placed on a rotational mechanism so that the susceptors are vertically spaced at a predetermined interval. The rotational mechanism on which the plurality of susceptors are placed is rotated. The plurality of susceptors on which the substrates are mounted respectively are heated. Semiconductor thin-films are deposited by supplying a source gas to each of the susceptors that are heated while being rotated, the source gas having been heated while passing through gas flow paths of respective path lengths substantially equal to each other.
    Type: Application
    Filed: February 25, 2011
    Publication date: September 13, 2012
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Hiromu Shiomi, Yasuhiko Senda, Satomi Itoh, Kazuhiro Fujikawa, Shigeki Shimada, Jun Genba, Takemi Terao, Masaru Furusho
  • Patent number: 7597066
    Abstract: There is provided a circulation type hot water supply device in which a downstream end of a hot water delivering channel 6 connected to a heat exchanger 4 of a water heater 1 is connected to a water supply channel 5 upstream of the heat exchanger, and a circulating pump 25 that returns hot water fed from the heat exchanger to the hot water delivering channel to the heat exchanger through the water supply channel is provided in the hot water delivering channel. The device can reliably identify an abnormality when it occurs, such as adhesion of a deposit to an inner surface of a heat absorbing pipe 4b to reduce heat exchange efficiency. A diagnosis is started when a hot water delivering tap 7 is closed and a burner 3 is subjected to combustion. In the diagnosis, supply of water to the heat exchanger 4 is first stopped to shut down the burner 3.
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: October 6, 2009
    Assignee: Rinnai Corporation
    Inventors: Shigeki Shimada, Masakazu Ando
  • Patent number: 7467956
    Abstract: A plurality of terminal fittings 11 are mounted to a housing 20, board connecting portions 13 having mounting portions 14 at lower ends protrude rearward, fixed fittings 30 having mounting plates 32 at lower edges are mounted to opposite side surfaces of the housing 20, and the mounting portion 14 of each terminal fitting 11 and the mounting plates 32 of the fixed fittings 30 are secured to a PCB 40 by reflow soldering. During the reflow soldering, a drawing force toward the PCB 40 acts on each of the terminal fittings 11 and the fixed fittings 30 based on surface tension of molten solder H, but the center of the fixed fitting 30 in the fore/aft direction of the board connecting portion 13 is positioned forward of the center of gravity position O of a connector 10, and rotation moment Mb toward the PCB 40 acts on the front of the housing 20 based on a drawing force Fb on the side of the fixed fitting 30 to prevent the front from being raised.
    Type: Grant
    Filed: September 27, 2005
    Date of Patent: December 23, 2008
    Assignees: Autonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Hiroki Hirai, Kenji Okamura, Masahide Hio, Tetsuya Aihara, Hiroshi Nakano, Shigeki Shimada
  • Publication number: 20080085616
    Abstract: A plurality of terminal fittings 11 are mounted to a housing 20, board connecting portions 13 having mounting portions 14 at lower ends protrude rearward, fixed fittings 30 having mounting plates 32 at lower edges are mounted to opposite side surfaces of the housing 20, and the mounting portion 14 of each terminal fitting 11 and the mounting plates 32 of the fixed fittings 30 are secured to a PCB 40 by reflow soldering. During the reflow soldering, a drawing force toward the PCB 40 acts on each of the terminal fittings 11 and the fixed fittings 30 based on surface tension of molten solder H, but the center of the fixed fitting 30 in the fore/aft direction of the board connecting portion 13 is positioned forward of the center of gravity position O of a connector 10, and rotation moment Mb toward the PCB 40 acts on the front of the housing 20 based on a drawing force Fb on the side of the fixed fitting 30 to prevent the front from being raised.
    Type: Application
    Filed: September 27, 2005
    Publication date: April 10, 2008
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD, SUMITOMO WIRING SYSTEMS, LTD, SUMITOMO ELECTRIC INDUSTRIES, LTD
    Inventors: Hiroki Hirai, Kenji Okamura, Masahide Hio, Tetsuya Aihara, Hiroshi Nakano, Shigeki Shimada
  • Publication number: 20070257122
    Abstract: There is provided a circulation type hot water supply device in which a downstream end of a hot water delivering channel 6 connected to a heat exchanger 4 of a water heater 1 is connected to a water supply channel 5 upstream of the heat exchanger, and a circulating pump 25 that returns hot water fed from the heat exchanger to the hot water delivering channel to the heat exchanger through the water supply channel is provided in the hot water delivering channel. The device can reliably identify an abnormality when it occurs, such as adhesion of a deposit to an inner surface of a heat absorbing pipe 4b to reduce heat exchange efficiency. A diagnosis is started when a hot water delivering tap 7 is closed and a burner 3 is subjected to combustion. In the diagnosis, supply of water to the heat exchanger 4 is first stopped to shut down the burner 3.
    Type: Application
    Filed: March 23, 2007
    Publication date: November 8, 2007
    Applicant: RINNAI CORPORATION
    Inventors: Shigeki Shimada, Masakazu Ando
  • Patent number: 7078921
    Abstract: A contact probe comprises a tip portion for making contact with a subject surface, a supporting portion, and a spring portion for connecting the other two members. The tip portion has a corner portion whose radius of curvature is larger than that of the opposite corner portion that moves in the lead during the scrubbing by the pressing force. The insulating layer on the subject surface is sufficiently removed by the scrubbing to secure the electrical contact, and the amount of shavings is minimized during the dissociation of the contact probe. Formation of scratches on the subject surface is reduced. Another contact probe for a ball-shaped electrode has a tip portion with a recess, which has a protrusion and bottom. The protrusion breaks the insulating layer on the electrode to secure the electrical contact. The bottom makes contact with the electrode to prevent the protrusion from excessively biting the electrode.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: July 18, 2006
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Tsuyoshi Haga, Shigeki Shimada, Atsushi Kimura
  • Publication number: 20040104737
    Abstract: A contact probe comprises a tip portion for making contact with a subject surface, a supporting portion, and a spring portion for connecting the other two members. The tip portion has a corner portion whose radius of curvature is larger than that of the opposite corner portion that moves in the lead during the scrubbing by the pressing force. The insulating layer on the subject surface is sufficiently removed by the scrubbing to secure the electrical contact, and the amount of shavings is minimized during the dissociation of the contact probe. Formation of scratches on the subject surface is reduced. Another contact probe for a ball-shaped electrode has a tip portion with a recess, which has a protrusion and bottom. The protrusion breaks the insulating layer on the electrode to secure the electrical contact. The bottom makes contact with the electrode to prevent the protrusion from excessively biting the electrode.
    Type: Application
    Filed: September 30, 2003
    Publication date: June 3, 2004
    Inventors: Tsuyoshi Haga, Shigeki Shimada, Atsushi Kimura
  • Patent number: 5087518
    Abstract: Granules of glass flakes which comprise glass flakes in granular form and a binder which bonds the glass flakes to one another to form granules. The granules are used together with a molten thermoplastic resin.
    Type: Grant
    Filed: November 2, 1990
    Date of Patent: February 11, 1992
    Assignee: Nippon Glass Fiber Co., Ltd.
    Inventors: Shigeki Shimada, Hidekazu Tanaka, Tsunefumi Nakagawa
  • Patent number: 5002827
    Abstract: Granules of glass flakes which comprise glass flakes in granular form and a binder which bonds the glass flakes to one another to form granules. The granules are used together with a molten thermoplastic resin.
    Type: Grant
    Filed: July 15, 1988
    Date of Patent: March 26, 1991
    Assignee: Nippon Glass Fiber Co., Ltd.
    Inventors: Shigeki Shimada, Hidekazu Tanaka, Tsunefumi Nakagawa