Abstract: A semiconductor-chip mounting substrate with a high degree of reliability of an electrical connection between a substrate and a semiconductor chip such as IC chips is provided. The substrate has at least one projection thereon, which is integrally molded with the substrate. A conductive layer is formed on the projection to obtain a first bump. The semiconductor chip has a terminal projecting as a second bump on its surface. The semiconductor chip is mounted on the substrate such that the first bump contacts the second bump. A required contact pressure between the first bump and the second bump is held by use of a pressure holding means.

Abstract: A semiconductor-chip mounting substrate with a high degree of reliability of an electrical connection between a substrate and a semiconductor chip such as IC chips is provided. The substrate has at least one projection thereon, which is integrally molded with the substrate. A conductive layer is formed on the projection to obtain a first bump. The semiconductor chip has a terminal projecting as a second bump on its surface. The semiconductor chip is mounted on the substrate such that the first bump contacts the second bump. A required contact pressure between the first bump and the second bump is held by use of a pressure holding means.

Abstract: An acceleration sensor element constitutes a piezoresistance type acceleration sensor in which an acceleration sensor chip including a cantilever structure of mass and beam parts and a piezoresistor formed on the beam part is mounted on a main lead which is slanted for positioning the piezoresistor and the center of gravity of the mass part substantially on the same horizontal plane in a mounted state of the sensor. The element thereby improves the reliability and assures such property as other-axis sensitivity of the sensor at the time of shipment.

Abstract: An infrared detecting arrangement includes an infrared detecting element having a heat insulating film and an infrared detector which are disposed between an interior space of a hermetically sealed casing for the element and a cavity formed within a substrate of the element and communicating through a ventilator with the interior space.

Abstract: A semiconductor device includes a circuit pattern of a conductive thin film formed on a ceramic substrate by means of an etching, and an IC chip connected to the etched circuit pattern through a gang-bonding in which respective pads of conduction parts of the circuit pattern and of the IC chip directly contact with each other. The circuit pattern can be thereby provided densely, and contributive to a higher integration of the IC chip.