Abstract: A testing method of a semiconductor integrated circuit device includes a testing step of conducting a functional test by supplying test pattern data to a semiconductor integrated circuit device mounted upon a testing apparatus, and a post processing step conducted after the testing step for continuously driving the semiconductor integrated circuit device by supplying dummy test pattern to the semiconductor integrated circuit device, wherein the test pattern data is supplied with a first system clock speed while the dummy test pattern data is supplied with a second, slower system clock speed, the post processing step switching a system clock speed of the testing apparatus from the first system clock speed to the second system clock speed at the same time as finishing of the testing step.

Abstract: A probe card is used to test an electronic device. The probe card includes a base plate and a cantilever-type probe arranged on the base plate. The cantilever-type probe has an end that contacts the contacted body and moves when contacting the contacted body. A stopper arranged on the base plate restricts the movement of the cantilever-type probe.

Abstract: A probe card that is manufactured inexpensively. The probe card includes a base plate, a flexible substrate, and a contact probe. The contact probe is a flexible substrate formed from polyimide resin. The contact probe has a plurality of parallel wires. Each wire has a distal end that functions as a contact. The contact probe is produced by cutting a general purpose substrate having a plurality of parallel wires formed at a predetermined pitch. The number of the parallel wires is equal to the number of pads of an LSI chip.

Abstract: A testing method of a semiconductor integrated circuit device includes a testing step of conducting a functional test by supplying test pattern data to a semiconductor integrated circuit device mounted upon a testing apparatus, and a post processing step conducted after the testing step for continuously driving the semiconductor integrated circuit device by supplying dummy test pattern to the semiconductor integrated circuit device, wherein the test pattern data is supplied with a first system clock speed while the dummy test pattern data is supplied with a second, slower system clock speed, the post processing step switching a system clock speed of the testing apparatus from the first system clock speed to the second system clock speed at the same time as finishing of the testing step.

Abstract: A probe card that is manufactured inexpensively. The probe card includes a base plate, a flexible substrate, and a contact probe. The contact probe is a flexible substrate formed from polyimide resin. The contact probe has a plurality of parallel wires. Each wire has a distal end that functions as a contact. The contact probe is produced by cutting a general purpose substrate having a plurality of parallel wires formed at a predetermined pitch. The number of the parallel wires is equal to the number of pads of an LSI chip.

Abstract: A probe card that is manufactured inexpensively. The probe card includes a base plate, a flexible substrate, and a contact probe. The contact probe is a flexible substrate formed from polyimide resin. The contact probe has a plurality of parallel wires. Each wire has a distal end that functions as a contact. The contact probe is produced by cutting a general purpose substrate having a plurality of parallel wires formed at a predetermined pitch. The number of the parallel wires is equal to the number of pads of an LSI chip.

Abstract: An inexpensive probing card that has probe pins for contacting pads with high reliability. The probe pins are arranged on a base plate. The probe pins move along the pads when contacting the pads. A stopper restricts the movement of the probe pins.

Abstract: An inexpensive probing card that has probe pins for contacting pads with high reliability. The probe pins are arranged on a base plate. The probe pins move along the pads when contacting the pads. A stopper restricts the movement of the probe pins.

Abstract: An optical disk substrate is disclosed, which is molded from a terpolymer composed of (A) an aromatic vinyl monomer, (B) cyclohexylmaleimide, and (C) at least one compound selected from the group consisting of (meth)acrylonitrile, isobornyl (meth)acrylate and cyclohexyl (meth)acrylate, with the cyclohexyl maleimide being copolymerized in an amount of from 5 to 60 wt % of said terpolymer. The optical disk substrate exhibits high heat resistance, low water absorption and low birefringence.

Abstract: An aqueous dispersion having good stability and fluidity, and a process for production thereof. The aqueous dispersion is produced by polymerizing (a) a specified amount of an ethylenically unsaturated monomer capable of forming a water-soluble polymer in (b) a specified amount of an aqueous solution containing a water-soluble polymer while adjusting the weight ratio of (a) to (b) to from 1:5 to 5:1.

Abstract: Resin compositions of high adhesivity which comprise (A) ethylene-vinylacetate copolymer or mixture of said copolymer with polyethylene, (B) chlorinated or chlorosulfonated polyethylene, (C) unsaturated carboxylic acids maintaining solid at room temperature and (D) organic peroxides or these components blended with phenolic compounds and/or acid-acceptors.