Patents by Inventor Shigenori Harada
Shigenori Harada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210143063Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.Type: ApplicationFiled: October 29, 2020Publication date: May 13, 2021Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
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Publication number: 20210143064Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.Type: ApplicationFiled: October 29, 2020Publication date: May 13, 2021Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
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Patent number: 11004744Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet in each region of the polyolefin sheet corresponding to each device chip, pushing up each device chip from the polyolefin sheet side to pick up each device chip from the polyolefin sheet.Type: GrantFiled: January 28, 2020Date of Patent: May 11, 2021Assignee: DISCO CORPORATIONInventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
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Patent number: 10998232Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyolefin sheet.Type: GrantFiled: February 24, 2020Date of Patent: May 4, 2021Assignee: DISCO CORPORATIONInventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
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Patent number: 10991587Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyester sheet.Type: GrantFiled: October 11, 2019Date of Patent: April 27, 2021Assignee: DISCO CORPORATIONInventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
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Patent number: 10991624Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyolefin sheet in each region of the polyolefin sheet corresponding to each device chip, pushing up each device chip from the polyolefin sheet side to pick up each device chip from the polyolefin sheet.Type: GrantFiled: January 15, 2020Date of Patent: April 27, 2021Assignee: DISCO CORPORATIONInventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
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Publication number: 20210118737Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.Type: ApplicationFiled: October 13, 2020Publication date: April 22, 2021Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
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Publication number: 20210118736Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.Type: ApplicationFiled: October 13, 2020Publication date: April 22, 2021Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
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Patent number: 10985067Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing out air to push up each device chip and picking up each device chip from the polyolefin sheet.Type: GrantFiled: March 27, 2020Date of Patent: April 20, 2021Assignee: DISCO CORPORATIONInventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
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Patent number: 10985066Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and then picking up each device chip from the polyolefin sheet.Type: GrantFiled: August 29, 2019Date of Patent: April 20, 2021Assignee: DISCO CORPORATIONInventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
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Publication number: 20210111074Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.Type: ApplicationFiled: October 6, 2020Publication date: April 15, 2021Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
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Publication number: 20210111073Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.Type: ApplicationFiled: October 6, 2020Publication date: April 15, 2021Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
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Publication number: 20210074589Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing air to each device chip from the polyester sheet side to push up each device chip through the polyester sheet and picking up each device chip from the polyester sheet.Type: ApplicationFiled: September 9, 2020Publication date: March 11, 2021Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
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Publication number: 20210074588Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing air to each device chip from the polyolefin sheet side to push up each device chip through the polyolefin sheet and picking up each device chip from the polyolefin sheet.Type: ApplicationFiled: September 8, 2020Publication date: March 11, 2021Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
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Publication number: 20210043514Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyester sheet.Type: ApplicationFiled: July 31, 2020Publication date: February 11, 2021Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
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Publication number: 20210043513Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyolefin sheet.Type: ApplicationFiled: July 31, 2020Publication date: February 11, 2021Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
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Patent number: 10910269Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of heating the polyester sheet, pushing up each device chip through the polyester sheet, and then picking up each device chip from the polyester sheet.Type: GrantFiled: June 26, 2019Date of Patent: February 2, 2021Assignee: DISCO CORPORATIONInventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
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Patent number: 10896850Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of heating the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and then picking up each device chip from the polyolefin sheet.Type: GrantFiled: June 26, 2019Date of Patent: January 19, 2021Assignee: DISCO CORPORATIONInventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
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Publication number: 20210013100Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyester sheet, then picking up each device chip from the polyester sheet.Type: ApplicationFiled: June 30, 2020Publication date: January 14, 2021Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE
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Publication number: 20210013101Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyolefin sheet, then picking up each device chip from the polyolefin sheet.Type: ApplicationFiled: June 30, 2020Publication date: January 14, 2021Inventors: Shigenori HARADA, Minoru MATSUZAWA, Hayato KIUCHI, Yoshiaki YODO, Taro ARAKAWA, Masamitsu AGARI, Emiko KAWAMURA, Yusuke FUJII, Toshiki MIYAI, Makiko OHMAE