Abstract: A building material discharge head is provided with, a flow path structure which, by stacking multiple plate-form bodies having a through-hole and closing both ends of the through-holes, forms a flow path in the direction orthogonal to the through-holes and in a long direction of an elongate shape of the through-holes, and in which a discharge opening is formed in at least one end of the body to communicate with the path, a thin plate which closes one side of the path, which is at one end of the through-holes, a heating plate which is provided on the opposite side and which heats the inside of the path, a closing plate which is provided on the other surface of the path, which is the other end of the through-holes, and an LED which is provided near the discharge opening and which irradiates light along the direction of the path.

Abstract: A building material discharge head is provided which uses a flow path structure which can be produced with extremely low-cost materials such as plates, etc., and which can discharge, in a prescribed place, a prescribed amount of a building material, even one with a high viscosity. This building material discharge head is provided with, a first heating plate which configures a first lateral wall, which is a part of the lateral wall forming the flow path through which the material flows and which heats the material inside of the path, a closing plate which configures a second lateral wall, which is the part of the lateral wall other than the first lateral wall, a discharge opening which is formed at one end of the path and communicates with the path, and a material supply opening which is formed at the other end of the path and communicates with the path.

Abstract: A building material discharge head is provided with, a flow path structure which, by stacking multiple plate-form bodies having a through-hole and closing both ends of the through-holes, forms a flow path in the direction orthogonal to the through-holes and in a long direction of an elongate shape of the through-holes, and in which a discharge opening is formed in at least one end of the body to communicate with the path, a thin plate which closes one side of the path, which is at one end of the through-holes, a heating plate which is provided on the opposite side and which heats the inside of the path, a closing plate which is provided on the other surface of the path, which is the other end of the through-holes, and an LED which is provided near the discharge opening and which irradiates light along the direction of the path.

Abstract: A fixing device includes, a transfer section (3) for transferring a toner (42) to a recording medium (41), a heating section (1) provided at a downstream side of the recording medium from the transfer section, for heating the toner transferred in the transfer section until the toner becomes a softened state or a fluidized state (molten state), and a pressing and conveying section (2) provided at a downstream side of the recording medium from the heating section and conveying the recording medium while pressurizing, with a pressure roller (21), a surface of the recording medium on which the toner is attached.

Abstract: An object of the present invention is to provide a synthetic silica glass optical material which exhibits excellent transmittance as well as durability for high output power vacuum ultraviolet rays, being emitted from, for example, ArF excimer lasers and Xe.sub.2 excimer lamps, and to provide a method for producing the same. A synthetic silica glass optical material for high output power vacuum ultraviolet rays made from ultra high purity synthetic silica glass for use in the wavelength region of from 165 to 195 nm, containing OH groups at a concentration of from 5 to 300 wtppm with a fluctuation width in OH group concentration (.DELTA.OH/cm) of 10 wtppm or less, containing hydrogen molecules at a concentration of from 1.times.10.sup.17 to 1.times.10.sup.19 molecule/cm.sup.3 with a fluctuation width in hydrogen molecule concentration (.DELTA.H.sub.2 /cm) of 1.times.10.sup.17 molecule/cm.sup.3 or lower, and containing chlorine at a concentration of 50 wtppm or lower.

Abstract: A surface mounting type diode is provided which comprises: a diode chip; a pair of leads held in electrical conduction with the diode chip, each of the leads including an inner end, an outer end, a first bend closer to the inner end, a second bend closer to the outer end, and an intermediate portion between the first and second bends; and a resin package enclosing the diode chip together with part of the respective leads, the resin package having a flat bottom surface. The inner end, first bend, second bend and intermediate portion of the lead are contained in the resin package. Further, the outer end of the lead has an exposed flat mounting surface flush with the bottom surface of the resin package.

Abstract: A surface mounting type diode is provided which comprises: a diode chip; a pair of leads held in electrical conduction with the diode chip, each of the leads including an inner end, an outer end, a first bend closer to the inner end, a second bend closer to the outer end, and an intermediate portion between the first and second bends; and a resin package enclosing the diode chip together with part of the respective leads, the resin package having a flat bottom surface. The inner end, first bend, second bend and intermediate portion of the lead are contained in the resin package. Further, the outer end of the lead has an exposed flat mounting surface flush with the bottom surface of the resin package.

Abstract: A central region of the bottom surface of a resin in which a diode chip and a base end portion of each of two lead terminals electrically connected to the chip is burning-treated by irradiating a laser beam in order to remove fat and oil existing in the bottom surface. Thereby, the deterioration of adhesive strength of an adhesive agent for fixing the bottom surface of the resin to a circuit board is prevented.