Abstract: A wiring substrate includes a multilayer core substrate including a core layer, core conductor layers, and core insulating layers, a first laminate formed on first surface of the substrate and including insulating layers and conductor layers such that each insulating layer includes resin without reinforcing material, and a second laminate formed on second surface of the substrate and including insulating layers and conductor layers such that each insulating layer includes resin without reinforcing material.

Abstract: A wiring substrate includes a substrate including conductor layers and core insulating layers, and a laminate including insulating layers and conductor layers such that the conductor layers include first layer including first line pattern. The laminate includes first strip line including the first pattern, a pair of interlayer insulating layers sandwiching the first pattern, and a pair of conductor layers sandwiching the interlayer layers, the conductor layers in the substrate include second layer including second line pattern such that the substrate includes second strip line including the second pattern, a pair of core insulating layers sandwiching the second pattern, and a pair of conductor layers sandwiching the core insulating layers, and the pair of core insulating layers is thicker than the pair of interlayer layers, the second pattern is thicker than the first pattern, and line width of the second pattern is larger than line width of the first pattern.

Abstract: A wiring substrate includes a multilayer core substrate including a core layer, core conductor layers, and core insulating layers, a first laminate formed on first surface of the substrate and including insulating layers and conductor layers such that each insulating layer includes resin without reinforcing material, and a second laminate formed on second surface of the substrate and including insulating layers and conductor layers such that each insulating layer includes resin without reinforcing material.

Abstract: A wiring substrate includes a substrate including conductor layers and core insulating layers, and a laminate including insulating layers and conductor layers such that the conductor layers include first layer including first line pattern. The laminate includes first strip line including the first pattern, a pair of interlayer insulating layers sandwiching the first pattern, and a pair of conductor layers sandwiching the interlayer layers, the conductor layers in the substrate include second layer including second line pattern such that the substrate includes second strip line including the second pattern, a pair of core insulating layers sandwiching the second pattern, and a pair of conductor layers sandwiching the core insulating layers, and the pair of core insulating layers is thicker than the pair of interlayer layers, the second pattern is thicker than the first pattern, and line width of the second pattern is larger than line width of the first pattern.