Patents by Inventor Shigenari Ohtake

Shigenari Ohtake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6451448
    Abstract: A surface treated metallic material according to the present invention comprises a metallic substrate and a metallic compound layer formed thereon, wherein the entire surface of the metallic compound layer is covered with minute, upright, scaly protrusions. The width in the major axial direction of the scaly protrusions is between 0.05˜0.5 &mgr;m and the thickness between 0.01˜0.1 &mgr;m, and the thickness of the metallic compound layer is between 0.1˜1.0 &mgr;m. The metallic compound layer incorporates one, or two or more of, the materials selected from the group consisting of chromium oxide, chromium hydroxide, niobium oxide, niobium hydroxide, rhodium oxide, rhodium hydroxide, vanadium oxide, vanadium hydroxide, palladium oxide, palladium hydroxide, nickel oxide, and nickel hydroxide. By using surface treated metallic materials of this type, bonding strength to a resin layer can be improved.
    Type: Grant
    Filed: December 22, 1999
    Date of Patent: September 17, 2002
    Assignee: Mitsubishi Shindoh Co. Ltd.
    Inventors: Yuichi Kanda, Sin-ei Satoh, Shigenari Ohtake, Takeshi Suzuki, Hiroyuki Natume