Patents by Inventor Shigenobu Asada

Shigenobu Asada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250091172
    Abstract: A measurement device includes: a sensor that acquires image information by imaging an object targeted for addition of materials or cutting; a measurement unit that acquires measurement data by measuring the shape of the object on the basis of the image information, the measurement data representing a shape of the object; a missing region detecting unit that detects a missing region of the object; a measurement data complementing unit that acquires re-measurement data by re-measuring the shape of the object on the basis of the image information which the sensor has acquired by re-imaging, and complements the measurement data with the re-measurement data; and a machining region specifying unit that specifies a machining region for the addition or the cutting, on the basis of the complemented measurement data and a model of a finished product obtained by the addition or the cutting.
    Type: Application
    Filed: August 10, 2021
    Publication date: March 20, 2025
    Applicant: Mitsubishi Electric Corporation
    Inventor: Shigenobu ASADA
  • Patent number: 7431868
    Abstract: A metal substrate for an oxide superconducting wire, which comprises a polycrystalline metal substrate with a rolled aggregate structure having a {100} plane which is parallel to the rolled surface and a <001> axis which is parallel to the rolling direction, and an oxide crystal layer comprising an oxide of the polycrystalline metal and formed on a surface of the polycrystalline metal substrate, wherein at least 90% of grain boundaries in the oxide crystal layer have an inclination of 10° or less, and at least 90% of the {100} plane of the oxide crystal layer make an angle of 10° or less with the surface of the polycrystalline metal substrate.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: October 7, 2008
    Assignees: The Furukawa Electric Co., Ltd., International Superconductivity Technology Center, Sumitomo Electric Industries Ltd.
    Inventors: Toshihiko Maeda, Toru Izumi, Katsuya Hasegawa, Shigenobu Asada, Teruo Izumi, Yuh Shiohara
  • Publication number: 20060019832
    Abstract: A metal substrate for an oxide superconducting wire, which comprises a polycrystalline metal substrate with a rolled aggregate structure having a {100} plane which is parallel to the rolled surface and a <001> axis which is parallel to the rolling direction, and an oxide crystal layer comprising an oxide of the polycrystalline metal and formed on a surface of the polycrystalline metal substrate, wherein at least 90% of grain boundaries in the oxide crystal layer have an inclination of 10° or less, and at least 90% of the {100} plane of the oxide crystal layer make an angle of 10° or less with the surface of the polycrystalline metal substrate.
    Type: Application
    Filed: September 30, 2005
    Publication date: January 26, 2006
    Applicants: The Furukawa Electric Co., Ltd., International Superconductivity Technology Ctr., Sumitomo Electric Industries, Ltd.
    Inventors: Toshihiko Maeda, Toru Izumi, Katsuya Hasegawa, Shigenobu Asada, Teruo Izumi, Yuh Shiohara