Abstract: A chip forming position specifying method for applying chip IDs indicative of positions on a wafer where semiconductor chips are formed, and thereby specifying their positions. In the chip forming position specifying method, different marks are formed for every chip in a transfer mask (hereinafter called “mark forming mask”) used to form a wiring layer, in addition to normal functional wirings. The positions of the chips on the wafer are respectively specified according to combinations of the marks of a plurality of the mark forming masks, which have been transferred onto the wafer.

Abstract: A chip forming position specifying method for applying chip IDs indicative of positions on a wafer where semiconductor chips are formed, and thereby specifying their positions. In the chip forming position specifying method, different marks are formed for every chip in a transfer mask (hereinafter called “mark forming mask”) used to form a wiring layer, in addition to normal functional wirings. The positions of the chips on the wafer are respectively specified according to combinations of the marks of a plurality of the mark forming masks, which have been transferred onto the wafer.

Abstract: A chip forming position specifying method for applying chip IDs indicative of positions on a wafer where semiconductor chips are formed, and thereby specifying their positions. In the chip forming position specifying method, different marks are formed for every chip in a transfer mask (hereinafter called “mark forming mask”) used to form a wiring layer, in addition to normal functional wirings. The positions of the chips on the wafer are respectively specified according to combinations of the marks of a plurality of the mark forming masks, which have been transferred onto the wafer.

Abstract: The present invention provides a chip forming position specifying method for applying chip IDs indicative of positions on a wafer where semiconductor chips are formed, and thereby specifying their positions. In the chip forming position specifying method, marks different every chip are formed in a transfer mask (hereinafter called “mark forming mask”) used to form a wiring layer, in addition to normal functional wirings. The positions of the chips on the wafer are respectively specified according to combinations of the marks of a plurality of the mark forming masks, which have been transferred onto the wafer.

Abstract: A semiconductor device is provided which is obtained by wire bonding without any drop in wire bonding characteristics. A bonding pad is prepared on which a wire bonding region and a test region that is separate from the wire bonding region are defined. A characteristic test is performed on the semiconductor element in the test region. Wire bonding in which a wire is connected is performed in the wire bonding region.

Abstract: A semiconductor device is provided which is obtained by wire bonding without any drop in wire bonding characteristics. A bonding pad is prepared on which a wire bonding region and a test region that is separate from the wire bonding region are defined. A characteristic test is performed on the semiconductor element in the test region. Wire bonding in which a wire is connected is performed in the wire bonding region.