Patents by Inventor Shigemitsu Sato

Shigemitsu Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vacuum Processing Apparatus
    Publication number: 20110180402
    Abstract: To provide a vacuum processing apparatus capable of supporting and conveying a substrate by a method suitable for a processing content in each processing step and capable of suppressing various mechanisms provided within a processing chamber from being adversely affected. More particularly, the CVD chamber of the apparatus is configured to be horizontal, and hence the above-mentioned problem can be solved. Further, by configuring a sputtering apparatus as the vertical type processing apparatus, problems with abnormal electrical discharge can be solved.
    Type: Application
    Filed: October 7, 2009
    Publication date: July 28, 2011
    Applicant: ULVAC, INC.
    Inventors: Takaomi Kurata, Junya Kiyota, Makoto Arai, Yasuhiko Akamatsu, Satoru Ishibashi, Shin Asari, Kazuya Saito, Shigemitsu Sato, Masashi Kikuchi
  • Sputter source, sputtering device, and sputtering method
    Patent number: 7347919
    Abstract: According to the invention, when targets are sputtered, each of them moves with respect to a substrate; and therefore, the entire area of the substrate is opposed to the targets during sputtering, so that a film of homogeneous quality can be formed on the surface of the substrate. During the sputtering, not only the targets but also magnetic field forming devices are moved relative to the targets, and therefore, a large area of the targets can be sputtered. In addition, when the magnetic field forming devices are also moved with respect to the substrate, the region of the target which is highly sputtered, moves with respect to the substrate, so that the thickness distribution of the film formed on the substrate can be even more uniform.
    Type: Grant
    Filed: May 19, 2004
    Date of Patent: March 25, 2008
    Assignee: ULVAC, Inc.
    Inventors: Shigemitsu Sato, Masasuke Matsudai, Hiroki Oozora, Junya Kiyota, Hajime Nakamura, Satoru Ishibashi, Atsushi Ota
  • Sputter source, sputtering device, and sputtering method
    Publication number: 20040231973
    Abstract: According to the invention, when targets are sputtered, each of them moves with respect to a substrate; and therefore, the entire area of the substrate is opposed to the targets during sputtering, so that a film of homogeneous quality can be formed on the surface of the substrate. During the sputtering, not only the targets but also magnetic field forming devices are moved relative to the targets, and therefore, a large area of the targets can be sputtered. In addition, when the magnetic field forming devices are also moved with respect to the substrate, the region of the target which is highly sputtered, moves with respect to the substrate, so that the thickness distribution of the film formed on the substrate can be even more uniform.
    Type: Application
    Filed: May 19, 2004
    Publication date: November 25, 2004
    Applicant: ULVAC, INC.
    Inventors: Shigemitsu Sato, Masasuke Matsudai, Hiroki Oozora, Junya Kiyota, Hajime Nakamura, Satoru Ishibashi, Atsushi Ota