Abstract: Provided is a semiconductor apparatus manufacturing method capable of severing a base material without producing burrs. A multiplicity of semiconductor apparatuses are produced as follows. A multi-segment base material is obtained by mounting a multiplicity of semiconductor chips on a substrate having a wiring pattern, followed by sealing the semiconductor chips with resin, further followed by attaching a terminal portion having a terminal hole to a back surface of the substrate. A filler is charged in each terminal hole, and, after curing the filler, the base material is severed along a cutting line covering the terminal hole, whereupon the multi-segment base material is divided into separate semiconductor apparatuses. The terminal hole is left exposed along the cut surface of the semiconductor apparatus. Chilled water is applied to the filler filled in the terminal hole to remove it from the terminal hole.

Abstract: Provided is a semiconductor apparatus manufacturing method capable of severing a base material without producing burrs. A multiplicity of semiconductor apparatuses are produced as follows. A multi-segment base material is obtained by mounting a multiplicity of semiconductor chips on a substrate having a wiring pattern, followed by sealing the semiconductor chips with resin, further followed by attaching a terminal portion having a terminal hole to a back surface of the substrate. A filler is charged in each terminal hole, and, after curing the filler, the base material is severed along a cutting line covering the terminal hole, whereupon the multi-segment base material is divided into separate semiconductor apparatuses. The terminal hole is left exposed along the cut surface of the semiconductor apparatus. Chilled water is applied to the filler filled in the terminal hole to remove it from the terminal hole.

Abstract: A light emitting element and a light receiving element are mounted on respective lead frames. The light emitting element and one lead frame, and the light receiving element and the other lead frame are covered with respective light transmissive primary moldings. A light shielding secondary molding is formed to unify the primary molding on the light emission side and the primary molding on the light reception side. The respective lead frames extend outward from the respective primary moldings and bent within and extend outward from the secondary molding. A bottom surface of the secondary molding is aligned with respective lower surfaces of the lead frames. A precision in positioning of a photointerrupter with respect to a substrate can be increased.

Abstract: An apparatus for detecting the passing state of a passing object to be detected by using a two-phase output signal has at least two light receiving elements (12a, 12b) and at least two light emitting elements (13a, 13b) which are disposed in such a manner that one light receiving element confronts one light emitting element and the other light receiving element confronts the other light emitting element, in order that even when the thickness of the object of detection is larger than the slit width thereof, light can pass through the maximum of the slit width to maximize quantities of light incident upon the light receiving elements (12a, 12b). In addition, light shielding pieces (22, 23) are provided at the front surfaces of a light receiving side transparent resin block (14) and a light emitting side transparent resin block (15) to prevent cross talk between not-confronting light receiving and emitting elements (12a, 13b) as well as between not-confronting light receiving and emitting elements (12b, 13a).