Patents by Inventor Shigenobu Kida

Shigenobu Kida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10358773
    Abstract: The present invention relates to a resin fine particle dispersion optimal for manufacturing a sheet product such as paper. Specifically, an object of the present invention is to provide a resin fine particle dispersion with which a sheet product having excellent heat resistance and high mechanical strength is obtained, and which has a small environmental load due to a small amount of resin particles remaining in wastewater after papermaking. Provided are a resin fine particle dispersion including resin fine particles (A), a fiber material (B), an ionic polyacrylamide (C), and water as essential components, and a sheet product and a friction plate using this.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: July 23, 2019
    Assignee: DIC Corporation
    Inventors: Seiji Kimoto, Shigenobu Kida
  • Patent number: 9963536
    Abstract: Disclosed are a phenolic hydroxyl group-containing resin which has excellent alkali developing properties and makes it possible to exhibit high heat resistance in a cured product obtained therefrom, a production method therefor, a photosensitive composition, a resist material, a coating film, a curable composition and a cured product thereof, and a resist underlayer film. A phenolic hydroxyl group-containing resin, including a compound (A) having a molecular structure represented by the following Structural Formula (1). (In the formula, R1 represents an alkyl group, an alkoxy group, or an aryl group, R2 represents a hydrogen atom, an alkyl group, or an aryl group, m is an integer of 1 to 3, and n is an integer of 2 to 15. In the case where m is 2 or more, plural R1's may be the same as or different from each other.
    Type: Grant
    Filed: May 28, 2015
    Date of Patent: May 8, 2018
    Assignee: DIC Corporation
    Inventors: Tomoyuki Imada, Seiji Kimoto, Shigenobu Kida
  • Publication number: 20180105632
    Abstract: In order to provide a curing agent (alkoxylated resole-type phenolic resin) with which a coating film having high hot-water resistance, high workability, and high adhesion to metals may be formed without limiting the main agent to be a bisphenol-A-type epoxy resin, the present invention provides a method for producing an alkoxylated resole-type phenolic resin. The method includes reacting a phenol (a1) including meta-cresol with an aldehyde (a2) in the presence of a basic compound to prepare a resole-type phenolic resin (A); and reacting the resole-type phenolic resin (A) with an alcohol (B) in the presence of an acidic compound having an acid dissociation constant (pKa) of 0 or less.
    Type: Application
    Filed: December 14, 2017
    Publication date: April 19, 2018
    Inventors: Takakazu Kage, Shigenobu Kida
  • Publication number: 20180044857
    Abstract: The present invention relates to a resin fine particle dispersion optimal for manufacturing a sheet product such as paper. Specifically, an object of the present invention is to provide a resin fine particle dispersion with which a sheet product having excellent heat resistance and high mechanical strength is obtained, and which has a small environmental load due to a small amount of resin particles remaining in wastewater after papermaking. Provided are a resin fine particle dispersion including resin fine particles (A), a fiber material (B), an ionic polyacrylamide (C), and water as essential components, and a sheet product and a friction plate using this.
    Type: Application
    Filed: March 1, 2016
    Publication date: February 15, 2018
    Inventors: Seiji Kimoto, Shigenobu Kida
  • Publication number: 20170137556
    Abstract: Disclosed are a phenolic hydroxyl group-containing resin which has excellent alkali developing properties and makes it possible to exhibit high heat resistance in a cured product obtained therefrom, a production method therefor, a photosensitive composition, a resist material, a coating film, a curable composition and a cured product thereof, and a resist underlayer film. A phenolic hydroxyl group-containing resin, including a compound (A) having a molecular structure represented by the following Structural Formula (1). (In the formula, R1 represents an alkyl group, an alkoxy group, or an aryl group, R2 represents a hydrogen atom, an alkyl group, or an aryl group, m is an integer of 1 to 3, and n is an integer of 2 to 15. In the case where m is 2 or more, plural R1's may be the same as or different from each other.
    Type: Application
    Filed: May 28, 2015
    Publication date: May 18, 2017
    Inventors: Tomoyuki Imada, Seiji Kimoto, Shigenobu Kida
  • Publication number: 20170029550
    Abstract: In order to provide a curing agent (alkoxylated resole-type phenolic resin) with which a coating film having high hot-water resistance, high workability, and high adhesion to metals may be formed without limiting the main agent to be a bisphenol-A-type epoxy resin, the present invention provides a method for producing an alkoxylated resole-type phenolic resin. The method includes reacting a phenol (a1) including meta-cresol with an aldehyde (a2) in the presence of a basic compound to prepare a resole-type phenolic resin (A); and reacting the resole-type phenolic resin (A) with an alcohol (B) in the presence of an acidic compound having an acid dissociation constant (pKa) of 0 or less.
    Type: Application
    Filed: March 19, 2015
    Publication date: February 2, 2017
    Applicant: DIC Corporation
    Inventors: Takakazu Kage, Shigenobu Kida