Abstract: A thermosensitive part sensing temperature; a temperature sensor for measurement provided in the unit and measuring temperature by contacting the unit with a body to be measured; a temperature detecting part detecting, from when the unit contacts the body, the time when the sensor senses a difference from an initial temperature of the sensor, and a measured temperature of the sensor at that time, and detecting, from when the difference is sensed, a time after a certain length of time and a measured temperature of the sensor at that time; an estimating part estimating, from the time when the difference is sensed and a time after a certain length of time, the time when the thermosensitive part contacts the body, and the measured temperature at that time; and a heat conduction analyzing part estimating the measured temperature based on output information from the temperature detecting part and the estimating part.

Abstract: A temperature measurement device (10) comprises: a thermosensitive unit (41) that senses temperature; a thin film thermosensitive element (1) for measurement capable of measuring the temperature by bringing the thermosensitive unit (41) into contact with a subject; a thin film thermosensitive element (2) for protective heating disposed to enable heat exchange with the thin film thermosensitive element (1) via an insulating layer (S1), and controlled so that the temperature thereof is equal to the temperature of the thin film thermosensitive element (1); a temperature control element (3) capable of causing the thin film thermosensitive element (1) to be in a temperature state in which the temperature thereof is a certain degree lower than the temperature of the subject; and a control processing unit (5) controlling the thin film thermosensitive element (1), the thin film thermosensitive element (2), and the temperature control element (3).

Abstract: A cooling device includes a heat receiver that receives heat of an electronic component via a coolant, a heat discharger that discharges heat of the coolant from the heat receiver, and a circulation flow path through which the coolant flows from the heat receiver to the heat discharger and the coolant flows from the heat discharger to the heat receiver. The heat receiver is provided with an attachment surface to which a plurality of the electronic components are attached, a first flow path that communicates with the circulation flow path, and a plurality of surface area increasing members that communicate with the first flow path and that are provided on a rear surface of the attachment surface corresponding to the plurality of electronic components.

Abstract: A cooling device includes a heat receiver that receives heat of an electronic component via a coolant, a heat discharger that discharges heat of the coolant from the heat receiver, and a circulation flow path through which the coolant flows from the heat receiver to the heat discharger and the coolant flows from the heat discharger to the heat receiver. The heat receiver is provided with an attachment surface to which a plurality of the electronic components are attached, a first flow path that communicates with the circulation flow path, and a plurality of surface area increasing members that communicate with the first flow path and that are provided on a rear surface of the attachment surface corresponding to the plurality of electronic components.

Abstract: To provide a method for improving the flavor of an alcohol-containing beverage. Provided are a method of leaving an alcohol-containing beverage at rest that includes leaving an alcohol-containing beverage at rest so that the liquid of the alcohol-containing beverage does not substantially move, and an alcohol-containing beverage with improved flavor that can be obtained by this method.

Abstract: When a temperature of a semiconductor wafer is controlled to be a target temperature by raising the temperature of the semiconductor wafer, switching is performed so that a high-temperature circulating liquid at a temperature higher than the target temperature in a high-temperature tank is supplied into an inside-stage flow channel, and respective thermoelectric elements in a plurality of zones in a stage are controlled; and then, the temperature of the semiconductor wafer matches the target temperature and a desired in-plane temperature distribution of the semiconductor wafer is provided.

Abstract: Disclosed is a piston cooling device wherein the cooling efficiency of a piston is improved by oil injected from an oil jet and supplied to a cooling passage provided in the piston, and the amount of cooling oil is reduced when an internal combustion engine is operated at maximum output. The piston cooling device is provided with a piston for an internal combustion engine, in which a circumferential passage and a cooling passage having an inlet passage and an outlet passage are provided, and an oil jet for injecting oil from an injection port to the inlet passage. The oil jet injects oil at every stroke of the piston so that a two-phase plug flow composed of gas and oil is formed in the cooling passage at least when an internal combustion engine is operated at maximum output.

Abstract: Disclosed is a piston cooling device wherein the cooling efficiency of a piston is improved by oil injected from an oil jet and supplied to a cooling passage provided in the piston, and the amount of cooling oil is reduced when an internal combustion engine is operated at maximum output. The piston cooling device is provided with a piston for an internal combustion engine, in which a circumferential passage and a cooling passage having an inlet passage and an outlet passage are provided, and an oil jet for injecting oil from an injection port to the inlet passage. The oil jet injects oil at every stroke of the piston so that a two-phase plug flow composed of gas and oil is formed in the cooling passage at least when an internal combustion engine is operated at maximum output.

Abstract: A manufacturing time of a semiconductor device is shortened by raising and dropping a base temperature of a semiconductor wafer such as silicon wafer to a target temperature at a high speed, a semiconductor device is manufactured with high qualities by making an in-plane temperature distribution of the semiconductor wafer a desired temperature distribution with high accuracy (by uniformizing an in-plane temperature and varying the in-plane temperature distribution for each region), and furthermore, an apparatus with excellent energy efficiency can be simply configured.

Abstract: There are provided an device for controlling temperature by Peltier element and a method for controlling temperature by the same, wherein the structure of the device can be simplified, the cost making the device can be reduced and an accuracy of the temperature control of a contact plane based on the detected temperature value with a temperature sensor can be improved by capacitating insulation for a Peltier element and related elements without providing a vacuum case and related elements for encapsulating a Peltier element and related elements.

Abstract: A jet stream injection device for use in a heat exchanger of a fluidized-bed type in which a flat jet stream is injected toward a heat transmission coil of the heat exchanger from below this coil so that is runs along said cell so as to form a mixed-phase flow of a gas and solid particles around the heat transmission coil. The jet stream injection device has a net with meshes smaller than the size of the particles of a fluidized bed provided over an opening provided on the upstream side of a jet stream generating slit-shaped injection port element. The opening has a larger passage sectional area than the injection port element.