Abstract: The invention is drawn to a polyarylene sulfide resin composition for optical communications parts, containing a polyarylene sulfide resin (A) having a melt viscosity of 8 to 20 Pa·s as measured at 300° C. and a shear rate of 500/sec and spherical silica (B) having a mean particle size of 3 to 25 &mgr;m and containing silica particles having a particle size of 1 &mgr;m or less in an amount of 50 wt. % or less based on the entire amount of the silica, the component (A) content being 15 wt. % or more and less than 20 wt. % and the component (B) content being more than 80 wt. % and 85 wt. % or less, based on the sum of the weights of the components (A) and (B). According to the invention, a polyphenylene sulfide resin composition suitably used for forming optical communications parts such as optical fiber connector ferrules and sleeves can be provided.

Abstract: Provided is a polyarylene sulfide resin composition for sealing electronic parts, which comprises (A) from 20 to 35% by weight of a polyarylene sulfide resin, (B) from 60 to 75% by weight of silica, and (C) from 1 to 10% by weight of an elastomer, and contains (D) from 0.05 to 1.2 parts by weight of an epoxysilane and/or (E) from 0.1 to 3 parts by weight of an epoxy resin, both relative to 100 parts by weight of the total amount of the components (A), (B) and (C). The composition has good PCT and TCT acceptable quality and good fluidity, naturally having good properties intrinsic to ordinary PAS resin, and which, when used for sealing electronic parts, causes neither deformation of bonding wires and other elements nor package breakdown, and is therefore favorable to materials for sealing electronic parts.

Abstract: Provided is a polyarylene sulfide resin composition comprising (A) from 20 to 34% by weight of a polyarylene sulfide having a melt viscosity of from 150 to 800 poises, (B) from 66 to 80% by weight of spherical silica having a mean particle size of from 0.3 to 10 &mgr;m, and (C) from 0 to 12% by weight of whiskers, in which the total of the spherical silica (B) and the whiskers (C) falls between 66 and 80% by weight. The composition has well-balanced physical properties of dimensional accuracy and mechanical strength, and has good moldability. It is favorable to moldings for precision members such as optical fiber connector ferrules, etc.

Abstract: Provided is a polyarylene sulfide (PAS) resin composition having extremely high dimensional accuracy and favorable to fiber-optics connector members, etc. The PAS resin composition for optical telecommunication members comprises (A) from 20 to 35% by weight of a polyarylene sulfide having a crystallization temperature, as measured through differential scanning calorimetry, of not lower than 250° C., and (B) from 65 to 80% by weight of silica, preferably spherical silica having a mean particle size of from 1 to 10 &mgr;m.

Abstract: Provided is a polyarylene sulfide resin composition comprising (A) from 20 to 34% by weight of a polyarylene sulfide having a melt viscosity of from 150 to 800 poises, (B) from 66 to 80% by weight of spherical silica having a mean particle size of from 0.3 to 10 &mgr;m, and (C) from 0 to 12% by weight of whiskers, in which the total of the spherical silica (B) and the whiskers (C) falls between 66 and 80% by weight. The composition has well-balanced physical properties of dimensional accuracy and mechanical strength, and has good moldability. It is favorable to moldings for precision members such as optical fiber connector ferrules, etc.

Abstract: A polyarylene sulfide resin composition comprising (A) a polyarylene sulfide resin, (B) an aliphatic or saturated cyclic polycarbodiimide resin or a precursor thereof, and preferably (C) reactive silicone compound grains, and (D) a polyethylene naphthalate resin or (E) a filler, which improves excellent properties exhibited by polyarylene sulfide resins, and which is also endowed with an excellent adhesion characteristics to adhesives such as epoxy resins. In addition, a molded article obtained by molding a polyarylene sulfide resin composition endowed with such excellent properties is useful as a container for accommodating an electric component material. Such a molded article may also be used as an electronic component having conductive portions which are totally or partially accommodated in the container, wherein the conductive portions are seled by a sealant encapsulated in the container.

Abstract: Disclosed are slide members for parts to be in contact with magnetic tape, which are made of polyarylenesulfide resin compositions comprising from 20 to 40% by weight of a polyarylenesulfide resin optionally combined with an amorphous, thermoplastic resin, and from 60 to 80% by weight of calcium metasilicate whiskers having a mean fiber diameter of not larger than 5 .mu.m and a mean aspect ratio of not smaller than 5, optionally combined with an inorganic filler. While being shaped, the resin compositions have good fluidity. The slide members are used in electric and electronic devices as the parts to be in contact with magnetic tape, for example, as VTR cylinders (drums). The slide members have high mechanical strength and good dimensional stability, and have good slidability with magnetic tape.

Abstract: A process for producing a resin foam by using an aqueous medium, which comprises(a) treating a resin compound with said aqueous medium to cause the aqueous medium to adhere to and be held by the resin compound, said resin compound being composed of porous agglomerated particles resulting from partial melt-adhesion of thermoplastic resin particles coated with a fine hydrophilic solid powder which does not substantially melt at the melting temperature of the resin particles, said solid powder being embedded in the resin particles but partly exposed at their surfaces,(b) melt-kneading the resin compound treated with the aqueous medium under such an elevated pressure that evaporation of the aqueous medium is substantially inhibited, and(c) thereafter releasing the kneaded resin composition from the pressurized state to foam it; and a thermoplastic resin compound used for the aforesaid process.

Abstract: An apparatus for forming a cross-oriented film which apparatus includes a device for maintaining the temperature of a thermoplastic synthetic resin tubular film below the melting point, and above the secondary transition temperature thereof, a twist-preventing device for pressing and feeding the tubular film in the film-forming direction, a cross-orientation device for holding the tubular film and for rotating the same, while vertically disposed, relative to the film-forming direction at a peripheral speed two or more times as fast as the feeding speed of the twist-preventing device, and a take-up device for successively flattening the tubular film into two layers.